公开(公告)号：EP2490252A2

公开(公告)日：2012-08-22

申请号：EP12155888.6

申请日：2012-02-17

申请人： Fujitsu Limited

发明人： Yamakami, Takatoyo ,  Kubota, Takashi ,  Ishikawa, Kuniko ,  Kitajima, Masayuki

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/485 ,  H01L23/498 ,  B22F1/00 ,  B23K35/02 ,  B22F1/02 ,  B23K35/26 ,  B23K35/30 ,  C22C5/02 ,  C22C5/06 ,  C22C9/00 ,  C22C12/00

CPC分类号： H01L24/13 ,  B22F1/0014 ,  B22F1/025 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  C22C9/00 ,  C23C24/106 ,  H01L23/49811 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05686 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11502 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13599 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13709 ,  H01L2224/13711 ,  H01L2224/13713 ,  H01L2224/13809 ,  H01L2224/13811 ,  H01L2224/13813 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/13847 ,  H01L2224/13899 ,  H01L2224/13913 ,  H01L2224/13939 ,  H01L2224/13944 ,  H01L2224/13947 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16507 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81055 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81509 ,  H01L2224/81511 ,  H01L2224/81513 ,  H01L2224/81639 ,  H01L2224/81644 ,  H01L2224/81647 ,  H01L2224/81699 ,  H01L2224/81711 ,  H01L2224/81713 ,  H01L2224/81739 ,  H01L2224/81744 ,  H01L2224/8181 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15738 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/01007 ,  H01L2924/01008 ,  H01L2924/01018 ,  H01L2924/01083 ,  H01L2924/01031 ,  H01L2924/0103 ,  H01L2924/053 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： An electro-conductive bonding material (20,30) includes: high-melting-point metal particles with a component having a first melting point, middle-melting-point metal particles having a second melting point, lower than the first melting point, low-melting-point metal particles having a third melting point, lower than the second melting point and preferably a flux. The high-melting-point metal particles include Au, Ag, Cu, Au-plated Cu, Sn-Bi-plated Cu and Ag-plated Cu particles. The middle-melting-point metal particles include Sn-Bi and Sn-Bi-Ag particles. The low-melting-point metal particles include Sn-Bi-ln and Sn-Bi-Ga particles. The electro-conductive bonding material (20,30) is used for bonding a substrate (6) and an electronic component (8). A method for bonding comprises supplying the electro-conductive bonding material (e.g. by paste printing) to any one of an electrode (7) of a substrate (6) and a terminal of an electronic component (8) (e.g. an Au bump (9)), heating the supplied electro-conductive bonding material at a temperature lower than the melting point of the middle-melting-point metal particles to form a first metallic bonding state, arranging the electronic component (8) on the substrate (6) with the electro-conductive bonding material in the first metallic bonding state therebetween and heating the electro-conductive bonding material at a temperature of the melting point of the middle-melting-point metal particles or higher and not exceeding 150°C to convert the first metallic bonding state into a second metallic bonding state with a melting point of 250°C or higher and form a bond.

摘要翻译： 导电性接合材料（20,30）包括：高融点的金属颗粒与具有第一熔点的成分，具有第二熔点中间的低熔点金属微粒，比第一熔点低，低 -melting点具有第三熔点，比第二熔点，并且优选的助熔剂下金属颗粒。 高融点金属颗粒包括金，银，铜，镀Au的Cu，Sn-Bi系镀Cu和镀Ag的Cu粒子。 中等熔点金属颗粒包括Sn-Bi系和Sn-Bi系Ag粒子。 低融点的金属颗粒包括Sn-Bi系-In和Sn-邲夹颗粒。 导电接合材料（20,30）是用于粘合基片（6）和电子部件（8）。 一种用于接合方法包括导电接合材料（例如，通过膏印刷）供给到电极的基板中的任一个（7）的（6），并在金凸点的电子部件（8）（例如一个终端（9 ）），在比中间低熔点金属粒子的熔点低的温度下加热所述提供导电粘合材料，以形成第一金属接合状态，安排在电子部件（8）上的基板（6）与 在之间的第一金属接合状态有导电粘合材料，并在中间的低熔点金属颗粒或更高的熔点的温度下加热所述导电接合材料和不超过150℃至第一种金属转换 接合状态与250℃或更高的熔点的第二金属接合状态和形成键。