公开(公告)号：EP3123506A1

公开(公告)日：2017-02-01

申请号：EP14887374.8

申请日：2014-03-28

申请人： Intel Corporation

发明人： DIAS, Rajendra, C. ,  DUBEY, Manish ,  ARMAGAN, Emre

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L2224/0214 ,  H01L2224/0312 ,  H01L2224/0333 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/10175 ,  H01L2224/11003 ,  H01L2224/113 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/1601 ,  H01L2224/16013 ,  H01L2224/16014 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16111 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/742 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2924/15192 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/40102 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method for attaching an integrated circuit (IC) to an IC package substrate includes forming a solder bump on a bond pad of an IC die, forming a solder-wetting protrusion on a bond pad of an IC package substrate, and bonding the solder bump of the IC die to the solder-wetting protrusion of the IC package substrate.

摘要翻译： 一种将集成电路（IC）连接到IC封装基板的方法包括在IC芯片的焊盘上形成焊料凸块，在IC封装基板的焊盘上形成焊料润湿突起，并且将焊料凸块 的IC管芯到IC封装衬底的焊料润湿突起。

公开(公告)号：EP3123506A4

公开(公告)日：2017-12-20

申请号：EP14887374

申请日：2014-03-28

申请人： INTEL CORP

发明人： DIAS RAJENDRA C ,  DUBEY MANISH ,  ARMAGAN EMRE

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L2224/0214 ,  H01L2224/0312 ,  H01L2224/0333 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/10175 ,  H01L2224/11003 ,  H01L2224/113 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/1601 ,  H01L2224/16013 ,  H01L2224/16014 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16111 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/742 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2924/15192 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/40102 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method for attaching an integrated circuit (IC) to an IC package substrate includes forming a solder bump on a bond pad of an IC die, forming a solder-wetting protrusion on a bond pad of an IC package substrate, and bonding the solder bump of the IC die to the solder-wetting protrusion of the IC package substrate.

公开(公告)号：EP3234994A2

公开(公告)日：2017-10-25

申请号：EP16706696.8

申请日：2016-02-01

申请人： Invensas Corporation

发明人： KATKAR, Rajesh ,  UZOH, Cyprian, Emeka ,  SITARAM, Arkalgud, R.

IPC分类号： H01L23/485 ,  H01L21/60 ,  H01L25/065

CPC分类号： H01L24/81 ,  H01L21/768 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/10126 ,  H01L2224/1182 ,  H01L2224/13023 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/1379 ,  H01L2224/13809 ,  H01L2224/13811 ,  H01L2224/13847 ,  H01L2224/13855 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/81007 ,  H01L2224/81048 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/8181 ,  H01L2224/8182 ,  H01L2224/81862 ,  H01L2224/81895 ,  H01L2224/81903 ,  H01L2224/81905 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01327 ,  H01L2924/364 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/2064

摘要： An apparatus relates generally to a microelectronic device. In such an apparatus, a first substrate has a first surface with first interconnects located on the first surface, and a second substrate has a second surface spaced apart from the first surface with a gap between the first surface and the second surface. Second interconnects are located on the second surface. Lower surfaces of the first interconnects and upper surfaces of the second interconnects are coupled to one another for electrical conductivity between the first substrate and the second substrate. A conductive collar is around sidewalls of the first and second interconnects, and a dielectric layer is around the conductive collar.

摘要翻译： 装置一般涉及微电子器件。 在这样的装置中，第一基板具有第一表面，第一表面具有位于第一表面上的第一互连，并且第二基板具有第二表面，第二表面与第一表面隔开，第一表面与第二表面之间具有间隙。 第二个互连位于第二个表面上。 第一互连的下表面和第二互连的上表面为了第一基板和第二基板之间的导电性而彼此耦合。 导电套环围绕第一和第二互连的侧壁，介电层围绕导电套环。