公开(公告)号：EP3234994A2

公开(公告)日：2017-10-25

申请号：EP16706696.8

申请日：2016-02-01

申请人： Invensas Corporation

发明人： KATKAR, Rajesh ,  UZOH, Cyprian, Emeka ,  SITARAM, Arkalgud, R.

IPC分类号： H01L23/485 ,  H01L21/60 ,  H01L25/065

CPC分类号： H01L24/81 ,  H01L21/768 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/10126 ,  H01L2224/1182 ,  H01L2224/13023 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/1379 ,  H01L2224/13809 ,  H01L2224/13811 ,  H01L2224/13847 ,  H01L2224/13855 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/81007 ,  H01L2224/81048 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/8181 ,  H01L2224/8182 ,  H01L2224/81862 ,  H01L2224/81895 ,  H01L2224/81903 ,  H01L2224/81905 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01327 ,  H01L2924/364 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/2064

摘要： An apparatus relates generally to a microelectronic device. In such an apparatus, a first substrate has a first surface with first interconnects located on the first surface, and a second substrate has a second surface spaced apart from the first surface with a gap between the first surface and the second surface. Second interconnects are located on the second surface. Lower surfaces of the first interconnects and upper surfaces of the second interconnects are coupled to one another for electrical conductivity between the first substrate and the second substrate. A conductive collar is around sidewalls of the first and second interconnects, and a dielectric layer is around the conductive collar.

摘要翻译： 装置一般涉及微电子器件。 在这样的装置中，第一基板具有第一表面，第一表面具有位于第一表面上的第一互连，并且第二基板具有第二表面，第二表面与第一表面隔开，第一表面与第二表面之间具有间隙。 第二个互连位于第二个表面上。 第一互连的下表面和第二互连的上表面为了第一基板和第二基板之间的导电性而彼此耦合。 导电套环围绕第一和第二互连的侧壁，介电层围绕导电套环。

公开(公告)号：EP2896069A1

公开(公告)日：2015-07-22

申请号：EP13765605.4

申请日：2013-09-12

申请人： Invensas Corporation

发明人： WOYCHIK, Charles, G. ,  UZOH, Cyprian, Emeka ,  SATO, Hiroaki

IPC分类号： H01L23/498

CPC分类号： H01L23/562 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/03 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/167 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.

摘要翻译： 复合内插器可以包括衬底元件和支撑元件。 衬底元件可以具有限定200微米或更小的厚度的第一和第二相对表面，并且可以具有在第一表面处暴露的多个触点和延伸穿过该厚度的导电结构。 支撑元件可以具有暴露在支撑元件的第二表面处的电介质或半导体材料中的至少一个的主体，延伸穿过主体的厚度的开口，在至少一些开口内沿着 主体的厚度以及在支撑元件的第一表面处露出的端子。 支撑元件的第二表面可以与衬底元件的第二表面结合。 端子可以通过导电通孔和导电结构与触点电连接。

公开(公告)号：EP3234994B1

公开(公告)日：2019-07-24

申请号：EP16706696.8

申请日：2016-02-01

申请人： Invensas Corporation

发明人： KATKAR, Rajesh ,  UZOH, Cyprian, Emeka ,  SITARAM, Arkalgud, R.

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/56

公开(公告)号：EP3533083A1

公开(公告)日：2019-09-04

申请号：EP17864837.4

申请日：2017-10-25

申请人： Invensas Corporation

发明人： UZOH, Cyprian, Emeka

IPC分类号： H01L23/00

公开(公告)号：EP2880683A1

公开(公告)日：2015-06-10

申请号：EP13826185.4

申请日：2013-08-02

申请人： Invensas Corporation

发明人： CASKEY, Terrence ,  MOHAMMED, Ilyas ,  UZOH, Cyprian, Emeka ,  WOYCHIK, Charles ,  NEWMAN, Michael ,  MONADGEMI, Pezhman ,  CO, Reynaldo ,  CHAU, Ellis ,  HABA, Belgacem

IPC分类号： H01L23/48 ,  H01L23/12

CPC分类号： H01L25/105 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/381 ,  H05K1/0298 ,  H05K3/46 ,  Y10T29/49126 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

摘要翻译： 一种制造内插器的方法包括形成结合到第一元件的一个或多个第一表面的多个引线键合。 电介质封装形成为接触将相邻的引线键彼此分开的引线键合的边缘表面。 进一步的处理包括去除第一元件的至少部分，其中插入件具有通过至少封装彼此分开的第一和第二相对侧，并且插入件分别在第一和第二相对侧具有第一触点和第二触点， 用于分别与第一和第二组件电连接，第一触点通过线键合与第二触点电连接。

公开(公告)号：EP2920810A2

公开(公告)日：2015-09-23

申请号：EP13811692.6

申请日：2013-12-02

申请人： Invensas Corporation

发明人： UZOH, Cyprian, Emeka

IPC分类号： H01L23/485 ,  H01L23/498 ,  H01L21/60 ,  H05K3/34 ,  H01L23/10 ,  H01L21/50

CPC分类号： H05K13/046 ,  H01L21/4853 ,  H01L21/50 ,  H01L21/76898 ,  H01L23/10 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/02372 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05138 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/13009 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13138 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/14131 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/16501 ,  H01L2224/16505 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/27462 ,  H01L2224/27464 ,  H01L2224/29011 ,  H01L2224/29023 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29138 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/32505 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81075 ,  H01L2224/8112 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/83075 ,  H01L2224/8312 ,  H01L2224/83193 ,  H01L2224/83825 ,  H01L2924/00014 ,  H01L2924/381 ,  H01L2924/04953 ,  H01L2924/01071 ,  H01L2924/01042 ,  H01L2924/01015 ,  H01L2924/04941 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01031 ,  H01L2924/01034 ,  H01L2924/00012 ,  H01L2924/07025 ,  H01L2224/05552

摘要： A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.