公开(公告)号：EP2838114A3

公开(公告)日：2015-04-08

申请号：EP14180536.6

申请日：2014-08-11

申请人： Xintec Inc.

发明人： HUANG, Yu-Lung ,  LIN, Chao-Yen ,  SUEN, Wei-Luen ,  CHEN, Chien-Hui

IPC分类号： H01L23/31 ,  H01L23/00

CPC分类号： H01L23/3114 ,  H01L23/3171 ,  H01L23/525 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/06164 ,  H01L2224/16013 ,  H01L2224/16105 ,  H01L2224/24226 ,  H01L2224/48227 ,  H01L2224/811 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/13091 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/03

摘要： An embodiment of the invention provides a chip package including a semiconductor substrate (100) having a first surface (100a) and a second surface (100b) opposite thereto. A dielectric layer (130) is overlying the first surface of the semiconductor substrate and comprises an opening exposing a conducting pad (150). A side recess (200) is on at least a first side of the semiconductor substrate, wherein the side recess extends from the first surface (100a) towards the second surface (100b). An upper recess is on at least a first side of the dielectric layer outside the conducting pad. A conducting layer is electrically connected to the conducting pad (150) and extends to the upper recess and the side recess.

公开(公告)号：EP3389089A1

公开(公告)日：2018-10-17

申请号：EP18165717.2

申请日：2018-04-04

申请人： Renesas Electronics Corporation

发明人： SAKATA, Kenji ,  AKIBA, Toshihiko ,  FUNAYA, Takuo ,  TSUCHIYA, Hideaki ,  YOSHIDA, Yuichi

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L24/13 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3192 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/02206 ,  H01L2224/02215 ,  H01L2224/0345 ,  H01L2224/0362 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05014 ,  H01L2224/05022 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05555 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14131 ,  H01L2224/14133 ,  H01L2224/1601 ,  H01L2224/16013 ,  H01L2224/16058 ,  H01L2224/16112 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/1713 ,  H01L2224/73204 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3512 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/01051 ,  H01L2924/206 ,  H01L2924/207 ,  H01L2924/04941 ,  H01L2224/1146 ,  H01L2224/47

摘要： There is a need to improve reliability of the semiconductor device.
A semiconductor device includes a printed circuit board and a semiconductor chip mounted over the printed circuit board. The semiconductor chip includes a pad, an insulation film including an opening to expose part of the pad, and a pillar electrode formed over the pad exposed from the opening. The printed circuit board includes a terminal and a resist layer including an opening to expose part of the terminal. The pillar electrode of the semiconductor chip and the terminal of the printed circuit board are coupled via a solder layer. Thickness h 1 of the pillar electrode is measured from the upper surface of the insulation film. Thickness h 2 of the solder layer is measured from the upper surface of the resist layer. Thickness h 1 is greater than or equal to a half of thickness h 2 and is smaller than or equal to thickness h 2 .

公开(公告)号：EP3123506A1

公开(公告)日：2017-02-01

申请号：EP14887374.8

申请日：2014-03-28

申请人： Intel Corporation

发明人： DIAS, Rajendra, C. ,  DUBEY, Manish ,  ARMAGAN, Emre

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L2224/0214 ,  H01L2224/0312 ,  H01L2224/0333 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/10175 ,  H01L2224/11003 ,  H01L2224/113 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/1601 ,  H01L2224/16013 ,  H01L2224/16014 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16111 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/742 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2924/15192 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/40102 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method for attaching an integrated circuit (IC) to an IC package substrate includes forming a solder bump on a bond pad of an IC die, forming a solder-wetting protrusion on a bond pad of an IC package substrate, and bonding the solder bump of the IC die to the solder-wetting protrusion of the IC package substrate.

摘要翻译： 一种将集成电路（IC）连接到IC封装基板的方法包括在IC芯片的焊盘上形成焊料凸块，在IC封装基板的焊盘上形成焊料润湿突起，并且将焊料凸块 的IC管芯到IC封装衬底的焊料润湿突起。

公开(公告)号：EP2838114A2

公开(公告)日：2015-02-18

申请号：EP14180536.6

申请日：2014-08-11

申请人： Xintec Inc.

发明人： HUANG, Yu-Lung ,  LIN, Chao-Yen ,  SUEN, Wei-Luen ,  CHEN, Chien-Hui

IPC分类号： H01L23/31

CPC分类号： H01L23/3114 ,  H01L23/3171 ,  H01L23/525 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/06164 ,  H01L2224/16013 ,  H01L2224/16105 ,  H01L2224/24226 ,  H01L2224/48227 ,  H01L2224/811 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/13091 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/03

摘要： An embodiment of the invention provides a chip package including a semiconductor substrate (100) having a first surface (100a) and a second surface (100b) opposite thereto. A dielectric layer (130) is overlying the first surface of the semiconductor substrate and comprises an opening exposing a conducting pad (150). A side recess (200) is on at least a first side of the semiconductor substrate, wherein the side recess extends from the first surface (100a) towards the second surface (100b). An upper recess is on at least a first side of the dielectric layer outside the conducting pad. A conducting layer is electrically connected to the conducting pad (150) and extends to the upper recess and the side recess.

摘要翻译： 本发明的实施例提供一种芯片封装，其包括具有第一表面（100a）和与其相对的第二表面（100b）的半导体衬底（100）。 电介质层（130）覆盖在半导体衬底的第一表面上，并且包括暴露导电焊盘（150）的开口。 侧凹部（200）位于半导体衬底的至少第一侧上，其中侧凹部从第一表面（100a）朝向第二表面（100b）延伸。 上部凹部位于导电垫外侧的介电层的至少第一侧。 导电层电连接到导电垫（150）并延伸到上凹部和侧凹槽。

公开(公告)号：EP2036125A2

公开(公告)日：2009-03-18

申请号：EP07789762.7

申请日：2007-06-20

申请人： Koninklijke Philips Electronics N.V.

发明人： SUDOL, Wojtek ,  WILSON, Martha

IPC分类号： H01L23/485

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/16013 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16148 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00014 ,  H01L2224/83851

摘要： A flip-chip electrical coupling between first and second electrical components (250, 260). The coupling includes a bump (210) and a pad (220). The bump (210) is electrically coupled to the first electrical component (250). The pad (220) is electrically coupled to the second electrical component (260). The pad (220) is electrically coupled to and dimensioned smaller than a corresponding coupling surface (214) of the bump (210). The pad (220) and bump (210) may be electrically coupled together using an ultrasonic stub bump bonding process, conductive epoxy, etc.

摘要翻译： 第一和第二电气部件（250,260）之间的倒装芯片电耦合。 联接器包括凸块（210）和垫（220）。 凸块（210）电耦合到第一电气部件（250）。 焊盘（220）电耦合到第二电气部件（260）。 焊盘（220）电耦合到尺寸小于凸块（210）的对应的耦合表面（214）。 焊盘（220）和凸块（210）可以使用超声焊条凸点焊接工艺，导电环氧树脂等电耦合在一起

公开(公告)号：EP3123506A4

公开(公告)日：2017-12-20

申请号：EP14887374

申请日：2014-03-28

申请人： INTEL CORP

发明人： DIAS RAJENDRA C ,  DUBEY MANISH ,  ARMAGAN EMRE

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L2224/0214 ,  H01L2224/0312 ,  H01L2224/0333 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/10175 ,  H01L2224/11003 ,  H01L2224/113 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/1601 ,  H01L2224/16013 ,  H01L2224/16014 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16111 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/742 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2924/15192 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/40102 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method for attaching an integrated circuit (IC) to an IC package substrate includes forming a solder bump on a bond pad of an IC die, forming a solder-wetting protrusion on a bond pad of an IC package substrate, and bonding the solder bump of the IC die to the solder-wetting protrusion of the IC package substrate.

公开(公告)号：EP3154084A3

公开(公告)日：2017-04-26

申请号：EP16187582.8

申请日：2016-09-07

申请人： MediaTek Inc.

发明人： CHOU, Che-Ya ,  HSU, Wen-Sung ,  CHEN, Nan-Cheng

IPC分类号： H01L23/498 ,  H01L23/485 ,  H05K1/11

CPC分类号： H01L23/49811 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/3192 ,  H01L23/3675 ,  H01L23/498 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0361 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/1132 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16013 ,  H01L2224/16058 ,  H01L2224/16112 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/00

摘要： A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The semiconductor device includes a carrier substrate including a conductive trace. A portion of the conductive trace is elongated. The semiconductor device also includes a second conductive structure above the carrier substrate. A portion of the second conductive structure is in contact with the portion of the conductive trace. The semiconductor device further includes a semiconductor body mounted above the conductive trace. The semiconductor body is connected to the second conductive structure.

摘要翻译： 提供半导体封装。 该半导体封装包括通过第一导电结构接合到基底的半导体器件。 该半导体器件包括具有导电迹线的载体基板。 导电迹线的一部分是细长的。 该半导体器件还包括在载体衬底上方的第二导电结构。 第二导电结构的一部分与导电迹线的该部分接触。 该半导体器件还包括安装在导电迹线上方的半导体本体。 半导体本体连接到第二导电结构。

公开(公告)号：EP3154084A2

公开(公告)日：2017-04-12

申请号：EP16187582.8

申请日：2016-09-07

申请人： MediaTek Inc.

发明人： CHOU, Che-Ya ,  HSU, Wen-Sung ,  CHEN, Nan-Cheng

IPC分类号： H01L23/498 ,  H01L23/485 ,  H05K1/11

CPC分类号： H01L23/49811 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/3192 ,  H01L23/3675 ,  H01L23/498 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0361 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/1132 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16013 ,  H01L2224/16058 ,  H01L2224/16112 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/00

摘要： A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The semiconductor device includes a carrier substrate including a conductive trace. A portion of the conductive trace is elongated. The semiconductor device also includes a second conductive structure above the carrier substrate. A portion of the second conductive structure is in contact with the portion of the conductive trace. The semiconductor device further includes a semiconductor body mounted above the conductive trace. The semiconductor body is connected to the second conductive structure.

摘要翻译： 提供半导体封装。 半导体封装包括通过第一导电结构结合到基底的半导体器件。 该半导体器件包括包括导电迹线的载体衬底。 导电迹线的一部分是细长的。 半导体器件还包括在载体衬底上方的第二导电结构。 第二导电结构的一部分与导电迹线的该部分接触。 半导体器件还包括安装在导电迹线上方的半导体本体。 半导体本体连接到第二导电结构。

公开(公告)号：EP1482547A3

公开(公告)日：2009-08-19

申请号：EP04012627.8

申请日：2004-05-27

申请人： Xerox Corporation

发明人： Andrews, John, R. ,  Gerner, Bradley, J. ,  Schmachtenberg, III, Richard ,  Slenes, Chad ,  Schultz, Samuel, V.

IPC分类号： H01L21/68 ,  H01L21/60

CPC分类号： H05K3/1225 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11005 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13309 ,  H01L2224/16013 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/27438 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3484 ,  H05K3/361 ,  H05K2201/2036 ,  H05K2203/0537 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T428/24843 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/07025

摘要： A multi-layer standoff/mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings. The structure is employed for forming interconnecting structures on electronic circuit structures.

公开(公告)号：EP1482547A2

公开(公告)日：2004-12-01

申请号：EP04012627.8

申请日：2004-05-27

申请人： Xerox Corporation

发明人： Andrews, John, R. ,  Gerner, Bradley, J. ,  Schmachtenberg, III, Richard ,  Slenes, Chad ,  Schultz, Samuel, V.

IPC分类号： H01L21/68 ,  H01L21/60

CPC分类号： H05K3/1225 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11005 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13309 ,  H01L2224/16013 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/27438 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3484 ,  H05K3/361 ,  H05K2201/2036 ,  H05K2203/0537 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T428/24843 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/07025

摘要： A multi-layer standoff/mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings. The structure is employed for forming interconnecting structures on electronic circuit structures.

摘要翻译： 该结构具有附着到衬垫层的粘合隔离层。 间隔孔（63）形成在衬垫层和粘合剂隔离层中。 掩模粘合剂层附着到衬垫层。 掩模衬垫层（75）附接到掩模粘合剂层。 在掩模粘合剂层和掩模衬里层中与隔离孔对准形成掩模孔。 还包括以下独立权利要求：（a）制造间隔/掩模结构的方法（b）制造互连的电路结构的方法。