公开(公告)号：EP2973683A2

公开(公告)日：2016-01-20

申请号：EP14719954.1

申请日：2014-03-13

申请人： Nthdegree Technologies Worldwide Inc.

发明人： RAY, William Johnstone ,  BLANCHARD, Richard Austin ,  LOWENTHAL, Mark David ,  ORAW, Bradley Steven

IPC分类号： H01L21/98

CPC分类号： H01L24/95 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/0753 ,  H01L25/18 ,  H01L25/50 ,  H01L33/20 ,  H01L2221/68381 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/25105 ,  H01L2224/25174 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82101 ,  H01L2224/82104 ,  H01L2224/82143 ,  H01L2224/92244 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95102 ,  H01L2224/95115 ,  H01L2224/95143 ,  H01L2224/95146 ,  H01L2924/10253 ,  H01L2924/12 ,  H01L2924/1203 ,  H01L2924/12041 ,  H01L2924/13 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H05K1/029 ,  H05K1/0296 ,  H05K3/12

摘要： A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.

摘要翻译： 可编程电路包括微晶晶体管或二极管的印刷组阵列。 这些装置被预先形成并印刷成油墨并固化。 每个组中的设备并联连接，以使每个组充当单个设备。 在一个实施例中，每个组中包含约10个设备，因此冗余使得每个组非常可靠。 每个组具有终止于衬底上的贴片区域中的至少一个电引线。 互连导体图案互连贴片区域中的组的至少一些引线以创建用于通用电路的定制应用的逻辑电路。 这些组也可以互连成逻辑门，并且栅极引线终止于贴片区域。 然后，互连导体图案将形成复合逻辑电路的栅极互连。

公开(公告)号：EP2973683B1

公开(公告)日：2018-10-24

申请号：EP14719954.1

申请日：2014-03-13

申请人： Nthdegree Technologies Worldwide Inc.

发明人： RAY, William Johnstone ,  BLANCHARD, Richard Austin ,  LOWENTHAL, Mark David ,  ORAW, Bradley Steven

IPC分类号： H01L21/98 ,  H01L25/065 ,  H01L25/075 ,  H01L33/20 ,  H01L21/60 ,  H05K1/02 ,  H05K3/12

CPC分类号： H01L24/95 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/0753 ,  H01L25/18 ,  H01L25/50 ,  H01L33/20 ,  H01L2221/68381 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/25105 ,  H01L2224/25174 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82101 ,  H01L2224/82104 ,  H01L2224/82143 ,  H01L2224/92244 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95102 ,  H01L2224/95115 ,  H01L2224/95143 ,  H01L2224/95146 ,  H01L2924/10253 ,  H01L2924/12 ,  H01L2924/1203 ,  H01L2924/12041 ,  H01L2924/13 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H05K1/029 ,  H05K1/0296 ,  H05K3/12

摘要： A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.

公开(公告)号：EP2973684B1

公开(公告)日：2018-05-16

申请号：EP14722021.4

申请日：2014-03-13

申请人： Nthdegree Technologies Worldwide Inc.

发明人： BLANCHARD, Richard Austin

IPC分类号： H01L21/98 ,  H01L33/20 ,  H01L25/075

CPC分类号： H01L21/84 ,  H01L21/6835 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/12 ,  H01L33/20 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/25105 ,  H01L2224/25174 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82104 ,  H01L2224/92244 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95115 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

摘要： A layer of microscopic, 3-terminal transistors is printed over a first conductor layer so that bottom electrodes of the transistors electrically contact the first conductor layer. A first dielectric layer overlies the first conductor layer, and a second conductor layer over the first dielectric layer contacts intermediate electrodes on the transistors between the bottom electrodes and top electrodes. A second dielectric layer overlies the second conductor layer, and a third conductor layer over the second dielectric layer contacts the top electrodes. The devices are thus electrically connected in parallel by a combination of the first conductor layer, the second conductor layer, and the third conductor layer. Separate groups of the devices may be interconnected to form more complex circuits. The resulting circuit may be a very thin flex-circuit.

公开(公告)号：EP2973684A1

公开(公告)日：2016-01-20

申请号：EP14722021.4

申请日：2014-03-13

申请人： Nthdegree Technologies Worldwide Inc.

发明人： BLANCHARD, Richard Austin

IPC分类号： H01L21/98 ,  H01L33/20 ,  H01L25/075

CPC分类号： H01L21/84 ,  H01L21/6835 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/12 ,  H01L33/20 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/25105 ,  H01L2224/25174 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82104 ,  H01L2224/92244 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95115 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

摘要： A layer of microscopic, 3-terminal transistors is printed over a first conductor layer so that bottom electrodes of the transistors electrically contact the first conductor layer. A first dielectric layer overlies the first conductor layer, and a second conductor layer over the first dielectric layer contacts intermediate electrodes on the transistors between the bottom electrodes and top electrodes. A second dielectric layer overlies the second conductor layer, and a third conductor layer over the second dielectric layer contacts the top electrodes. The devices are thus electrically connected in parallel by a combination of the first conductor layer, the second conductor layer, and the third conductor layer. Separate groups of the devices may be interconnected to form more complex circuits. The resulting circuit may be a very thin flex-circuit.

摘要翻译： 在第一导体层上印刷一层微观的3端子晶体管，使得晶体管的底部电极与第一导体层电接触。 第一介电层覆盖在第一导体层上，第一介电层上的第二导体层接触底电极和顶电极之间的晶体管上的中间电极。 第二电介质层覆盖在第二导体层上，第二电介质层上的第三导体层接触顶电极。 因此，这些器件通过第一导体层，第二导体层和第三导体层的组合而并联连接。 单独的设备组可以互连以形成更复杂的电路。 所得到的电路可以是非常薄的柔性电路。