公开(公告)号：EP3271953A1

公开(公告)日：2018-01-24

申请号：EP15892223.7

申请日：2015-05-21

Applicant: Goertek Inc.

Inventor： ZOU, Quanbo ,  WANG, Zhe

IPC: H01L33/48 ,  H01L33/00

CPC classification number: H01L24/97 ,  H01L24/00 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/62 ,  H01L2224/81005 ,  H01L2224/81143 ,  H01L2224/81815 ,  H01L2224/83005 ,  H01L2224/83143 ,  H01L2224/83851 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED, comprises: forming micro-LEDs (202) on a laser-transparent original substrate (201), providing an anisotropic conductive layer (203) on a receiving substrate (204), bringing the micro-LEDs (202) into contact with the anisotropic conductive layer (203) on the receiving substrate (204), irradiating the original substrate (201) with laser from the original substrate side to lift-off the micro-LEDs (202) from the original substrate (201), and processing the anisotropic conductive layer (203), to electrically connect the micro-LEDs (202) with the pads (205′) on the receiving substrate (204).

公开(公告)号：EP2839522A4

公开(公告)日：2015-12-09

申请号：EP13778001

申请日：2013-04-19

Applicant: RENSSELAER POLYTECH INST

Inventor： KARLICEK ROBERT F ,  LU JAMES JIAN-QIANG ,  GOODWIN CHARLES SANFORD ,  TKACHENKO ANTON

IPC: H01L33/62 ,  B07C5/36 ,  H01L21/60

CPC classification number: H01L25/50 ,  H01L21/6836 ,  H01L24/05 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/76 ,  H01L24/82 ,  H01L24/83 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0753 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/04026 ,  H01L2224/05655 ,  H01L2224/13101 ,  H01L2224/24225 ,  H01L2224/245 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/75252 ,  H01L2224/75283 ,  H01L2224/75655 ,  H01L2224/75701 ,  H01L2224/75733 ,  H01L2224/75801 ,  H01L2224/76655 ,  H01L2224/76701 ,  H01L2224/76733 ,  H01L2224/76801 ,  H01L2224/82002 ,  H01L2224/82102 ,  H01L2224/82143 ,  H01L2224/83002 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/8323 ,  H01L2224/83801 ,  H01L2224/9202 ,  H01L2224/95101 ,  H01L2224/95144 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/3511 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00 ,  H01L2224/83205 ,  H01L2924/00014

公开(公告)号：EP1859483B1

公开(公告)日：2010-12-08

申请号：EP06736270.7

申请日：2006-02-28

Applicant: Sensormatic Electronics Corporation

Inventor： CLARK, John, J. ,  LIAN, Ming-Ren ,  SHAFER, Gary, Mark ,  REYNOLDS, Jr., George, Anthony

IPC: H01L23/32 ,  H01L21/60 ,  G06K19/077

CPC classification number: G06K19/07749 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/95144 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/00014

Abstract: An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.

公开(公告)号：EP1859483A1

公开(公告)日：2007-11-28

申请号：EP06736270.7

申请日：2006-02-28

Applicant: Sensormatic Electronics Corporation

Inventor： CLARK, John, J. ,  LIAN, Ming-Ren ,  SHAFER, Gary, Mark ,  REYNOLDS, Jr., George, Anthony

IPC: H01L23/32

CPC classification number: G06K19/07749 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/95144 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/00014

Abstract: An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.

公开(公告)号：EP3323145A1

公开(公告)日：2018-05-23

申请号：EP15897981.5

申请日：2015-07-14

Applicant: Goertek Inc.

Inventor： ZOU, Quanbo ,  WANG, Zhe

IPC: H01L21/70 ,  H01L33/00

CPC classification number: H01L24/97 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/81005 ,  H01L2224/81143 ,  H01L2224/81815 ,  H01L2224/83005 ,  H01L2224/83143 ,  H01L2224/83851 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/12041 ,  H01L2933/0066

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate; irradiating the original substrate with laser from the original substrate side to lift-off the micro-LEDs from the original substrate; bring the micro-LEDs into contact with pads preset on a receiving substrate through a contactless action.

公开(公告)号：EP2973684B1

公开(公告)日：2018-05-16

申请号：EP14722021.4

申请日：2014-03-13

Applicant: Nthdegree Technologies Worldwide Inc.

Inventor： BLANCHARD, Richard Austin

IPC: H01L21/98 ,  H01L33/20 ,  H01L25/075

CPC classification number: H01L21/84 ,  H01L21/6835 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/12 ,  H01L33/20 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/25105 ,  H01L2224/25174 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82104 ,  H01L2224/92244 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95115 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A layer of microscopic, 3-terminal transistors is printed over a first conductor layer so that bottom electrodes of the transistors electrically contact the first conductor layer. A first dielectric layer overlies the first conductor layer, and a second conductor layer over the first dielectric layer contacts intermediate electrodes on the transistors between the bottom electrodes and top electrodes. A second dielectric layer overlies the second conductor layer, and a third conductor layer over the second dielectric layer contacts the top electrodes. The devices are thus electrically connected in parallel by a combination of the first conductor layer, the second conductor layer, and the third conductor layer. Separate groups of the devices may be interconnected to form more complex circuits. The resulting circuit may be a very thin flex-circuit.

公开(公告)号：EP2973684A1

公开(公告)日：2016-01-20

申请号：EP14722021.4

申请日：2014-03-13

Applicant: Nthdegree Technologies Worldwide Inc.

Inventor： BLANCHARD, Richard Austin

IPC: H01L21/98 ,  H01L33/20 ,  H01L25/075

CPC classification number: H01L21/84 ,  H01L21/6835 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/12 ,  H01L33/20 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/25105 ,  H01L2224/25174 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82104 ,  H01L2224/92244 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95115 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A layer of microscopic, 3-terminal transistors is printed over a first conductor layer so that bottom electrodes of the transistors electrically contact the first conductor layer. A first dielectric layer overlies the first conductor layer, and a second conductor layer over the first dielectric layer contacts intermediate electrodes on the transistors between the bottom electrodes and top electrodes. A second dielectric layer overlies the second conductor layer, and a third conductor layer over the second dielectric layer contacts the top electrodes. The devices are thus electrically connected in parallel by a combination of the first conductor layer, the second conductor layer, and the third conductor layer. Separate groups of the devices may be interconnected to form more complex circuits. The resulting circuit may be a very thin flex-circuit.

Abstract translation: 在第一导体层上印刷一层微观的3端子晶体管，使得晶体管的底部电极与第一导体层电接触。 第一介电层覆盖在第一导体层上，第一介电层上的第二导体层接触底电极和顶电极之间的晶体管上的中间电极。 第二电介质层覆盖在第二导体层上，第二电介质层上的第三导体层接触顶电极。 因此，这些器件通过第一导体层，第二导体层和第三导体层的组合而并联连接。 单独的设备组可以互连以形成更复杂的电路。 所得到的电路可以是非常薄的柔性电路。

公开(公告)号：EP1829104B1

公开(公告)日：2008-06-18

申请号：EP05854952.8

申请日：2005-12-20

Applicant: Eastman Kodak Company

Inventor： SHARMA, Ravi ,  LUSIGNAN, Charles P.

IPC: H01L21/98

CPC classification number: H01L24/95 ,  H01L24/86 ,  H01L25/50 ,  H01L2224/83192 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T436/25 ,  H01L2924/15153 ,  H01L2924/00

Abstract: Methods and apparatuses are provided for assembling micro-components on a support having a pattern of binding sites. In accordance with one method, a first fluid is provided on the surface of the support with the first fluid being of a type that increases viscosity when cooled, the first fluid having first micro-components suspended therein each adapted to engage the binding sites. First fluid proximate to selected binding sites is cooled to increase the viscosity of the responsive fluid proximate to the selected binding sites so that the first micro-components suspended in the first fluid are inhibited from engaging the selected binding sites.

公开(公告)号：EP1805797A4

公开(公告)日：2008-06-04

申请号：EP05791648

申请日：2005-08-23

Applicant: GELCORE LLC

Inventor： PETROSKI JAMES

IPC: H01L23/34 ,  F21K99/00 ,  H01L33/00

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V19/001 ,  F21V19/045 ,  F21V21/096 ,  F21V29/004 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10 ,  H01L2224/95144 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: A light engine ( 16 ) includes at least one LED ( 12 ) for generating light of one of a plurality of wavelengths. The LED ( 12 ) is disposed on the magnetic core printed circuit board ( 14 ). A heatsink ( 26 ) is disposed in thermal communication with a base ( 24 ) and the LED ( 12 ) for conducting thermal energy away from the LED ( 12 ). The light engine ( 16 ) is magnetically attached to the heatsink ( 26 ) via a magnet ( 50 ) which is attached to the heatsink ( 26 ) to create that a magnetic force between the magnetic core board ( 14 ) and the heatsink ( 26 ).

Abstract translation: 光引擎（16）包括用于产生多个波长中的一个的光的至少一个LED（12）。 LED（12）设置在磁芯印刷电路板（14）上。 散热器（26）被布置成与基座（24）和用于将热能远离LED（12）的LED（12）热连通。 光引擎（16）通过附着在散热片（26）上的磁体（50）磁性地连接到散热器（26），以产生磁芯板（14）和散热片（26）之间的磁力， 。

公开(公告)号：EP3271953A4

公开(公告)日：2018-02-21

申请号：EP15892223

申请日：2015-05-21

Applicant: GOERTEK INC

Inventor： ZOU QUANBO ,  WANG ZHE

IPC: H01L33/48 ,  H01L33/00

CPC classification number: H01L24/97 ,  H01L24/00 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/62 ,  H01L2224/81005 ,  H01L2224/81143 ,  H01L2224/81815 ,  H01L2224/83005 ,  H01L2224/83143 ,  H01L2224/83851 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED, comprises: forming micro-LEDs (202) on a laser-transparent original substrate (201), providing an anisotropic conductive layer (203) on a receiving substrate (204), bringing the micro-LEDs (202) into contact with the anisotropic conductive layer (203) on the receiving substrate (204), irradiating the original substrate (201) with laser from the original substrate side to lift-off the micro-LEDs (202) from the original substrate (201), and processing the anisotropic conductive layer (203), to electrically connect the micro-LEDs (202) with the pads (205′) on the receiving substrate (204).