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1.发明公开
公开(公告)号：EP3240025A2
公开(公告)日：2017-11-01
申请号：EP17165324.9
申请日：2017-04-06
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/32 , H01L24/03 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/03505 , H01L2224/2731 , H01L2224/27312 , H01L2224/2732 , H01L2224/2741 , H01L2224/27505 , H01L2224/29005 , H01L2224/29017 , H01L2224/2908 , H01L2224/29082 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29164 , H01L2224/29294 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/2938 , H01L2224/29384 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/2949 , H01L2224/3201 , H01L2224/32053 , H01L2224/32054 , H01L2224/32055 , H01L2224/32058 , H01L2224/32225 , H01L2224/32227 , H01L2224/32245 , H01L2224/32501 , H01L2224/83055 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/8384 , H01L2924/00014 , H01L2924/01006 , H01L2924/07802 , H01L2924/0781 , H01L2924/00012
摘要： A die and substrate assembly (10) is disclosed for a die (12) with electronic circuitry and a substrate (14). A sintered bonding layer (16, 16A) of sintered metal (e.g. silver) is disposed between the die (12) and the substrate (14). The sintered bonding layer (16, 16A) includes a plurality of zones (18, 18', 18", 20, 20', 20") having different sintered metal densities. The plurality of zones (18, 18', 18", 20, 20', 20") are distributed along one or more horizontal axes of the sintered bonding layer (16), along one or more vertical axes of the sintered bonding layer (16) or along both one or more horizontal and one or more vertical axes of the sintered bonding layer (16A).
摘要翻译： 公开了一种具有电子电路和衬底（14）的管芯（12）的管芯和衬底组件（10）。 烧结金属（例如银）的烧结结合层（16,16A）设置在管芯（12）和衬底（14）之间。 烧结结合层（16,16A）包括具有不同烧结金属密度的多个区域（18,18'，18“，20,20'，20”）。 多个区域（18,18'，18“，20,20'，20”）沿烧结层（16）的一个或多个水平轴线沿着烧结层（16）的一个或多个垂直轴线分布 或者沿着烧结层（16A）的一个或多个水平轴线和一个或多个垂直轴线。
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2.发明授权
公开(公告)号：EP2499085B1
公开(公告)日：2013-08-28
申请号：EP10757200.0
申请日：2010-09-23
申请人： Robert Bosch GmbH
IPC分类号： B81C1/00
CPC分类号： B81C1/00269 , B81C2201/019 , B81C2203/0118 , B81C2203/019 , B81C2203/036 , H01L23/10 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/83 , H01L25/50 , H01L2224/26145 , H01L2224/29011 , H01L2224/29013 , H01L2224/29076 , H01L2224/291 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29117 , H01L2224/29124 , H01L2224/29144 , H01L2224/30051 , H01L2224/30131 , H01L2224/30135 , H01L2224/30177 , H01L2224/30505 , H01L2224/30515 , H01L2224/32054 , H01L2224/32145 , H01L2224/32501 , H01L2224/83007 , H01L2224/83095 , H01L2224/83191 , H01L2224/83365 , H01L2224/83815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1461 , H01L2924/1631 , H01L2924/165 , H01L2924/00 , H01L2924/01014 , H01L2924/01049 , H01L2924/00014
摘要： A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.
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公开(公告)号：EP3240025A3
公开(公告)日：2018-01-24
申请号：EP17165324.9
申请日：2017-04-06
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/32 , H01L24/03 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/03505 , H01L2224/2731 , H01L2224/27312 , H01L2224/2732 , H01L2224/2741 , H01L2224/27505 , H01L2224/29005 , H01L2224/29017 , H01L2224/2908 , H01L2224/29082 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29164 , H01L2224/29294 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/2938 , H01L2224/29384 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/2949 , H01L2224/3201 , H01L2224/32053 , H01L2224/32054 , H01L2224/32055 , H01L2224/32058 , H01L2224/32225 , H01L2224/32227 , H01L2224/32245 , H01L2224/32501 , H01L2224/83055 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/8384 , H01L2924/00014 , H01L2924/01006 , H01L2924/07802 , H01L2924/0781 , H01L2924/00012
摘要： A die and substrate assembly (10) is disclosed for a die (12) with electronic circuitry and a substrate (14). A sintered bonding layer (16, 16A) of sintered metal (e.g. silver) is disposed between the die (12) and the substrate (14). The sintered bonding layer (16, 16A) includes a plurality of zones (18, 18', 18", 20, 20', 20") having different sintered metal densities. The plurality of zones (18, 18', 18", 20, 20', 20") are distributed along one or more horizontal axes of the sintered bonding layer (16), along one or more vertical axes of the sintered bonding layer (16) or along both one or more horizontal and one or more vertical axes of the sintered bonding layer (16A).
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4.发明公开
公开(公告)号：EP2499085A2
公开(公告)日：2012-09-19
申请号：EP10757200.0
申请日：2010-09-23
申请人： Robert Bosch GmbH
IPC分类号： B81C3/00
CPC分类号： B81C1/00269 , B81C2201/019 , B81C2203/0118 , B81C2203/019 , B81C2203/036 , H01L23/10 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/83 , H01L25/50 , H01L2224/26145 , H01L2224/29011 , H01L2224/29013 , H01L2224/29076 , H01L2224/291 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29117 , H01L2224/29124 , H01L2224/29144 , H01L2224/30051 , H01L2224/30131 , H01L2224/30135 , H01L2224/30177 , H01L2224/30505 , H01L2224/30515 , H01L2224/32054 , H01L2224/32145 , H01L2224/32501 , H01L2224/83007 , H01L2224/83095 , H01L2224/83191 , H01L2224/83365 , H01L2224/83815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1461 , H01L2924/1631 , H01L2924/165 , H01L2924/00 , H01L2924/01014 , H01L2924/01049 , H01L2924/00014
摘要： A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.
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