公开(公告)号：EP2727135A2

公开(公告)日：2014-05-07

申请号：EP12767538.7

申请日：2012-04-05

申请人： Texas Instruments Inc.

发明人： YU, Frank ,  WRIGHT, Lance ,  FENG, Chien-te ,  HORTON, Sandra

IPC分类号： H01L21/48

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/30181 ,  H01L2224/30505 ,  H01L2224/30519 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/1305 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged semiconductor device (100) includes a semiconductor die (110) including a substrate (112) having a top side (113) including active circuitry (114) and a bottom side (116) with at least one back side metal layer (118) directly attached. A package (130) including a molding material (132) having a die pad (125) and a plurality of leads (127) is encapsulated within the molding material, wherein the leads include an exposed portion 127(a) that includes a bonding portion 127(a)(1). The top side of the semiconductor die is attached to the die pad, and the package includes a gap that exposes the back side metal layer along a bottom surface of the package. Bond wires couple pads on the top side of the semiconductor die to the leads. The bonding portions, the molding material along the bottom surface of the package, and the back side metal layer are all substantially planar to one another.

公开(公告)号：EP2978015A1

公开(公告)日：2016-01-27

申请号：EP14768581.2

申请日：2014-03-13

申请人： G-Smatt Co., Ltd.

发明人： SHIN, Hak Ryul ,  LEE, Ho Joon

IPC分类号： H01L21/60 ,  B05C5/00 ,  H05K3/32 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/27312 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29012 ,  H01L2224/29014 ,  H01L2224/29027 ,  H01L2224/29036 ,  H01L2224/30131 ,  H01L2224/30135 ,  H01L2224/30136 ,  H01L2224/30151 ,  H01L2224/30155 ,  H01L2224/30179 ,  H01L2224/30505 ,  H01L2224/32225 ,  H01L2224/33135 ,  H01L2224/33179 ,  H01L2224/33505 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2924/12041 ,  H01L2933/0066 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2203/0126 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a method of coating a conductive substrate with an adhesive, wherein the amounts and positions of conductive and non-conductive adhesives for bonding a plurality of circuit elements to the conductive substrate are set, thus preventing the spread of the adhesive from causing defects, including a poor aesthetic appearance, low electrical conductivity, and short circuits.

摘要翻译： 公开了一种用粘合剂涂覆导电衬底的方法，其中设置用于将多个电路元件接合到导电衬底的导电和非导电粘合剂的量和位置，从而防止粘合剂扩散导致缺陷， 包括美观性差，导电性低和短路。

公开(公告)号：EP3146538A4

公开(公告)日：2018-02-28

申请号：EP15795680

申请日：2015-05-26

申请人： TEXAS INSTRUMENTS INC

发明人： LEE DOK WON ,  FRENCH WILLIAM D ,  PAPOU ANDREI

IPC分类号： H01F27/28 ,  H01F17/00 ,  H01L21/02 ,  H01L23/00 ,  H01L23/522 ,  H01L23/532 ,  H01L25/10 ,  H01L49/02

CPC分类号： H01L28/10 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2027/2809 ,  H01L23/5222 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/5329 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/33 ,  H01L24/80 ,  H01L25/105 ,  H01L2224/0345 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/131 ,  H01L2224/1705 ,  H01L2224/30505 ,  H01L2224/80031 ,  H01L2224/80862 ,  H01L2225/1011 ,  H01L2924/01029 ,  H01L2924/06 ,  H01L2924/364 ,  H01L2924/00014 ,  H01L2924/014

摘要： A method of manufacturing an inductor on a wafer level process that can operate at 20 MHz with good efficiency and a high inductance density is disclosed, wherein the inductor design allows high frequency operation, low RDSON values and high efficiency.

公开(公告)号：EP2499085A2

公开(公告)日：2012-09-19

申请号：EP10757200.0

申请日：2010-09-23

申请人： Robert Bosch GmbH

发明人： TRAUTMANN, Achim ,  REICHENBACH, Ralf

IPC分类号： B81C3/00

CPC分类号： B81C1/00269 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/036 ,  H01L23/10 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/26145 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/30051 ,  H01L2224/30131 ,  H01L2224/30135 ,  H01L2224/30177 ,  H01L2224/30505 ,  H01L2224/30515 ,  H01L2224/32054 ,  H01L2224/32145 ,  H01L2224/32501 ,  H01L2224/83007 ,  H01L2224/83095 ,  H01L2224/83191 ,  H01L2224/83365 ,  H01L2224/83815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/1631 ,  H01L2924/165 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01049 ,  H01L2924/00014

摘要： A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.

公开(公告)号：EP2978015A4

公开(公告)日：2016-12-07

申请号：EP14768581

申请日：2014-03-13

申请人： G-SMATT CO LTD

发明人： SHIN HAK RYUL ,  LEE HO JOON

IPC分类号： H05K3/32 ,  H01L23/00 ,  H05K3/30

CPC分类号： H01L33/62 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/27312 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29012 ,  H01L2224/29014 ,  H01L2224/29027 ,  H01L2224/29036 ,  H01L2224/30131 ,  H01L2224/30135 ,  H01L2224/30136 ,  H01L2224/30151 ,  H01L2224/30155 ,  H01L2224/30179 ,  H01L2224/30505 ,  H01L2224/32225 ,  H01L2224/33135 ,  H01L2224/33179 ,  H01L2224/33505 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2924/12041 ,  H01L2933/0066 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2203/0126 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

公开(公告)号：EP2727135A4

公开(公告)日：2015-10-21

申请号：EP12767538

申请日：2012-04-05

申请人： TEXAS INSTRUMENTS INC

发明人： YU FRANK ,  WRIGHT LANCE ,  FENG CHIEN-TE ,  HORTON SANDRA

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/30181 ,  H01L2224/30505 ,  H01L2224/30519 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/1305 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2499085B1

公开(公告)日：2013-08-28

申请号：EP10757200.0

申请日：2010-09-23

申请人： Robert Bosch GmbH

发明人： TRAUTMANN, Achim ,  REICHENBACH, Ralf

IPC分类号： B81C1/00

CPC分类号： B81C1/00269 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/036 ,  H01L23/10 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/26145 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/30051 ,  H01L2224/30131 ,  H01L2224/30135 ,  H01L2224/30177 ,  H01L2224/30505 ,  H01L2224/30515 ,  H01L2224/32054 ,  H01L2224/32145 ,  H01L2224/32501 ,  H01L2224/83007 ,  H01L2224/83095 ,  H01L2224/83191 ,  H01L2224/83365 ,  H01L2224/83815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/1631 ,  H01L2924/165 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01049 ,  H01L2924/00014

摘要： A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.