公开(公告)号：EP2312628A2

公开(公告)日：2011-04-20

申请号：EP10191035.4

申请日：2008-07-24

申请人： Nippon Steel Materials Co., Ltd. ,  Nippon Micrometal Corporation

发明人： Uno, Tomohiro ,  Kimura, Keiichi ,  Terashima, Shinichi ,  Yamada, Takashi ,  Nishibayashi, Akihito

IPC分类号： H01L23/49

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

摘要： It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition. The outer layer is 0.021 to 0.12 µ m in thickness.

摘要翻译： 本发明的目的是提供一种铜基接合线，其材料成本低，具有优异的球接合性，热循环试验或回流试验的可靠性以及储存寿命，使得能够使用的线材变薄 用于细间距连接。 接合线包括具有铜作为主要成分的芯材和设置在芯材上并且包含金属M和铜的外层，其中金属M与芯材料在组分和组成中的一种或两种中不同 。 外层的厚度为0.021〜0.12μm。

公开(公告)号：EP2221861A1

公开(公告)日：2010-08-25

申请号：EP08791508.8

申请日：2008-07-24

申请人： Nippon Steel Chemical Co., Ltd. ,  Nippon Micrometal Corporation

发明人： UNO, Tomohiro ,  KIMURA, Keiichi ,  TERASHIMA, Shinichi ,  YAMADA, Takashi ,  NISHIBAYASHI, Akihito

IPC分类号： H01L21/60 ,  H01B5/02

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

摘要： It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition.. The outer layer is 0.021 to 0.12µm in thickness.

公开(公告)号：EP2221861A4

公开(公告)日：2012-06-20

申请号：EP08791508

申请日：2008-07-24

申请人： NIPPON STEEL MATERIALS CO LTD ,  NIPPON MICROMETAL CORP

发明人： UNO TOMOHIRO ,  KIMURA KEIICHI ,  TERASHIMA SHINICHI ,  YAMADA TAKASHI ,  NISHIBAYASHI AKIHITO

IPC分类号： H01L21/60 ,  H01B5/02 ,  H01L23/49

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

摘要： It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition.. The outer layer is 0.021 to 0.12µm in thickness.

摘要翻译： 本发明的目的是提供一种铜基接合线，其材料成本低，具有优异的球接合性，热循环试验或回流试验的可靠性以及储存寿命，使得能够使用的线材变薄 用于细间距连接。 接合线包括具有铜作为主要成分的芯材和设置在芯材上并且包含金属M和铜的外层，其中金属M与芯材料在组分和组成中的一种或两种中不同 外层的厚度为0.021〜0.12μm。

公开(公告)号：EP2779257A3

公开(公告)日：2014-10-08

申请号：EP14159836.7

申请日：2014-03-14

申请人： Nichia Corporation

发明人： Yamashita, Ryohei ,  Yoshimoto, Ryoichi

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

摘要： A terminal (10) includes a first surface (10a), a second surface (10b), and an end surface having first and second recessed areas (10ca, 10cb) that are extend from the first and second surfaces, respectively. The resin portion (20) is integrally formed with the terminal, and at least partially covers the end surface so that the first and second surfaces are at least partially exposed. The resin portion forms a recessed part to accommodate the light emitting device. The second recessed area includes a closest point (P) that is positioned closest to the first surface and an extension part (10cbe) that extends outward of the closest point and toward the second surface (10b) side. The extension part is formed at least on opposing end surfaces of the pair of positive and negative lead terminal. The first recessed area is arranged on the exterior side relative to the closest point.

摘要翻译： 端子（10）包括第一表面（10a），第二表面（10b）和具有分别从第一表面和第二表面延伸的第一和第二凹陷区域（10ca，10cb）的端面。 树脂部分（20）与端子一体地形成，并且至少部分地覆盖端面，使得第一和第二表面至少部分地露出。 树脂部分形成凹部以容纳发光器件。 第二凹陷区域包括最靠近第一表面定位的最近点（P）和从最近点向外延伸并朝向第二表面（10b）侧的延伸部分（10cbe）。 延伸部分至少形成在一对正和负引线端子的相对的端面上。 第一凹陷区域相对于最接近的点布置在外侧。

公开(公告)号：EP2779257A2

公开(公告)日：2014-09-17

申请号：EP14159836.7

申请日：2014-03-14

申请人： Nichia Corporation

发明人： Yamashita, Ryohei ,  Yoshimoto, Ryoichi

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

摘要： A terminal (10) includes a first surface (10a), a second surface (10b), and an end surface having first and second recessed areas (10ca, 10cb) that are extend from the first and second surfaces, respectively. The resin portion (20) is integrally formed with the terminal, and at least partially covers the end surface so that the first and second surfaces are at least partially exposed. The resin portion forms a recessed part to accommodate the light emitting device. The second recessed area includes a closest point (P) that is positioned closest to the first surface and an extension part (10cbe) that extends outward of the closest point and toward the second surface (10b) side. The extension part is formed at least on opposing end surfaces of the pair of positive and negative lead terminal. The first recessed area is arranged on the exterior side relative to the closest point.

摘要翻译： 端子（10）包括第一表面（10a），第二表面（10b）和具有分别从第一和第二表面延伸的第一和第二凹陷区域（10ca，10cb）的端表面。 树脂部（20）与端子一体形成，并且至少部分地覆盖端面，使得第一和第二表面至少部分地暴露。 树脂部分形成凹陷部分以容纳发光器件。 第二凹陷区域包括最靠近第一表面的最近点（P）和从最靠近点向第二表面（10b）侧延伸的延伸部分（10cbe）。 延伸部至少形成在一对正负引线端子的相对的端面上。 第一凹陷区域相对于最近点布置在外侧。

公开(公告)号：EP3190635A1

公开(公告)日：2017-07-12

申请号：EP17153341.7

申请日：2014-03-14

申请人： NICHIA CORPORATION

发明人： YAMASHITA, Ryohei ,  YOSHIMOTO, Ryoichi

IPC分类号： H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L23/495

CPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

摘要： A light emitting device mount comprising a pair of lead terminals (10, 11), each including a first main surface (10a), a second main surface (10b) that is located on the opposite side to said first main surface (10a), and an end surface having first and second recessed surface areas (10ca, 10cb) that include curved surfaces and extend from said first and second main surfaces (10a, 10b), respectively, as viewed in cross-section, the end surface also having a middle area (10cc) between said first and second recessed surface areas (10ca, 10cb); and a resin portion (20) that is integrally formed with said pair of lead terminals (10, 11), and covers said end surface so that said second main surface (10b) is at least partially exposed, wherein the area of said second recessed surface area (10cb) is larger than that of said first recessed surface area (10ca).

摘要翻译： 1。一种发光装置支架，包括：一对引线端子，每个引线端子包括第一主表面，位于所述第一主表面的相反侧的第二主表面， 和具有第一和第二凹陷表面区域（10ca，10cb）的端表面，所述第一和第二凹陷表面区域（10ca，10cb）包括弯曲表面并且分别从所述第一和第二主表面（10a，10b）延伸，所述端表面也具有 所述第一和第二凹陷表面区域（10ca，10cb）之间的中间区域（10cc）; 和与所述一对引线端子（10,11）一体形成的树脂部分（20），并覆盖所述端面以使所述第二主表面（10b）至少部分地暴露，其中所述第二凹陷 表面积（10cb）大于所述第一凹陷表面区域（10ca）的表面积。

公开(公告)号：EP2779257B1

公开(公告)日：2017-02-01

申请号：EP14159836.7

申请日：2014-03-14

申请人： Nichia Corporation

发明人： Yamashita, Ryohei ,  Yoshimoto, Ryoichi

IPC分类号： H01L33/48 ,  H01L33/62 ,  H01L23/495

CPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752