公开(公告)号：EP3158345A1

公开(公告)日：2017-04-26

申请号：EP15734498.7

申请日：2015-06-18

申请人： Xcerra Corporation

发明人： TREIBERGS, Valts ,  NELSON, Mitchell ,  MROCZKOWSKI, Jason

IPC分类号： G01R1/04

CPC分类号： H01L23/49517 ,  G01R1/0466 ,  G01R1/0483 ,  H01L2924/0002 ,  H05K5/04 ,  H05K7/10 ,  H01L2924/00

摘要： A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

摘要翻译： 一种插座组件，包括其中具有一个或多个弹簧探针的壳体。 插座组件还包括具有一个或多个悬臂构件的引线框组件，并且引线框组件具有微波结构和柔性接地平面。 插座组件进一步包括邻近引线框架组件的弹性体间隔件，弹性间隔件具有一个或多个接收穿过其中的弹簧探针的孔。

公开(公告)号：EP3143642A1

公开(公告)日：2017-03-22

申请号：EP15792595.9

申请日：2015-05-15

申请人： Texas Instruments Incorporated ,  Texas Instruments Japan Limited

发明人： VILUAN, Ramil, Alfonso ,  SAMSON, Roxanna, Bauzon ,  ESQUEJO, Jeffrey, De Guzman ,  SANCHEZ, Ramices, Julian

IPC分类号： H01L21/687 ,  H05K1/18

CPC分类号： H01L23/49517 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/85

摘要： Gang clips (500) having a flat area (510), a ridge (510a), and tie bars (530b) extending from the flat area, the end portions of the ties bars aligned in a common x-direction; a plurality of gang clips having respective end portions of tie bars merged in x-direction to form an elongated chain (701) of clips; and a plurality of chains arrayed parallel to each other, free of tie bars between adjacent chains, the plurality having the chain ends tied at both ends (730a) to rails (740) normal to the chains to form a matrix (700) of clips having the rails as a stable frame.

摘要翻译： 具有扁平区域（510），脊（510a）和从平坦区域延伸的连接杆（530b）的组夹（500），连杆条的端部沿共同的x方向排列; 多个组合夹，其具有在x方向上合并的连接杆的相应端部，以形成细长链条（701）; 以及多个彼此平行排列的链，在相邻链之间没有连接条，所述多个链的两端（730a）链接到与链条垂直的轨道（740），以形成夹子的矩阵（700） 将轨道作为稳定的框架。

公开(公告)号：EP2733727B1

公开(公告)日：2016-08-24

申请号：EP13756799.6

申请日：2013-04-25

申请人： Huawei Technologies Co., Ltd.

发明人： CHEN, Kai ,  LIU, Zhihua ,  JIANG, Ran

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L21/4828 ,  H01L21/4825 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/48249 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2814060A4

公开(公告)日：2015-10-14

申请号：EP13803451

申请日：2013-04-16

申请人： FUJI ELECTRIC CO LTD

发明人： DENTA TOSHIO ,  SEKI TOMONORI ,  YAMADA TADANORI ,  SATO TADAHIKO

IPC分类号： H01L25/16 ,  H01L23/495

CPC分类号： H01L25/18 ,  H01L23/043 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49861 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

公开(公告)号：EP2101402A3

公开(公告)日：2015-09-02

申请号：EP09002478.7

申请日：2009-02-20

申请人： Hitachi, Ltd.

发明人： Tokuyama, Takeshi ,  Nakatsu, Kinya ,  Saito, Ryuichi ,  Horiuchi, Keisuke ,  Satoh, Toshiya ,  Miyazaki, Hideki

IPC分类号： H02M7/00

CPC分类号： H05K7/20927 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L11/1803 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/429 ,  B60Y2200/92 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49517 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H02M7/003 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0262 ,  H05K7/2089 ,  Y10S903/906 ,  Y10S903/907 ,  Y10S903/909 ,  H01L2924/00 ,  H01L2224/45099

摘要： An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module 500 that comprises an upper and lower arms series circuit 50 of an inverter circuit 44-46; a capacitor module 390; a direct current connector 38; and an alternate current connector 88. The semiconductormodule 500 comprises a first and a second heat dissipation metals 522, 562 whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit 50 is disposed tightly between the first heat dissipation metal 522 and the second heat dissipation metal 562, and the semiconductor module 500 further comprises a direct current positive terminal 57, a direct current negative terminal 58, and an alternate current terminal 59 which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet 246 to a cooling water outlet 248, and a first opening 237 which opens into the cooling water channel.

摘要翻译： 电力转换装置包括：形成冷却水通道的通道壳体; 包括逆变器电路44-46的上下臂串联电路50的双面冷却半导体模块500; 电容器模块390; 直流连接器38; 和半导体模块500包括第一和第二散热金属522,562，其外表面是散热表面，上臂和下臂串联电路50紧密地设置在第一散热金属522和 第二散热金属562，并且半导体模块500还包括突出到外部的直流正极端子57，直流负极端子58和交流端子59。 通道壳体设置有从冷却水入口246延伸到冷却水出口248的冷却水通道以及通向冷却水通道的第一开口237。

公开(公告)号：EP2779257A3

公开(公告)日：2014-10-08

申请号：EP14159836.7

申请日：2014-03-14

申请人： Nichia Corporation

发明人： Yamashita, Ryohei ,  Yoshimoto, Ryoichi

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

摘要： A terminal (10) includes a first surface (10a), a second surface (10b), and an end surface having first and second recessed areas (10ca, 10cb) that are extend from the first and second surfaces, respectively. The resin portion (20) is integrally formed with the terminal, and at least partially covers the end surface so that the first and second surfaces are at least partially exposed. The resin portion forms a recessed part to accommodate the light emitting device. The second recessed area includes a closest point (P) that is positioned closest to the first surface and an extension part (10cbe) that extends outward of the closest point and toward the second surface (10b) side. The extension part is formed at least on opposing end surfaces of the pair of positive and negative lead terminal. The first recessed area is arranged on the exterior side relative to the closest point.

摘要翻译： 端子（10）包括第一表面（10a），第二表面（10b）和具有分别从第一表面和第二表面延伸的第一和第二凹陷区域（10ca，10cb）的端面。 树脂部分（20）与端子一体地形成，并且至少部分地覆盖端面，使得第一和第二表面至少部分地露出。 树脂部分形成凹部以容纳发光器件。 第二凹陷区域包括最靠近第一表面定位的最近点（P）和从最近点向外延伸并朝向第二表面（10b）侧的延伸部分（10cbe）。 延伸部分至少形成在一对正和负引线端子的相对的端面上。 第一凹陷区域相对于最接近的点布置在外侧。

公开(公告)号：EP2779257A2

公开(公告)日：2014-09-17

申请号：EP14159836.7

申请日：2014-03-14

申请人： Nichia Corporation

发明人： Yamashita, Ryohei ,  Yoshimoto, Ryoichi

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

摘要： A terminal (10) includes a first surface (10a), a second surface (10b), and an end surface having first and second recessed areas (10ca, 10cb) that are extend from the first and second surfaces, respectively. The resin portion (20) is integrally formed with the terminal, and at least partially covers the end surface so that the first and second surfaces are at least partially exposed. The resin portion forms a recessed part to accommodate the light emitting device. The second recessed area includes a closest point (P) that is positioned closest to the first surface and an extension part (10cbe) that extends outward of the closest point and toward the second surface (10b) side. The extension part is formed at least on opposing end surfaces of the pair of positive and negative lead terminal. The first recessed area is arranged on the exterior side relative to the closest point.

摘要翻译： 端子（10）包括第一表面（10a），第二表面（10b）和具有分别从第一和第二表面延伸的第一和第二凹陷区域（10ca，10cb）的端表面。 树脂部（20）与端子一体形成，并且至少部分地覆盖端面，使得第一和第二表面至少部分地暴露。 树脂部分形成凹陷部分以容纳发光器件。 第二凹陷区域包括最靠近第一表面的最近点（P）和从最靠近点向第二表面（10b）侧延伸的延伸部分（10cbe）。 延伸部至少形成在一对正负引线端子的相对的端面上。 第一凹陷区域相对于最近点布置在外侧。

公开(公告)号：EP2002478A1

公开(公告)日：2008-12-17

申请号：EP07735213.6

申请日：2007-03-23

申请人： NXP B.V.

发明人： WYLAND, Chris

IPC分类号： H01L23/49 ,  H01L21/60

CPC分类号： H01L24/49 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49558 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/91 ,  H01L2223/6611 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49175 ,  H01L2224/73277 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Consistent with an example embodiment, there is an integrated circuit (IC) device in a packaging having electrically insulated connections. The IC device comprises a semiconductor device (100) mounted onto a die attachment area (10); the semiconductor device has a plurality of bonding pads (20a, 25a, 30a, 35a). A lead frame having a plurality of bonding fingers (20b, 25b, 30b, 35b) surrounds the die attachment area. A plurality of mutually isolated connection conductors (25d, 30d, 40, 50) having respective first ends are attached to respective bonding pads on the semiconductor device and the plurality of mutually isolated connection conductors having respective second respective second ends are attached to respective bonding fingers of the lead frame. An insulating material (45) coats at least a portion of the plurality of mutually isolated connection conductors. The mutually isolated connection conductors may include a bond wire (40, 50) for the signal connection and a conductive strap (25d, 30d) for the voltage reference connection. The insulating material (45) coating the bond wires reduces the likelihood of short circuits during encapsulation.

公开(公告)号：EP0729645B1

公开(公告)日：1999-03-17

申请号：EP95933108.3

申请日：1995-09-15

申请人： NATIONAL SEMICONDUCTOR CORPORATION

发明人： CHILLARA, Satya ,  MOSTAFAZADEH, Shahram

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H05K3/341 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit assembly (30) is disclosed herein. The assembly (30) includes a dielectric substrate (32) defining a predetermined array of electrically conductive traces (40) and an array of solder balls (42) electrically connected to the traces (40). An integrated circuit chip (44) having a series of input/output pads is supported on the substrate (32). In one embodiment, a plurality of leadframe leads (48) are supported by the substrate (32) in electrical isolation from and over the conductive traces (40). First and second series of bonding wires (56, 58) electrically connect certain ones of the input/output pads on the IC chip to the leadframe leads (48) and conductive traces (40). In other embodiments, one or more electrically isolated conductive layers are supported by the dielectric substrate (32) over the traces (40) and leadframe leads (48). The integrated circuit assembly (30), in accordance with any of these embodiments, provides a very high density electrical interconnection arrangement for the IC chip while retaining a small package footprint.

摘要翻译： 一种集成电路组件是在盘游离缺失。 该组件包括一个绝缘基片限定的导电迹线和电连接到迹线焊球阵列的预定阵列。 被支撑在基片上具有一系列的输入/输出焊盘的集成电路芯片。 在一个，实施例的引线框的引线的多元性由基板中的电隔离和从在所述导电迹线支撑。 第一和第二系列键合线的电IC芯片到引线框架引线和导电迹线对连接的输入/输出焊盘某一些。 在其它实施例中，一个或多个电隔离的导电层是通过在所述迹线和引线框架引线电介质基板支撑。 的集成电路组件，在与任何实施例论文雅舞蹈，提供用于该IC芯片的非常高密度的电互连装置，同时保持一个小尺寸封装。

公开(公告)号：EP0538010A3

公开(公告)日：1993-05-19

申请号：EP92309366.0

申请日：1992-10-14

申请人： FUJITSU LIMITED ,  KYUSHU FUJITSU ELECTRONICS LIMITED ,  FUJITSU AUTOMATION LIMITED

发明人： Kasai, Junichi, c/o FUJITSU LIMITED ,  Tsuji, Kazuto, c/o FUJITSU LIMITED ,  Taniguchi, Norio, c/o FUJITSU LIMITED ,  Yoneda, Yoshiyuki, c/o FUJITSU LIMITED ,  Takenaka, Masashi, c/o FUJITSU LIMITED ,  Mashiko, Takashi, c/o FUJITSU AUTOMATION LIMITED ,  Sakuma, Masao, c/o FUJITSU AUTOMATION LIMITED ,  Saigo, Yukio, c/o KYUSHO FUJITSU ELECTRONICS LTD

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L21/66 ,  H01L21/68 ,  H01L21/00

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device comprises a plurality of leads (225) respectively made up of an inner lead (5, 93a, 225a) and an outer lead (8, 93b, 225b), a semiconductor chip (4, 223) electrically connected to the inner leads of the leads, and a package (7, 221) encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package (7, 221) has an upper part (7a, 221a) and a lower part (7b, 221b) which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads (8, 93b) have a wide part (21) which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.