公开(公告)号：EP3437443B1

公开(公告)日：2024-04-24

申请号：EP17773411.8

申请日：2017-03-29

IPC分类号： H05K1/18 ,  H05K3/46

CPC分类号： H01L2224/1820130101 ,  H05K1/185 ,  H05K3/4652 ,  H01L2224/0410520130101 ,  H01L2224/251820130101 ,  H01L2224/9214420130101 ,  H01L2224/9620130101 ,  H01L2924/351120130101 ,  H05K2203/146920130101 ,  H05K2203/019120130101 ,  H05K2203/06320130101

公开(公告)号：EP4300576A3

公开(公告)日：2024-06-26

申请号：EP23209817.8

申请日：2017-12-22

申请人： At&S (China) Co., Ltd.

发明人： TAY, Seok Kim (Annie) ,  TUOMINEN, Mikael Andreas ,  BAFTIRI, Artan

IPC分类号： H05K1/18 ,  H05K1/02 ,  H01L23/538 ,  H01L23/48 ,  H05K3/30 ,  H05K3/46 ,  C09J7/00

CPC分类号： H05K1/0204 ,  H05K1/185 ,  H05K3/4652 ,  H05K2201/1041620130101 ,  H05K2201/207220130101 ,  H05K2201/20920130101 ,  H05K2203/06320130101 ,  C09J7/00 ,  H05K2201/02620130101 ,  H05K2201/032320130101 ,  H05K2203/019120130101 ,  C09J2203/32620130101 ,  H05K2201/0912720130101 ,  H01L2224/1820130101 ,  H01L23/49822 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49894 ,  C09J2301/3120200801

摘要： A component carrier (106), comprising a stack (116) comprising at least one electrically conductive layer structure (114) and/or at least one electrically insulating layer structure (112), a sheet (100) with nano- and/or microstructures (102) and arranged on and/or in the stack (116), said sheet (100) comprising or consisting of copper.

公开(公告)号：EP3216325B1

公开(公告)日：2024-06-12

申请号：EP15788423.0

申请日：2015-11-03

IPC分类号： H05K1/02 ,  H05K7/20 ,  F28D15/02

CPC分类号： F28D15/02 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/022 ,  H05K2203/06320130101 ,  H05K2201/06420130101 ,  H01L23/427 ,  F28F2265/1220130101

公开(公告)号：EP4340555A3

公开(公告)日：2024-09-04

申请号：EP24155860.0

申请日：2018-06-11

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Stahr, Johannes ,  Weidinger, Gerald ,  Schmid, Gerhard ,  Zluc, Andreas

IPC分类号： H05K1/18 ,  H05K3/46

CPC分类号： H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/010820130101 ,  H05K2201/0906320130101 ,  H05K2201/0907220130101 ,  H05K2201/0912720130101 ,  H05K2201/0984520130101 ,  H05K2201/1012120130101 ,  H05K2201/1051520130101 ,  H05K2203/015620130101 ,  H05K2203/019120130101 ,  H05K2203/06320130101 ,  H05K2203/146920130101

摘要： Described are component carriers (100; 200a, 200b) comprising a stepped cavity (150; 250) into which a stepped component assembly (160; 260) is embedded. The component carriers comprise (a) fully cured electrically insulating material (M) originating from at least one electrically insulating layer structure (112) of the component carrier (100) and circumferentially surrounding the stepped component assembly (160) and/or (b) an undercut (254a) in a transition region between a narrow recess (252) and a wide recess (254) of the stepped cavity (250). Further described are methods for manufacturing such component carriers (100; 200a, 200b).

公开(公告)号：EP4408134A1

公开(公告)日：2024-07-31

申请号：EP24153706.7

申请日：2024-01-24

申请人： Simmonds Precision Products, Inc.

发明人： EWANCHUK, Jeffrey ,  FRANZ, Paul M. ,  FITZHUGH, Christopher ,  DURKEE, Scott R.

IPC分类号： H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K1/185 ,  H05K2201/019520130101 ,  H05K2201/018720130101 ,  H05K2203/06320130101 ,  H05K3/4697 ,  H05K3/4626 ,  H05K3/4644 ,  H05K3/4673 ,  H05K1/0204

摘要： A circuit board assembly can include a circuit component die, a first dielectric layer disposed on a first side of the circuit component die made of a first dielectric material having a high thermal conductivity, a second dielectric layer disposed on a second side of the circuit component die made of the first dielectric material, and a bulk dielectric material having a lower thermal conductivity than the first dielectric material. The bulk dielectric material can have a lower glass transition temperature than the first dielectric material and being heterogeneous to the first dielectric material. The bulk dielectric material can be in flowed contact with lateral sides of the circuit component die, the first dielectric layer, and the second dielectric layer to laterally enclose the circuit component die, the first dielectric layer, and the second dielectric layer.

公开(公告)号：EP4358657A1

公开(公告)日：2024-04-24

申请号：EP23204533.6

申请日：2023-10-19

申请人： Airbus Operations (S.A.S.) ,  Airbus Operations S.L.

发明人： MURILLO, Richard ,  DE LA MOTA MENDIOLA, Matilde ,  LAGACHE, Nathan

IPC分类号： H05K3/20 ,  H05K3/28

CPC分类号： H05K3/281 ,  H05K3/202 ,  H05K2203/06320130101 ,  H05K2203/06620130101 ,  H05K2203/03320130101 ,  H05K2203/053720130101 ,  H05K2203/055720130101

摘要： Un film de résine (6) adapté pour maintenir une piste métallique (2) conductrice contre un panneau (1). Le film de résine (6) recouvre partiellement la piste métallique (2) conductrice, de sorte que la piste métallique (2) conductrice présente au moins une zone (8) dépourvue du film de résine (6) pour permettre une connexion électrique par contact. Ainsi, dans le cadre d'un assemblage sur un panneau, la piste métallique intégrée entre le panneau et le film de résine est protégée ce qui rend cette solution technique particulièrement robuste. En outre, d'une manière particulièrement astucieuse, le film de résine permet d'isoler électriquement la piste métallique des éléments environnants, et les zones dépourvues de film de résine permettent une connexion électrique par contact.