公开(公告)号：EP2713411B1

公开(公告)日：2018-10-31

申请号：EP13185895.3

申请日：2013-09-25

Applicant: LG Innotek Co., Ltd.

Inventor： TOMOHIRO, Sampei

IPC: H01L33/62 ,  H01L33/64 ,  H01L23/373 ,  H01L33/50

CPC classification number: H01L24/04 ,  H01L23/3735 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L33/382 ,  H01L33/50 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/04042 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/284 ,  H05K2201/0335 ,  H05K2201/09909 ,  H05K2201/10106 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A luminescence device used in a backlight unit for lighting or displaying may be provided that includes: a substrate 11 including a first electrode 12 and a second electrode 13; an LED chip disposed on the first electrode 12; and a dam 18 disposed on the substrate 11, wherein the dam 18 is disposed spaced from the LED chip 14 , wherein the substrate 11 comprises a direct copper bonding (DCB) substrate 11 including a first copper layer 2, a second copper layer 3 and a substrate body 1, and wherein the first electrode 12 and the second electrode 13 include respectively a metal film 35 which fills a void 31 of the surfaces thereof.

公开(公告)号：EP2903399A4

公开(公告)日：2016-07-27

申请号：EP12885910

申请日：2012-09-26

Applicant: MEIKO ELECTRONICS CO LTD

Inventor： SHIMIZU RYOICHI ,  IWAMOTO MITSUO ,  TODA MITSUAKI

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K1/188 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/115 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0335 ,  H05K2201/09154 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49131

公开(公告)号：EP2713411A2

公开(公告)日：2014-04-02

申请号：EP13185895.3

申请日：2013-09-25

Applicant: LG Innotek Co., Ltd.

Inventor： TOMOHIRO, Sampei

IPC: H01L33/62 ,  H01L33/64

CPC classification number: H01L24/04 ,  H01L23/3735 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L33/382 ,  H01L33/50 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/04042 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/284 ,  H05K2201/0335 ,  H05K2201/09909 ,  H05K2201/10106 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A luminescence device used in a backlight unit for lighting or displaying may be provided that includes: a substrate 11 including a first electrode 12 and a second electrode 13; an LED chip disposed on the first electrode 12; and a dam 18 disposed on the substrate 11, wherein the dam 18 is disposed spaced from the LED chip 14 , wherein the substrate 11 comprises a direct copper bonding (DCB) substrate 11 including a first copper layer 2, a second copper layer 3 and a substrate body 1, and wherein the first electrode 12 and the second electrode 13 include respectively a metal film 35 which fills a void 31 of the surfaces thereof.

Abstract translation: 可以提供用于照明或显示的背光单元中的发光装置，其包括：包括第一电极12和第二电极13的基板11; 设置在第一电极12上的LED芯片; 以及设置在基板11上的坝18，其中坝18与LED芯片14间隔开设置，其中基板11包括直接铜键合（DCB）基板11，其包括第一铜层2，第二铜层3和 基板主体1，并且其中第一电极12和第二电极13分别包括填充其表面的空隙31的金属膜35。

公开(公告)号：EP2713411A3

公开(公告)日：2016-03-16

申请号：EP13185895.3

申请日：2013-09-25

Applicant: LG Innotek Co., Ltd.

Inventor： TOMOHIRO, Sampei

IPC: H01L33/62 ,  H01L33/64 ,  H01L23/373 ,  H01L33/50

CPC classification number: H01L24/04 ,  H01L23/3735 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L33/382 ,  H01L33/50 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/04042 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/284 ,  H05K2201/0335 ,  H05K2201/09909 ,  H05K2201/10106 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A luminescence device used in a backlight unit for lighting or displaying may be provided that includes: a substrate 11 including a first electrode 12 and a second electrode 13; an LED chip disposed on the first electrode 12; and a dam 18 disposed on the substrate 11, wherein the dam 18 is disposed spaced from the LED chip 14 , wherein the substrate 11 comprises a direct copper bonding (DCB) substrate 11 including a first copper layer 2, a second copper layer 3 and a substrate body 1, and wherein the first electrode 12 and the second electrode 13 include respectively a metal film 35 which fills a void 31 of the surfaces thereof.

公开(公告)号：EP2903399A1

公开(公告)日：2015-08-05

申请号：EP12885910.5

申请日：2012-09-26

Applicant: Meiko Electronics Co., Ltd.

Inventor： SHIMIZU, Ryoichi ,  IWAMOTO, Mitsuo ,  TODA, Mitsuaki

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K1/188 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/115 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0335 ,  H05K2201/09154 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49131

Abstract: In the present invention, in a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component (14) is positioned with reference to a mark (12) formed in a copper layer (4), when an imaginary line extending from a search center (74), which is a center of a search range (72) of a sensor, to an edge side (78) of the search range (72) is represented as a search reference line (80) and an imaginary line extending, in a state in which a mark center (76), which is the center of the mark (12), is matched with the search center (74), from the mark center (76) in the same direction as the search reference line (80) and to an outer ridgeline (25) of the mark (12) is represented as a mark reference line (82), the mark (12) is formed in a shape in which the outer ridgeline (25) of the mark (12) is present in a position where a length of the mark reference line (82) is in a range of 30% or more of the search reference line (80).

Abstract translation: 在本发明中，在制造方法的标记形成工序的元件基板并入在其中的铜层（4）当虚线形成电子部件（14）被定位成与参考标记（12） 从搜索中心（74），所有这些是一个传感器的搜索范围（72）的中心，在搜索范围的边缘侧（78）延伸（72）被表示为搜索基准线（80）和在 假想延长线，在其中的状态下的标记中心（76），所有这些是标记的中心（12）与搜索中心（74）匹配时，来自在相同的方向上的中心标记（76） 搜索基准线（80）和在所述标记（12）的外脊线（25）被表示为标记参考线（82），标记（12）的形状被形成，其中所述外棱线（25）的 标记（12）是存在于一个位置，其中标记参考线（82）的长度的范围内的搜索基准线（80）的30％或更多。