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    Printed wiring board, semiconductor package, and printed circuit board with semiconductor package
    2.
    发明公开
    Printed wiring board, semiconductor package, and printed circuit board with semiconductor package 审中-公开
    Leiterplatte，Halbleitergehäuse和und Leiterplatte mitHalbleitergehäuse

    公开(公告)号：EP2658353A1

    公开(公告)日：2013-10-30

    申请号：EP13164422.1

    申请日：2013-04-19

    Applicant: Canon Kabushiki Kaisha

    Inventor： Hayashi, Seiji ,  Kondo, Takuya ,  Matsumoto, Shoji

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16

    CPC classification number: H05K1/0216 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/48227 ,  H05K1/0228 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/114 ,  H05K1/116 ,  H05K1/14 ,  H05K1/141 ,  H05K1/162 ,  H05K1/18 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09454 ,  H05K2201/09463 ,  H05K2201/09636 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734

    Abstract: First (111) and second (112) signal wiring patterns are formed in a first conductor layer (101). A first electrode pad (121) electrically connected to the first signal wiring pattern through a first via (131) and a second electrode pad (122) electrically connected to the second signal wiring pattern through a second via (132) are formed in a second conductor layer (102) as a surface layer. A third conductor layer (103) is disposed between the first conductor layer and the second conductor layer with an insulator (105) interposed between those conductor layers. A first pad (141,151,161,171) electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion (141a,151b,161c,171d) which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.

    Abstract translation: 在第一导体层（101）中形成第一（111）和第二（112）信号布线图案。 通过第二通孔（132）通过第一通孔（131）和与第二信号布线图案电连接的第二电极焊盘（122）电连接到第一信号布线图案的第一电极焊盘（121） 导体层（102）作为表面层。 第三导体层（103）设置在第一导体层和第二导体层之间，绝缘体（105）插入在这些导体层之间。 电连接到第一通孔的第一焊盘（141,151,161,171）形成在第三导体层中。 第一焊盘包括与垂直于印刷电路板的表面的方向观察的与第二电极焊盘重叠并且通过绝缘体与第二电极焊盘相对的相对部分（141a，151b，161c，171d）。 这能够减少在信号布线之间引起的串扰噪声。

    Bond pads for fine-pitch applications on air bridge circuit boards
    4.
    发明公开
    Bond pads for fine-pitch applications on air bridge circuit boards 审中-公开
    对于与中途停留的印刷电路板具有细间距应用接触表面

    公开(公告)号：EP1026928A2

    公开(公告)日：2000-08-09

    申请号：EP00300553.5

    申请日：2000-01-26

    Applicant: Ford Motor Company

    Inventor： Goenka, Lakhi Nandial

    IPC: H05K1/11

    CPC classification number: H05K1/111 ,  H05K3/062 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09736 ,  H05K2201/09772 ,  H05K2201/098 ,  Y02P70/611

    Abstract: An etched tri-metal-layer air bridge circuit board specially designed for fine-pitch applications, comprising:

    an electrically insulative substrate surface (10), a plurality of tri-metal-layer bond pads (12) arranged in a generally straight row on the substrate surface (10) wherein the row defines a width direction therealong, and a circuit trace (20) arranged on the substrate surface (10), wherein the circuit trace (20) runs between two adjacent ones (22) of the plurality of tri-metal-layer bond pads (12). Each bond pad (12) comprises: (1) a bottom layer (14) attached to the substrate surface (10), the bottom layer (14) being made of a first metal and having an overall width W1 as measured along the width direction; (2) a top layer (18) disposed above and generally concentric with the bottom layer (14), the top layer (18) being made of the first metal and having an overall width W2 as measured along the width direction; and (3) a middle layer (16) made of a second metal connecting the bottom layer (14) and the top layer (18). The bond pads (12) are specially shaped such that W2 > W1 for at least the two adjacent bond pads (12), thus enabling the circuit trace (20) to be spaced closely to the bottom layers (14) of the two adjacent bond pads (12), while allowing the top layers (18) of the pads (12) to be made much larger so as to avoid delamination thereof from their associated middle layers (16).

    Abstract translation: 蚀刻的三金属层的空气桥电路板专为细间距应用，包括：在一个基因的反弹直排布置在电绝缘衬底表面（10），的三金属层接合垫有多个（12） 配置于该基板表面（10）worin的电路迹线（20）在基片上表面（10）worin行有沿定义的宽度方向，和一个电路迹线（20）的所述多个相邻的两个（22）之间延伸 三金属层接合焊盘（12）。 每一接合垫（12）包括：（1）附连到基板表面（10）的底层（14），底层（14）由第一金属制成的，并沿宽度方向测量的具有总宽度W1 ; 上述（2）和基因反弹同心设置为与底层（14），所述顶层（18）的顶层（18）由所述第一金属的，并具有为沿宽度方向测量的总宽度W2; 和（3）由第二金属制成的连接底部层（14）和顶层（18）的中间层（16）。 的键合焊盘（12）被特殊形状搜索做W2> W1，至少在两个相邻的键合焊盘（12）从而使电路迹线（20）被紧密间隔相邻的两个键的底层（14） 垫（12），同时允许所述垫（12）的顶层（18），以进行大得多，以便从它们相关联的中间层（16），其避免脱层。

    Printed-wiring board
    8.
    发明公开
    Printed-wiring board 有权
    印刷电路板

    公开(公告)号：EP1098555A3

    公开(公告)日：2005-04-13

    申请号：EP00309666.6

    申请日：2000-11-01

    Applicant: CANON KABUSHIKI KAISHA

    Inventor： Otaki, Toru ,  Inagawa, Hideho ,  Osaka, Toru

    IPC: H05K1/11

    CPC classification number: H05K1/112 ,  H05K2201/09227 ,  H05K2201/09336 ,  H05K2201/0939 ,  H05K2201/09627 ,  H05K2201/10734

    Abstract: A printed wiring board having assembled thereon a grid array type package, a multi-terminal device with many terminals arranged in matrix, is provided, through first signal connection holes, signal lines, and second connection holes, with many numbers of lands divided into plural blocks, being arranged in matrix on a first layer to connect each terminal of the multi-terminal device correspondingly, signal line patterns connected with many lands, and drawn out in the same direction per block, and first signal patterns from lands positioned on the innermost line of many lands. Then, the wiring patterns of the signal lines are drawn out regularly from many lands formed in matrix on the assembling surface of the grid array type package to make it easier for the printed wiring board to effectuate wiring connections without making them complicated or increasing the number of layers of the printed wiring board. Also, with the provision of ground patterns that surround signal lines, it is made possible to reduce unwanted radiation, as well as to suppress the occurrence of malfunctions of electronic equipment due to reflections and ground bounces.

    Printed-wiring board
    9.
    发明公开
    Printed-wiring board 有权
    Gedruckte Leiterplatte

    公开(公告)号：EP1098555A2

    公开(公告)日：2001-05-09

    申请号：EP00309666.6

    申请日：2000-11-01

    Applicant: CANON KABUSHIKI KAISHA

    Inventor： Otaki, Toru ,  Inagawa, Hideho ,  Osaka, Toru

    IPC: H05K1/11

    CPC classification number: H05K1/112 ,  H05K2201/09227 ,  H05K2201/09336 ,  H05K2201/0939 ,  H05K2201/09627 ,  H05K2201/10734

    Abstract: A printed wiring board having assembled thereon a grid array type package, a multi-terminal device with many terminals arranged in matrix, is provided, through first signal connection holes, signal lines, and second connection holes, with many numbers of lands divided into plural blocks, being arranged in matrix on a first layer to connect each terminal of the multi-terminal device correspondingly, signal line patterns connected with many lands, and drawn out in the same direction per block, and first signal patterns from lands positioned on the innermost line of many lands. Then, the wiring patterns of the signal lines are drawn out regularly from many lands formed in matrix on the assembling surface of the grid array type package to make it easier for the printed wiring board to effectuate wiring connections without making them complicated or increasing the number of layers of the printed wiring board. Also, with the provision of ground patterns that surround signal lines, it is made possible to reduce unwanted radiation, as well as to suppress the occurrence of malfunctions of electronic equipment due to reflections and ground bounces.

    Abstract translation: 通过第一信号连接孔，信号线和第二连接孔，设置有多个阵列型封装的印刷电路板，具有多个端子排列成矩阵状的多端子装置，其中多个焊盘分成多个 块，以矩阵形式布置在第一层上，以相应地连接多终端设备的每个终端，与许多焊盘相连并沿与每块相同的方向拉出的信号线图案，以及位于最内层的焊盘的第一信号图案 许多土地线。 然后，信号线的布线图形从格栅阵列型封装的组装表面上的矩阵形状的多个区域中规则地拉出，使得印刷布线板更容易实现布线连接而不使其复杂或增加数量 的印刷线路板的层。 此外，通过提供环绕信号线的接地图案，可以减少不需要的辐射，并且抑制由于反射和地面反弹而导致的电子设备故障的发生。

    METHODS AND SYSTEMS FOR MAGNETIC COUPLING
    10.
    发明公开
    METHODS AND SYSTEMS FOR MAGNETIC COUPLING 有权
    VERFAHREN UND SYSTEME ZUR MAGNETKUPPLUNG

    公开(公告)号：EP3104671A1

    公开(公告)日：2016-12-14

    申请号：EP16167926.1

    申请日：2016-05-02

    Applicant: Joylabz LLC

    Inventor： WILCOX, Bryan Randall ,  EDDIE, Todd ,  SILVER, Jay Saul

    IPC: H05K1/11 ,  H01R11/30 ,  H01R13/62 ,  H01R12/72 ,  H05K5/00

    CPC classification number: H01R13/6205 ,  G06F1/16 ,  H01R11/24 ,  H01R13/6658 ,  H01R2201/06 ,  H05K1/11 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K5/0278 ,  H05K2201/083 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09481 ,  H05K2201/10386

    Abstract: Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.

    Abstract translation: 用于磁耦合的系统和方法。 一个系统包括外部计算设备和具有导电端的连接器。 该系统还包括印刷电路板。 印刷电路板包括与背面相对的连接器侧。 连接器侧具有带孔的接触垫。 印刷电路板还包括位于印刷电路板背面的磁体。 磁体提供磁场，其被配置为向接触接触垫的连接器提供磁力吸引力。 印刷电路板还包括通信终端。 该系统还包括通过连接器和接触垫与印刷电路板通信的电路。

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