公开(公告)号：EP3157317B1

公开(公告)日：2018-12-26

申请号：EP16158530.2

申请日：2016-03-03

Applicant: Xiaomi Inc.

Inventor： WANG, Dongliang ,  WANG, Shaojie ,  SHI, Shasha

IPC: H05K1/02 ,  H05K7/20 ,  H05K9/00

CPC classification number: H05K1/0212 ,  H05K7/20 ,  H05K7/2039 ,  H05K7/20418 ,  H05K7/20427 ,  H05K7/20436 ,  H05K7/20518 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0081 ,  H05K2201/066 ,  H05K2201/0707 ,  H05K2201/10371

Abstract: Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) that are interconnected, wherein the second shielding case body (2) at least partially covers the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).

公开(公告)号：EP3162176A1

公开(公告)日：2017-05-03

申请号：EP15778213.7

申请日：2015-05-08

Applicant: Robert Bosch GmbH

Inventor： ERBE, Christian ,  GSCHWIND-SCHILLING, Rainer

IPC: H05K9/00

CPC classification number: H05K9/0007 ,  B60R16/02 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/181 ,  H05K3/34 ,  H05K5/0078 ,  H05K5/04 ,  H05K7/1427 ,  H05K9/0039 ,  H05K2201/0707

Abstract: The invention relates to a device for controlling person-protecting means for a vehicle, comprising a housing, at least one circuit board, and at least one electrical or electronic component, wherein the circuit board has at least one layer for screening electromagnetic radiation, wherein the circuit board is arranged in the housing in such a way that, when the device is attached in the vehicle, the circuit board screens off the electromagnetic radiation that the at least one electrical or electronic component emits from at least the interior of the vehicle. The invention further relates to a method for producing such a device.

Abstract translation: 本发明涉及一种用于控制人保护装置，用于一种车辆，包括一个壳体，至少一个电路板的装置，并且至少一个电气或电子组件，worin所述电路板具有至少一个层用于筛选电磁辐射，worin 所述电路板设置在壳体中寻求的方式，当该设备在车辆中安装，电路板的屏幕关断的电磁辐射，DASS模具至少一个电气或电子组件从所述车辆的至少内部发光。 本发明还涉及一种用于制造一个检索装置。

公开(公告)号：EP3076426A1

公开(公告)日：2016-10-05

申请号：EP14864242.4

申请日：2014-11-18

Applicant: Kyocera Corporation

Inventor： NIINO,Noritaka

IPC: H01L23/02 ,  H01L23/08 ,  H03H9/02 ,  H03H9/25

CPC classification number: H01L23/053 ,  H01L21/50 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L41/053 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H03H9/1014 ,  H03H9/1071 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/183 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0071 ,  H05K9/0098 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/10371 ,  H01L2924/00014

Abstract: An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package (10) includes an insulating substrate (1) including a plurality of insulating layers (11) stacked on top of each other, an upper surface of the insulating substrate (1) being provided with an electronic component (4) mounting section. The plurality of insulating layers (11) each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer (2) in frame-like form disposed on an upper surface of an uppermost one (11) of the plurality of insulating layers (11). The first metal layer (2) contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

Abstract translation: 提供能够减少红外线加热操作时间的电子部件外壳封装等。 一种电子部件壳体封装（10），包括绝缘基板（1），绝缘基板（1）包括堆叠在彼此顶部的多个绝缘层（11），所述绝缘基板（1）的上表面设置有电子部件（4） 安装部分。 多个绝缘层（11）各自含有第一金属氧化物作为主要成分。 所述绝缘基板还包括设置在所述多个绝缘层（11）的最上面（11）的上表面上的框状形式的第一金属层（2）。 第一金属层（2）含有与第一金属氧化物相比红外线吸收率更高的第二金属氧化物。

公开(公告)号：EP2825012A3

公开(公告)日：2015-04-08

申请号：EP14174760.0

申请日：2014-06-27

Applicant: Samsung Electronics Co., Ltd

Inventor： Jang, Souk-Su ,  Choi, Hyun-Suk

IPC: H05K9/00

CPC classification number: H05K9/0024 ,  H05K9/0028 ,  H05K2201/0707

Abstract: A shielding apparatus includes: a printed circuit board that has a plurality of catching parts; a shield member that covers the printed circuit board; and at least one shield fastening part that is provided in the shield member and is fastened to or separated from the catching parts by a resilient force while not protruding.

公开(公告)号：EP3240387A1

公开(公告)日：2017-11-01

申请号：EP17159483.1

申请日：2017-03-07

Applicant: Harman International Industries, Incorporated

Inventor： AUGER, Elijah ,  OANA, Sabin

IPC: H05K9/00

CPC classification number: H05K1/0216 ,  H01Q1/50 ,  H05K1/111 ,  H05K1/115 ,  H05K7/142 ,  H05K9/0033 ,  H05K9/0039 ,  H05K2201/0707 ,  H05K2201/10098

Abstract: An electronic device including a substrate having opposing top and bottom surfaces is provided. A ground layer is disposed in the substrate. An electrically conductive chassis has a mounting surface to receive the bottom surface of the substrate and is in electrical contact with the ground layer by a ground stitch via. An electromagnetic shield is defined by the ground layer, the ground stitch via and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference. A non-conductive cover is assembled to the substrate in tension so that an interior surface of the cover applies a force to the top surface of the substrate thereby ensuring the chassis maintains in electrical contact with the ground layer.

Abstract translation: 提供了包括具有相对的顶面和底面的基板的电子装置。 接地层设置在基板中。 导电底架具有安装表面以接收基板的底表面并且通过接地线路通孔与接地层电接触。 电磁屏蔽由接地层，接地针脚通孔和底座限定，以封闭基板的​​底表面并保护底表面免受电磁干扰。 不导电的盖在张力下组装到基底上，使得盖的内表面向基底的顶表面施加力，从而确保底座保持与接地层的电接触。

公开(公告)号：EP3157317A1

公开(公告)日：2017-04-19

申请号：EP16158530.2

申请日：2016-03-03

Applicant: Xiaomi Inc.

Inventor： WANG, Dongliang ,  WANG, Shaojie ,  SHI, Shasha

IPC: H05K9/00 ,  H05K7/20

CPC classification number: H05K1/0212 ,  H05K7/20 ,  H05K7/2039 ,  H05K7/20418 ,  H05K7/20427 ,  H05K7/20436 ,  H05K7/20518 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0081 ,  H05K2201/066 ,  H05K2201/0707 ,  H05K2201/10371

Abstract: Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) that are interconnected, wherein the second shielding case body (2) at least partially covers the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).

Abstract translation: 描述的是屏蔽盒，印刷电路板（PCB）和终端设备。 所述屏蔽壳体包括互连的第一屏蔽壳体（1）和第二屏蔽壳体（2），其中所述第二屏蔽壳体（2）至少部分地覆盖所述第一屏蔽壳体（1） 储存材料（3）容纳在第一屏蔽壳体（1）和第二屏蔽壳体（2）之间。

公开(公告)号：EP3131371A2

公开(公告)日：2017-02-15

申请号：EP16180076.8

申请日：2016-07-19

Applicant: InnoSenT GmbH

Inventor： Bäuerlein, Stefan ,  Lenhard, Thilo

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0216 ,  G01S2007/028 ,  H05K1/0218 ,  H05K1/0298 ,  H05K3/0044 ,  H05K2201/048 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2203/0228

Abstract: Die Erfindung betrifft einen Radarsensor (1) mit einer Leiterplatte mit einer elektronischen Schaltung und mit einer Bestückung elektronischer Komponenten und mit einem die Leiterplatte und die darauf angeordnete Bestückung abdeckenden Abschirmdeckel (10, 50), wobei der Abschirmdeckel aus einem Leiterplattenmaterial (11, 51) ausgebildet ist und eine Einbuchtung (12, 52) aufweist, welche Raum für die Aufnahme der Bestückung schafft.

Abstract translation: 本发明涉及一种具有印刷电路板的雷达传感器，该印刷电路板具有电子电路并配有电子部件，并且具有覆盖印刷电路板的屏蔽盖和布置在所述印刷电路板上的设备，其中屏蔽盖是 由印刷电路板材料形成并且具有形成用于容纳设备的空间的凹部。

公开(公告)号：EP2825012A2

公开(公告)日：2015-01-14

申请号：EP14174760.0

申请日：2014-06-27

Applicant: Samsung Electronics Co., Ltd

Inventor： Jang, Souk-Su ,  Choi, Hyun-Suk

IPC: H05K9/00

CPC classification number: H05K9/0024 ,  H05K9/0028 ,  H05K2201/0707

Abstract: A shielding apparatus includes: a printed circuit board that has a plurality of catching parts; a shield member that covers the printed circuit board; and at least one shield fastening part that is provided in the shield member and is fastened to or separated from the catching parts by a resilient force while not protruding.

Abstract translation: 一种屏蔽装置，包括：具有多个捕捉部的印刷电路板; 覆盖印刷电路板的屏蔽部件; 以及至少一个屏蔽固定部件，其设置在屏蔽部件中，并且在不突出的情况下通过弹力与该固定部件固定或分离。

公开(公告)号：EP3366096A1

公开(公告)日：2018-08-29

申请号：EP16791195.7

申请日：2016-10-20

Applicant: THOMSON LICENSING

Inventor： HUNT, Mickey ,  CRAIG, Randy Wayne ,  CORBIN, Theodore Paul ,  TESTIN, William J. ,  DERNIER, William P.

IPC: H05K9/00

CPC classification number: H05K9/006 ,  H05K1/0216 ,  H05K9/0033 ,  H05K2201/0707 ,  H05K2201/09854 ,  H05K2201/10371 ,  H05K2201/2072

Abstract: The present disclosure relates to a printed circuit board assembly including a printed circuit board, a first shielding structure located on a first surface of the printed circuit board and having a first extension element extending from the first shielding structure and through a first hole in the printed circuit board, a second shielding structure located on a second surface of the printed circuit board. According to at least one embodiment on the present disclosure, a first contacting element of the first extension element makes a mechanical and electrical contact between the first shielding structure and the second shielding structure in a contact region entirely located outside the first hole from which the first extension element is extending through.

公开(公告)号：EP3363272A1

公开(公告)日：2018-08-22

申请号：EP16790783.1

申请日：2016-10-12

Applicant: Google LLC

Inventor： COOPER, James ,  LILJE, Joshua Norman

IPC: H05K9/00 ,  H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/373 ,  H01L23/427 ,  H01L23/552 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0323 ,  H05K2201/064 ,  H05K2201/0707 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.