公开(公告)号：EP3366092A1

公开(公告)日：2018-08-29

申请号：EP16785149.2

申请日：2016-10-21

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： GROBER, Gernot ,  LIEBFAHRT, Sabine ,  GAVAGNIN, Marco

IPC: H05K3/46 ,  H05K1/18

CPC classification number: H05K3/4614 ,  H05K1/0237 ,  H05K1/0271 ,  H05K1/14 ,  H05K1/185 ,  H05K3/36 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/086 ,  H05K2201/09136 ,  H05K2201/09163

Abstract: A method of manufacturing a component carrier is disclosed. The method includes providing a first component carrier body having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, providing a second component carrier body having at least one second electrically insulating layer structure and at least one second electrically conductive layer structure, providing at least a part of at least one of the first component carrier body and the second component carrier body of an at least partially uncured material, and interconnecting the first component carrier body with the second component carrier body by curing the at least partially uncured material.

公开(公告)号：EP3007342A1

公开(公告)日：2016-04-13

申请号：EP15186376.8

申请日：2015-09-23

Applicant: International Rectifier Corporation

Inventor： Cho, Eung San ,  Ribarich, Thomas J. ,  Fernando, Dean ,  Moody, Kevin ,  Park, Dae Keun ,  Cheah, Chuan

IPC: H02M3/145 ,  H05K1/14

CPC classification number: H05K7/1092 ,  H02M3/145 ,  H05K1/117 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048

Abstract: In one implementation, an insertable power unit for plugging into a mother board includes a power module situated on a substrate, and a mounting contact on an extended side of the substrate away from the power module. The mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contact is configured to provide electrical connection between the power module and the mother board.

Abstract translation: 在一个实施方案中，用于插入母板的可插入动力单元包括位于基板上的功率模块和远离功率模块的基板的延伸侧上的安装触点。 安装触头通过在基板中的电路径电耦合到功率模块。 安装触点被配置为在电源模块和母板之间提供电连接。

公开(公告)号：EP2560466A4

公开(公告)日：2015-05-06

申请号：EP11768652

申请日：2011-01-26

Applicant: FURUKAWA ELECTRIC CO LTD ,  FURUKAWA AUTOMOTIVE SYS INC

Inventor： HARA TOSHITAKA ,  HASHIMOTO KYOSUKE ,  NOJI KIYONOBU ,  ABE KYUTARO ,  FUKAI HIROYUKI ,  TAKAHASHI NAOMI

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00

CPC classification number: H05K1/183 ,  H05K1/0271 ,  H05K1/141 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/1003

公开(公告)号：EP2461227A2

公开(公告)日：2012-06-06

申请号：EP11191292.9

申请日：2011-11-30

Applicant: ASUSTeK Computer Inc.

Inventor： Hu, Angus ,  Chiu, Hui-Wen ,  Lin, San-Feng

IPC: G06F1/18

CPC classification number: G06F1/185 ,  H05K1/142 ,  H05K2201/048 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: An electronic device includes a motherboard, a connector, a expansion card and a housing. The motherboard includes an opening. The connector is disposed at the motherboard and at one side of the opening. The expansion card is inserted to the connector in order to be placed in the opening and coplanar with the motherboard. The motherboard, the connector and the expansion card are in the housing.

Abstract translation: 电子设备包括主板，连接器，扩展卡和外壳。 主板包括一个开口。 连接器设置在主板和开口的一侧。 将扩展卡插入连接器以便放置在开口中并与主板共面。 主板，连接器和扩展卡位于外壳中。

公开(公告)号：EP2392200A1

公开(公告)日：2011-12-07

申请号：EP10704613.8

申请日：2010-02-01

Applicant: Tyco Electronics Corporation

Inventor： SMEJTEK, Dalibor, J.

IPC: H05K3/36

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10484

Abstract: A printed circuit assembly (10) includes a base printed circuit (12) having a printed circuit receiving area (29) and a plurality of electrical contacts provided on the printed circuit receiving area (30). The printed circuit assembly also includes a secondary printed circuit (14) having a secondary substrate (54) including a mating edge (46) and a plurality of secondary contacts (70) provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.

公开(公告)号：EP2277242B1

公开(公告)日：2011-09-07

申请号：EP09741951.9

申请日：2009-04-02

Applicant: Robert Bosch GmbH

Inventor： SEIBOLD, Jochen ,  ECKERT, Bernd

IPC: H01R24/60 ,  H05K3/30 ,  H05K3/36 ,  H05K7/14

CPC classification number: H05K1/141 ,  H01R12/52 ,  H01R12/728 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10303 ,  H05K2201/1059 ,  Y10T29/49117

Abstract: The invention relates to connection of a plug connector comprising: a plug connector strip (10, 110), a primary circuit board (20, 120) with connections and an intermediate circuit board (30, 130).  The plug connector strip comprises a group of single plug connector elements which extent at an angle to the intermediate circuit board (30, 130) and are attached thereto.  The intermediate circuit board (30, 130) extends at an angle to the primary circuit board (20, 120) and is attached thereto.  The individual plug connector elements are electrically connected to the junctions via the intermediate circuit board (30, 130).  The invention further relates to a method for production of a connection of a plug connector.  A plug connector strip (10, 110), a primary circuit board (20, 120) with junctions and an intermediate circuit board (30, 130) are provided.  A group of individual plug connector elements is arranged as plug connector strip (10, 110); the plug connector strip (10, 110) is attached to the intermediate circuit board (30, 130), wherein individual plug connector elements extend perpendicular to the intermediate circuit board (30, 130); electrical contacts between the intermediate circuit board (30, 130) and the plug connector strip (10, 110) are produced and the intermediate circuit board (30, 130) is attached to the primary circuit board (20, 120), wherein the intermediate circuit board (30, 130) extends perpendicular to the primary circuit board (20, 120).  The method further comprises: Production of electric contacts between the primary circuit board (20, 120) and the intermediate circuit board (30, 130).

Abstract translation: 本发明涉及一种插头连接器的连接，包括：插头连接器带（10,110），具有连接的主电路板（20,120）和中间电路板（30,130）。 插头连接器条带包括一组单插头连接器元件，其与中间电路板（30,130）成一定角度并与其连接。 中间电路板（30,130）相对于主电路板（20,120）以一定角度延伸并附接到主电路板（20,120）。 各个插塞连接器元件经由中间电路板（30,130）电连接到接点。 本发明还涉及一种用于制造插头连接器的连接的方法。 提供插头连接器条（10,110），具有接合部的主电路板（20,120）和中间电路板（30,130）。 一组单独的插头连接器元件布置为插头连接器条（10,110）; 所述插头连接器条带（10,110）附接到所述中间电路板（30,130），其中单独的插头连接器元件垂直于所述中间电路板（30,130）延伸; 在中间电路板（30,130）和插头连接器条带（10,110）之间产生电接触并且中间电路板（30,130）附接到主电路板（20,120），其中中间电路板 电路板（30,130）垂直于主电路板（20,120）延伸。 该方法还包括：在主电路板（20,120）和中间电路板（30,130）之间产生电接触。

公开(公告)号：EP1909545A3

公开(公告)日：2009-05-06

申请号：EP07117064.1

申请日：2007-09-24

Applicant: Deere & Company

Inventor： Livdahl, Richard J ,  Hawk, Nathan M ,  Johnston, Travis L ,  Segal, Vincent G ,  Wyland, Amanda R ,  Janssen, Dale A ,  Duppong, Jeffrey S

IPC: H05K3/30 ,  H05K7/14

CPC classification number: H05K3/366 ,  H05K3/301 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10598 ,  H05K2201/10606

Abstract: A circuit board carrier (20) for mounting a first printed circuit board (12) in relation to a second printed circuit board (16) comprises:
a flat base (36) for abutting said second circuit board (16);
a pair of wings (38) on laterally opposite sides of said base (36), each said wing (38) including a snap-in feature (44) for snap engagement with a corresponding hole (46) in said second circuit board (16); and
at least one slot guide (40) for retaining a lateral edge of said first printed circuit board (12).

公开(公告)号：EP1971193A1

公开(公告)日：2008-09-17

申请号：EP07005449.9

申请日：2007-03-16

Applicant: HÜTTINGER Elektronik GmbH + Co. KG

Inventor： Kirchmeier, Thomas ,  Knaus, Hanns-Joachim

IPC: H05K1/16

CPC classification number: H05K1/165 ,  H01F27/2804 ,  H01F41/043 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/086

Abstract: Ein Leiterplattenbauteil (14) weist auf: wenigstens ein erstes Leiterplattenelement (6), das ein dielektrisches Substrat (11) mit mindestens einer auf diesem Substrat angeordneten ersten Leiterbahn (12.1, 12.2) umfasst, an dem mindestens ein geschlossenes einteiliges Magnetfeld verstärkendes Element (13.1-13.4) angeordnet ist, das die erste Leiterbahn (12.1, 12.2) zumindest abschnittweise umgibt; und wenigstens ein zweites Leiterplattenelement (1), das ein dielektrisches Substrat mit mindestens einer Aussparung (3.1-3.4), die zum Einstecken des ersten Leiterplattenelements (6) ausgebildet ist, und mit mindestens einer auf diesem Substrat angeordneten, sich bis zu der Aussparung erstreckenden zweiten Leiterbahn umfasst; wobei das erste und das zweite Leiterplattenelement (6, 1) so ineinander gesteckt sind, dass die erste Leiterbahn (12.1, 12.2) die zweite Leiterbahn ergänzt.

Abstract translation: 该组件具有印刷电路板元件（6），该电路板元件（6）包括布置在基板上的导体路径（12.1,12.2）的电介质基板（11）。 铁氧体磁芯（13.1-13.4）布置在导体路径上。 另一个印刷电路板元件（1）具有另一电介质基片，其具有设计用于插入印刷电路板元件（6）的凹槽（3.1-3.4）。 两个印刷电路板元件彼此粘合，使得两个导体路径相互补充。 印刷电路板部件的制造方法也包含独立的权利要求。

公开(公告)号：EP0917992B1

公开(公告)日：2003-09-10

申请号：EP98402914.0

申请日：1998-11-24

Applicant: VALEO ELECTRONIQUE

Inventor： Boucheron, Jean-Louis ,  Fargues, Emmanuel

IPC: B60R16/02

CPC classification number: B60R16/02 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09645

公开(公告)号：EP1056319A3

公开(公告)日：2003-02-12

申请号：EP00109876.3

申请日：2000-05-10

Applicant: SEW-EURODRIVE GMBH & CO.

Inventor： Rusnak, Reinhold

IPC: H05K3/36

CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2203/0455

Abstract: Tochterplatine (2) zum Einsetzen in eine Mutterplatine (1), wobei mindestens eine Lötverbindung (21) zwischen Tochterplatine (2) und Mutterplatine (1) besteht, wobei die Tochterplatine (2) mindestens zwei Zungen (4) aufweist, die in Bohrlöcher (5) der Mutterplatine (1) einsetzbar sind.