MULTILAYER CERAMIC CAPACITOR
    1.
    发明公开

    公开(公告)号:EP4428883A2

    公开(公告)日:2024-09-11

    申请号:EP24161319.9

    申请日:2024-03-05

    摘要: A multilayer ceramic capacitor having a thickness smaller than a width thereof includes: a ceramic main body including first and second surfaces opposite to each other in a first direction, third and fourth surfaces opposite to each other in a second direction, fifth and sixth surfaces opposite to each other in a third direction: a first cover layer including a first dummy electrode pattern adjoining to an internal electrode closest to the fifth surface among the plurality of first and second internal electrodes; and a second cover layer including a second dummy electrode pattern adjoining to an internal electrode closest to the sixth surface among the plurality of first and second internal electrodes.

    NEW HIGH-VOLTAGE CERAMIC BUS SUPPORT CAPACITOR FOR AUTOMOBILE INVERTER

    公开(公告)号:EP4394830A1

    公开(公告)日:2024-07-03

    申请号:EP22909314.1

    申请日:2022-08-11

    摘要: This invention relates to the field of high-voltage ceramic capacitors and discloses a new high-voltage ceramic bus supporting capacitor for automotive inverter, the bus supporting capacitor includes a positive busbar, a negative busbar, and several high-voltage ceramic capacitors; the positive busbar integrates a busbar positive network and several positive busbar interface ports are arranged on one side of the positive network; the negative busbar integrates a busbar negative network and several negative busbar interface ports are arranged on one side of the negative busbar; the negative busbar interface ports are staggered with the positive busbar interface ports and are both used to connect half-bridge SiC module or multilayer composite busbar; all the high-voltage ceramic capacitors are evenly spaced between the positive busbar and the negative busbar, and positive terminals of the high-voltage ceramic capacitors are connected to the positive busbar and join the busbar positive network, and negative terminals are connected to the negative busbar and join the busbar negative network; there is a heat dissipation fluid between adjacent high-voltage ceramic capacitors. This invention can effectively increase space utilization and eliminate the need to consider safety distance and creepage distance between solder pads.

    BOX AND ELECTRONIC DEVICE
    10.
    发明公开

    公开(公告)号:EP4322190A1

    公开(公告)日:2024-02-14

    申请号:EP23191150.4

    申请日:2023-08-11

    摘要: This application provides a box and an electronic device. The box includes a box body, a cover, and a plurality of explosion venting assemblies The box body has an opening. The cover seals the opening of the box body, so that enclosed space is formed inside the box body. The plurality of explosion venting assemblies are disposed at spacings in a circumferential direction along an edge of the opening of the box body. Each explosion venting assembly includes a fastener and a sleeve covering the fastener. The fastener is configured to fasten the cover and the box body, and fit with the box body and the cover to press against the sleeve. The sleeve has critical buckling load. The explosion venting assemblies of the box utilize a linear buckling property of the sleeves. When the box experiences an explosion, after the cover is separated from the box body for explosion venting, the opening of the box body can be re-sealed, so that there is no opening or only a quite small opening between the cover and the box body. This improves explosion-proof performance of the box, reduces a probability of personal injury when the box experiences an explosion, and improves safety of using the box.