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    Thermally-curable heat-conductive silicone grease composition
    46.
    发明专利
    Thermally-curable heat-conductive silicone grease composition 有权
    热固性导热硅油组合物

    公开(公告)号：JP2013227374A

    公开(公告)日：2013-11-07

    申请号：JP2012098765

    申请日：2012-04-24

    Applicant: Shin-Etsu Chemical Co Ltd ,  信越化学工業株式会社

    Inventor： MATSUMOTO NOBUAKI ,  YAMADA KUNIHIRO ,  TSUJI KENICHI

    IPC: C08L83/07 ,  C08K3/36 ,  C08K9/06 ,  C08L83/05 ,  C08L83/06

    CPC classification number: C10M169/044 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08K3/36 ,  C08K5/56 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L83/00 ,  C08L83/04 ,  C10M2201/05 ,  C10M2201/06 ,  C10M2229/041 ,  C10M2229/0435 ,  C10M2229/047 ,  C10N2250/10

    Abstract: PROBLEM TO BE SOLVED: To provide a thermally-curable heat-conductive silicone grease composition which has high shape retention characteristics even in an early stage when the viscosity of the composition is low (the composition is easily applied), and which becomes soft (having low hardness) after being cured.SOLUTION: A thermally-curable heat-conductive silicone grease composition includes: (A) an organopolysiloxane having viscosity of 100 to 100,000 mPa s at 25°C and containing at least one alkenyl group per molecule; (B) an organopolysiloxane represented by general formula (1); (C) an organohydrogenpolysiloxane containing at least two hydrogen atoms each directly bound to a silicon atom per molecule; (D) a catalyst selected from a group consisting of platinum and platinum compounds; (F) a heat-conductive filler having heat conductivity of 10 W/m °C or more; and (G) silica fine powder, as essential components.

    Abstract translation: 要解决的问题：为了提供即使在组合物的粘度低（组合物容易涂布）的情况下，即使在早期阶段也具有高形状保持特性的可热固化的导热硅油组合物，并且变软（具有 低硬度）。溶解性：可热固化的导热硅脂组合物包括：（A）在25℃下粘度为100至100,000mPa·s且每分子含有至少一个烯基的有机聚硅氧烷; （B）由通式（1）表示的有机聚硅氧烷; （C）每分子含有至少两个氢原子直接键合到硅原子上的有机氢聚硅氧烷; （D）选自铂和铂化合物的催化剂; （F）导热性为10W / m℃以上的导热性填料; 和（G）二氧化硅细粉，作为必要成分。

    Heat conductive silicone grease composition and a cured product thereof
    49.
    发明专利
    Heat conductive silicone grease composition and a cured product thereof 有权

    公开(公告)号：JP4634891B2

    公开(公告)日：2011-02-23

    申请号：JP2005238019

    申请日：2005-08-18

    Applicant: 信越化学工業株式会社

    Inventor： 敬 三好 ,  邦弘 山田 ,  弘明 木崎 ,  晃洋 遠藤

    IPC: C08L83/07 ,  C08K3/08 ,  C08K5/5419 ,  C08K7/00 ,  C08L83/05 ,  C08L83/06 ,  C09K5/08 ,  H01L23/36

    CPC classification number: H01L23/3737 ,  C10M169/04 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/053 ,  C10M2201/061 ,  C10M2229/041 ,  C10M2229/0415 ,  C10M2229/044 ,  C10M2229/046 ,  C10N2210/01 ,  C10N2210/03 ,  C10N2210/07 ,  C10N2210/08 ,  C10N2220/082 ,  C10N2230/02 ,  H01L2224/32245 ,  Y10T428/31663

    Abstract: Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 µm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.

    Film composition for sliding member
    50.
    发明专利
    Film composition for sliding member 有权
    用于滑动构件的薄膜组合物

    公开(公告)号：JP2010280879A

    公开(公告)日：2010-12-16

    申请号：JP2009222795

    申请日：2009-09-28

    Applicant: Akurosu Kk ,  アクロス株式会社

    Inventor： MAKINO MAKOTO ,  MIYAMOTO KEISHI ,  MATSUO SACHIKO

    IPC: C10M169/04 ,  C10M103/06 ,  C10M107/38 ,  C10M125/08 ,  C10M149/18 ,  C10M171/06 ,  C10N10/12 ,  C10N20/00 ,  C10N20/06 ,  C10N30/00 ,  C10N30/06 ,  C10N40/02 ,  C10N50/08

    CPC classification number: C10M125/00 ,  C10M141/00 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/062 ,  C10M2201/065 ,  C10M2201/066 ,  C10M2209/1003 ,  C10M2213/062 ,  C10M2217/0443 ,  C10M2221/0405 ,  C10N2220/082 ,  C10N2230/06 ,  C10N2250/141

    Abstract: PROBLEM TO BE SOLVED: To provide a film composition for a sliding member capable of forming a film capable of keeping good lubricity even in a state exposed in a severe friction condition for a long time.
    SOLUTION: The film composition for the sliding member for forming the film on the surface of the sliding member contains a binder resin, an abrasion-inhibiting material and a solid lubricant. The abrasion-inhibiting material is in a form of plate having an aspect ratio expressed with an average particle size/average particle thickness of 5-100, and the average particle size is ≤15.0 μm and Mohs hardness is ≥6. A content of the solid lubricant is 0-15 pts.wt. to the binder resin of 100 pts.wt. A content of the abrasion-inhibiting material is 1-100 pts.wt. to the binder resin of 100 pts.wt. The solid lubricant may be not compounded. The abrasion-inhibiting material is aluminas preferably.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种即使在长时间在严重的摩擦条件下暴露的状态下能够形成能够保持良好润滑性的膜的滑动构件的膜组合物。 解决方案：用于在滑动构件的表面上形成膜的滑动构件的膜组合物包含粘合剂树脂，耐磨损材料和固体润滑剂。 耐磨损材料为平均粒径/平均粒子厚度为5〜100的长宽比，平均粒径≤15.0μm，莫氏硬度≥6的板状。 固体润滑剂的含量为0-15重量份 到100重量份的粘合剂树脂 耐磨材料的含量为1-100重量份 到100重量份的粘合剂树脂 固体润滑剂可能不复合。 耐磨材料优选为氧化铝。 版权所有（C）2011，JPO＆INPIT

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