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    Junction structure of substrate, and method of joining the substrate
    41.
    发明专利
    Junction structure of substrate, and method of joining the substrate 审中-公开
    基板的结构结构，以及接合基板的方法

    公开(公告)号：JP2010050445A

    公开(公告)日：2010-03-04

    申请号：JP2009166213

    申请日：2009-07-15

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： YAMAZAKI MASAHIRO ,  SHIBATA YASUMASA ,  UEDA YASUO

    IPC: H05K1/14 ,  H05K3/36

    CPC classification number: H05K3/363 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/10484 ,  H05K2201/10606 ,  H05K2203/0195 ,  Y10T428/1241

    Abstract: PROBLEM TO BE SOLVED: To provide a junction structure of substrates and a joining method which can stably join the substrates and achieve high workability during joining. SOLUTION: A second substrate 2 soldered to a first substrate 1 is elastically bent at a bent portion 9. The first substrate 1 is in contact with a portion where a joint 6 on the second substrate 2 is formed, in a direction along which the bending angle of the bent portion 9 increases. In this state, a first joint 5 on the first substrate 1 and the second joint 6 on the second substrate 2 are joined by soldering. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供基板的接合结构和能够稳定地接合基板并在接合期间实现高加工性的接合方法。 焊接到第一基板1的第二基板2在弯曲部分9处弹性弯曲。第一基板1沿着沿着第二基板2的方向与形成有第二基板2的接合部6接触 弯曲部分9的弯曲角度增加。 在该状态下，第一基板1上的第一接头5和第二基板2上的第二接头6通过焊接接合。 版权所有（C）2010，JPO＆INPIT

    Mounting board and electric element with lead
    43.
    发明专利
    Mounting board and electric element with lead 有权
    安装板和电气元件与领导

    公开(公告)号：JP2008244234A

    公开(公告)日：2008-10-09

    申请号：JP2007084112

    申请日：2007-03-28

    Applicant: Sanyo Electric Co Ltd ,  Sanyo Energy Tottori Co Ltd ,  三洋エナジー鳥取株式会社 ,  三洋電機株式会社

    Inventor： YAMASHITA TETSUYA ,  OZAKI HIROTOSHI ,  MORIMOTO AKIKO

    IPC: H01R12/51 ,  H05K1/18 ,  H01M2/10 ,  H01M2/30

    CPC classification number: H01R12/7082 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/09836 ,  H05K2201/10037 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/082

    Abstract: PROBLEM TO BE SOLVED: To solve the problem wherein solder is hidden behind an electrical element in a conventional flat electric element, it is difficult to detach a defective element and rework is difficult as a result, while the defective element is sometimes detached by manual work using a soldering iron, in order to detach a defective mounted element from a printed board and exchange it, after mounting the printed board.
    SOLUTION: A coin-shaped battery 20 with leads is provided with bend parts 22a and 23a by bending the respective two leads 22 and 23 in a direction of crossing main surfaces 21a and 21b, in a region farther inside than the edge of the main surfaces 21a and 21b of a coin-shaped battery 21.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题为了解决在传统的扁平电气元件中将电极隐藏在电气元件后面的问题，难以拆卸有缺陷的元件，结果难以进行返工，而有缺陷的元件有时被分离 通过使用烙铁进行人工操作，以便在安装印刷电路板之后，从印刷电路板上拆下有缺陷的安装元件并进行更换。 解决方案：具有引线的硬币形电池20通过在与主表面21a和21b交叉的方向上相对于两个引线22和23的方向在相对于第二引线22和23的边缘 硬币形电池21的主表面21a和21b。版权所有（C）2009，JPO＆INPIT

    Connection member, electric board, optical scanning device, and image forming device
    45.
    发明专利
    Connection member, electric board, optical scanning device, and image forming device 有权
    连接构件，电子板，光学扫描装置和图像形成装置

    公开(公告)号：JP2008097920A

    公开(公告)日：2008-04-24

    申请号：JP2006276365

    申请日：2006-10-10

    Applicant: Fuji Xerox Co Ltd ,  富士ゼロックス株式会社

    Inventor： SATO KEIICHI ,  YOSHIDA YASUO

    IPC: H01R33/74 ,  G02B26/10 ,  H01S5/022

    CPC classification number: H01R33/09 ,  B41J2/473 ,  G02B26/123 ,  H01R12/7082 ,  H01R12/716 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10651

    Abstract: PROBLEM TO BE SOLVED: To more facilitate connection work for connecting a light source to an electric board. SOLUTION: When the electric board 48 is slid in the direction of an arrow Y2, pins 61a, 61b, 61c hit the vertexes 109 of cross-sectional semicircles of connection pins 108A, 108B, 108C, the pins 61a, 61b, 61c are inserted into the connection pins 108A, 108B, 108C, and the tip parts of the connection pins 108A, 108B, 108C advance along the vertexes 109 and folded. Then, the solder H is made to flow-in from the other end parts of the connection pins 108A, 108B, 108C, and the connection pins 108A, 108B, 108C and the pins 61a, 61b, 61c are fixed to each other by the solder H. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：为了更方便连接光源到电路板的连接工作。 解决方案：当电路板48沿着箭头Y2的方向滑动时，销61a，61b，61c撞击连接销108A，108B，108C的横截面半圆顶点109，销61a，61b， 61c插入到连接销108A，108B，108C中，并且连接销108A，108B，108C的尖端部分沿着顶点109前进并折叠。 然后，使焊料H从连接销108A，108B，108C的另一端部流入，并且连接销108A，108B，108C和销61a，61b，61c彼此固定在一起 焊接H.版权所有（C）2008，JPO＆INPIT

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