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    Head of electric soldering iron
    4.
    发明专利
    Head of electric soldering iron 审中-公开
    电焊铁头

    公开(公告)号：JP2013111653A

    公开(公告)日：2013-06-10

    申请号：JP2012244214

    申请日：2012-11-06

    Applicant: Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi ,  鴻富錦精密工業(深▲セン▼)有限公司 ,  Hon Hai Precision Industry Co Ltd ,  鴻海精密工業股▲ふん▼有限公司

    Inventor： REN GUAN-NAN

    IPC: B23K3/02 ,  B23K101/42 ,  H05K3/34

    CPC classification number: B23K3/0473 ,  B23K1/0016 ,  B23K3/0338 ,  B23K3/0476 ,  B23K2201/42 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/10393 ,  H05K2201/10651 ,  Y02P70/613

    Abstract: PROBLEM TO BE SOLVED: To provide a head of an electric soldering iron which is convenient for use.SOLUTION: The head of an electric soldering iron includes a heat conduction pipe connected to a heat conduction rod of the electric soldering iron, a connection unit fixed to the heat conduction pipe, a first heating block fixed to the connection unit, a second heating block slidably attached to the connection unit, and an operation unit rotatably attached to the connection unit. The operation unit includes a gear, the first heating block includes a first clamping part, the second heating block includes a second clamping part and a plurality of racks to mesh with the gear. When the gear is rotated, the gear meshes with the racks to allow the second heating block to slide relative to the first heating block to thereby adjust the distance between the first clamping part and the second clamping part.

    Abstract translation: 要解决的问题：提供方便使用的电烙铁头。 电烙铁的头部包括连接到电烙铁的导热棒的导热管，固定到导热管的连接单元，固定到连接单元的第一加热块， 可滑动地连接到连接单元的第二加热块和可旋转地附接到连接单元的操作单元。 所述操作单元包括齿轮，所述第一加热块包括第一夹持部，所述第二加热块包括第二夹紧部和与所述齿轮啮合的多个齿条。 当齿轮旋转时，齿轮与齿条啮合，以允许第二加热块相对于第一加热块滑动，从而调节第一夹紧部分和第二夹紧部分之间的距离。 版权所有（C）2013，JPO＆INPIT

    回路基板および電子部品のプリント基板への実装方法
    6.
    发明专利
    回路基板および電子部品のプリント基板への実装方法 有权

    公开(公告)号：JPWO2009090717A1

    公开(公告)日：2011-05-26

    申请号：JP2009549912

    申请日：2008-12-22

    Applicant: 三菱電機株式会社

    Inventor： 城所　仁志 ,  仁志 城所

    IPC: H05K1/18 ,  H05K3/34

    CPC classification number: H05K1/18 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10651 ,  Y10T29/4913

    Abstract: U字フォーミングされたアキシャルリード形状の電子部品をプリント基板に立てて実装する場合に、2つのU字フォーミングされたアキシャルリード形状の電子部品を、互いに同一直線上にないように配置し、それぞれの湾曲した側のリード線の電位が同電位となるように配線パターンを設け、その湾曲した側のリード線を接近させるように各電子部品を傾けておくことで、傾けた方向への電子部品の倒れを、湾曲させた側のリード線でお互いを支え合うことにより、電子部品や基板の放熱性を損なうことなく、また基板の組立性を大きく悪化させること無く、電子部品の倒れを防止することができる。

    Production method for electronic circuit device, and electronic circuit device
    9.
    发明专利
    Production method for electronic circuit device, and electronic circuit device 有权
    电子电路装置的制造方法和电子电路装置

    公开(公告)号：JP2009088352A

    公开(公告)日：2009-04-23

    申请号：JP2007257842

    申请日：2007-10-01

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： SUGIMOTO KEIICHI ,  NAKAGAWA MITSURU

    IPC: H01L21/56

    CPC classification number: H05K3/303 ,  G07C9/00944 ,  H01L2924/1815 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/10037 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49146

    Abstract: PROBLEM TO BE SOLVED: To provide a production method for electronic circuit device which can prevent the non-mounting surface of a circuit board from swelling, when a casing is molded, and to provide an electronic circuit device which is formed by this production method. SOLUTION: As shown in Fig. (a), a circuit component 3, having a protrusion 33 formed on the surface becoming the side of a circuit board 2, is mounted on the circuit board 2 held in the cavity of a die and the tip of the protrusion 33 is substantially brought into point contact with the circuit board 2. As shown in Fig. (b), a gap formed in between the circuit board 2 and the circuit component 3 by the protrusion 33 is filled with resin that serves as a casing 4 and the air can be removed from the gap. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种可以防止电路板的非安装表面膨胀的电子电路装置的制造方法，当壳体被模制时，以及提供一种由此形成的电子电路装置 生产方式。 解决方案：如图1所示。 （a）中，在保持在模具的空腔中的电路板2上安装有形成在电路板2侧的表面上形成的突起33的电路部件3，突起33的前端基本上被 与电路板2接触。 （b）中，通过突起33在电路基板2和电路部件3之间形成的间隙填充有用作壳体4的树脂，并且可以从间隙移除空气。 版权所有（C）2009，JPO＆INPIT

    Electronic component
    10.
    发明专利
    Electronic component 有权

    公开(公告)号：JP3883528B2

    公开(公告)日：2007-02-21

    申请号：JP2003295309

    申请日：2003-08-19

    Applicant: Tdk株式会社

    Inventor： 彰敏 吉井 ,  真範 山本

    IPC: H01G4/228 ,  H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K3/34

    CPC classification number: H01G2/065 ,  H01G4/228 ,  H01G4/232 ,  H05K3/3426 ,  H05K2201/10651 ,  Y02P70/613

    Abstract: An electronic component including: an element (2) having a pair of terminal electrodes (11, 12); and a pair of metal terminals (21, 22) formed of metal materials respectively and connected to the pair of terminal electrodes (11, 12) respectively, characterized in that: a portion of the metal terminal (21, 22) that extends from a base-end side of the metal terminal (21, 22) connectable to an external circuit to face the terminal electrode (11, 12) of the element (2) is an electrode facing portion (21A, 22A); and a tip side portion of the metal terminal (21, 22) in the electrode facing portion (21A, 22A) is connected to the terminal electrode (11, 12), and a gap (S) exists between a base-end side portion of the metal terminal (21, 22) in the electrode facing portion (21A, 22A) and the terminal electrode (11, 12).

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