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    RESIN COMPOSITION AND CURED PRODUCT THEREOF
    41.
    发明专利
    RESIN COMPOSITION AND CURED PRODUCT THEREOF 失效

    公开(公告)号：JPH02187454A

    公开(公告)日：1990-07-23

    申请号：JP809589

    申请日：1989-01-17

    Applicant: DAINIPPON INK & CHEMICALS

    Inventor： SAKAI SHIRO ,  KOMORI AKIRA ,  MITANI TOMOMASA

    IPC: C08L67/06 ,  C08K5/15 ,  C08K5/1565

    Abstract: PURPOSE:To obtain a resin composition capable of suppressing molded product shrinkage without whitening, thus suitable for precision parts. IC sealers, etc., by incorporating a unsaturated polyester or vinyl ester resin with a specific spiro compound. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100 pts.wt., on a solid basis, of a unsaturated polyester or vinyl ester resin 100-600 in unsaturated group equivalent with (B) 10-200 (pref. 30-150) pts.wt. of a spiro compound of the formula (R is H, lower alkyl or phenyl).

    MANUFACTURE OF COMPRESSION-MOLDED MATERIAL
    43.
    发明专利
    MANUFACTURE OF COMPRESSION-MOLDED MATERIAL 失效

    公开(公告)号：JPH0286404A

    公开(公告)日：1990-03-27

    申请号：JP18902089

    申请日：1989-07-24

    Applicant: BAYER AG

    Inventor： EBERUHARUTO KENITSUKU ,  HANSU INMO ZATSUHASU ,  PEETERU KASUPURUTORUKU ,  DONARUDO RIHIYARUTO RARIMERU

    IPC: B27N3/00 ,  B29C43/00 ,  B29K75/00 ,  B29K103/00 ,  C08G18/16 ,  C08J5/18 ,  C08K5/1565 ,  C08L61/10 ,  C08L97/02 ,  C09J175/00

    Abstract: PURPOSE: To easily mold a chipboard or the like by a method wherein a base material such as wood, bark or the like is compression-molded with a polyisocyanate, a compound containing two or more isocyanate-reactive hydrogen atoms and an alkylene carbonate. CONSTITUTION: A binder is prepared by compounding a polyisocyanate (a), a compound (b) containing at least two isocyanate-reactive hydrogen atoms and an alkylene carbonate (c) with one another. This binder is given to a base material in the shape such as granular matters, shavings, chips or the like made of wood, bard, cork, bagasse, straw, flax, bamboo, chaff or the like so as to thermally compress at a temperature such as 70-250 deg.C at a pressure such as 1-150 bar in order to mold a board or a three-dimensionally shaped molding. The preferable vesting amount of the binder to the base material is 0.5-20 wt.%. The preferable compounding of the binder is 10-250 pts.wt. of (b) and of (c) to 100 pts.wt. of (a).

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