利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

342 条记录 (耗时 0.029 秒)

    Semiconductor device
    75.
    发明专利
    Semiconductor device 有权
    半导体器件

    公开(公告)号：JP2014156655A

    公开(公告)日：2014-08-28

    申请号：JP2014033808

    申请日：2014-02-25

    申请人： Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

    发明人： HIZUKA JUNICHI ,  MARUYAMA YOSHIKI ,  SAITO TAKAYUKI ,  IMOTO YUKI ,  UTO NORIAKI ,  ENDO YUTA ,  SATO HITOMI ,  HIROHASHI TAKUYA ,  YAMAZAKI SHUNPEI

    IPC分类号： C23C14/06 ,  G02F1/1343 ,  H01L21/28 ,  H01L21/285 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/532

    CPC分类号： H01B1/02 ,  C23C14/0676 ,  C23C14/3414 ,  C23C14/541 ,  C23C14/5806

    摘要： PROBLEM TO BE SOLVED: To provide a transparent conductive film having favorable transparency and conductivity at low cost, to reduce the resistivity of a transparent conductive film formed using conductive oxynitride including zinc and aluminum, and to provide a transparent conductive film that is formed using conductive oxynitride including zinc and aluminum.SOLUTION: When aluminum and nitrogen are made to be included in a transparent conductive film formed using oxide including zinc to form a transparent conductive film that is formed using conductive oxynitride including zinc and aluminum, the transparent conductive film can have reduced resistivity. Heat treatment after the formation of the transparent conductive film that is formed using conductive oxynitride including zinc and aluminum enables reduction in resistivity of the transparent conductive film.

    摘要翻译： 要解决的问题：为了降低使用包括锌和铝的导电氮氧化物形成的透明导电膜的电阻率，提供了一种透明导电膜，具有良好的透明性和导电性的透明导电膜，并提供使用导电 包括锌和铝的氮氧化物。解决方案：当使用包含锌的氧化物形成的透明导电膜中包含铝和氮以形成使用包括锌和铝的导电氮氧化物形成的透明导电膜时，透明导电膜可以具有 电阻率降低。 在形成使用包括锌和铝的导电氮氧化物形成的透明导电膜之后的热处理使得能够降低透明导电膜的电阻率。

    Substrate carrying apparatus
    77.
    发明专利
    Substrate carrying apparatus 有权
    基板承载装置

    公开(公告)号：JP2014122394A

    公开(公告)日：2014-07-03

    申请号：JP2012279532

    申请日：2012-12-21

    申请人： Kobe Steel Ltd ,  株式会社神戸製鋼所

    发明人： OBA NAOKI ,  TAMAGAKI HIROSHI

    IPC分类号： C23C14/56

    CPC分类号： C23C14/541 ,  C23C14/562 ,  C23C16/466 ,  C23C16/545

    摘要： PROBLEM TO BE SOLVED: To provide a substrate carrying apparatus securing a wide temperature control range for a substrate without deterioration of the substrate carrying quality of improving the heat transfer efficiency in non-contact parts of a substrate and a film formation roll.SOLUTION: A substrate carrying apparatus 2a which is arranged in a film formation apparatus 1 carrying out a film formation treatment on the surface of a substrate W and has a cylindrical or columnar film formation roll 6 carrying the substrate W, and the film formation roll 6 comprises: a central small-diameter portion formed in the central part, in the longitudinal direction along the axial center, of the film formation roll 6 and not coming in contact with the substrate W; and both end large-diameter portions 11a and 11b formed at both ends, in the longitudinal direction, of the central small-diameter portion, coming in contact with the substrate W and rotating around the axial center to carry the substrate W, and has a gas introduction mechanism introducing a gas into a space formed between the substrate W and the central small-diameter portion.

    摘要翻译： 要解决的问题：提供一种确保基板的宽温度控制范围的基板承载装置，而不会降低基板承载质量，从而提高基板和成膜辊的非接触部分中的传热效率。解决方案：A 基板搬送装置2a配置在成膜装置1中，在基板W的表面进行成膜处理，并具有承载基板​​W的圆筒状或圆柱状的成膜辊6，成膜辊6包括： 中心小直径部分形成在成膜辊6的中心部分沿着轴向中心的纵向方向，并且不与基底W接触; 以及形成在中心小直径部分的纵向两端的两端部大直径部分11a和11b与基板W接触并围绕轴向中心旋转以承载基板W，并且具有 气体引入机构将气体引入到形成在基板W和中心小直径部分之间的空间中。

    Roll-to-roll sputtering method
    79.
    发明专利
    Roll-to-roll sputtering method 审中-公开
    滚筒式滚筒式旋转方式

    公开(公告)号：JP2014109073A

    公开(公告)日：2014-06-12

    申请号：JP2013244649

    申请日：2013-11-27

    申请人： Samsung Corning Precision Materials Co Ltd ,  サムスンコーニング精密素材株式会社Samsung Corning Precision Materials Co.,Ltd.

    发明人： OH JUNG HONG ,  AN JIN SOO ,  RIM CHANG MOOG ,  YANG GI-MO ,  OH SANG YOON

    IPC分类号： C23C14/34 ,  C23C14/56 ,  H01B13/00

    CPC分类号： C23C14/086 ,  C23C14/34 ,  C23C14/541 ,  C23C14/562

    摘要： PROBLEM TO BE SOLVED: To provide a roll-to-roll sputtering method which can form a vapor deposited film on a flexible substrate at a high temperature by a sputtering vapor-deposition method.SOLUTION: In a roll-to-roll sputtering method, a flexible substrate wound up by a feed roll is conveyed to a vapor deposition part and a vapor deposited film is formed on the flexible substrate, and then the flexible substrate is wound up by a winding roll. The vapor deposition part includes a first vapor deposition part. The first vapor deposition part includes: a first sputter which deposits a first target substance on one surface of the flexible substrate; and a heater which is arranged on the other surface of the flexible substrate and heats the flexible substrate.

    摘要翻译： 要解决的问题：提供可以通过溅射气相沉积法在高温下在柔性基板上形成气相沉积膜的辊对辊溅射方法。解决方案：在辊对辊溅射法中， 将由进料辊卷绕的柔性基板输送到蒸镀部，在柔性基板上形成气相沉积膜，然后通过卷绕辊卷绕柔性基板。 蒸镀部包括第一蒸镀部。 第一气相沉积部分包括：第一溅射，其在柔性基板的一个表面上沉积第一目标物质; 以及设置在柔性基板的另一表面上并加热柔性基板的加热器。