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71.发明专利
公开(公告)号：JP5430563B2
公开(公告)日：2014-03-05
申请号：JP2010514487
申请日：2009-05-26
Applicant: 三井金属鉱業株式会社
CPC classification number: C09J163/00 , C08G73/14 , C08L63/00 , C08L79/08 , C08L2203/20 , C08L2666/20 , C08L2666/22 , C09J179/08 , H05K1/0393 , H05K3/386 , H05K3/4635 , H05K3/4652 , H05K3/4655 , H05K2201/012 , H05K2201/0154 , H05K2201/0358
Abstract: An object of the present invention is to enable formation of a resin layer which reduces the thickness of a multilayered flexible printed wiring board without causing problems in the process of multilayer forming, and is excellent in flexibility. To achieve the object, a resin compound for forming an adhesive layer of a multilayered flexible printed wiring board which is used for formation of an adhesive layer for bonding an outer layer of a printed wiring board onto a surface of an inner layer flexible printed wiring board, the resin compound is made to comprise components A (an epoxy resin composed of one or more selected from the group consisting of bisphenol epoxy resins of which epoxy equivalents are 200 or less and are liquid at room temperature), B (an epoxy resin performing high thermal resistance), C (a phosphorus-containing flame-retardant epoxy resin), D (a rubber-modified polyamide-imide resin, the resin having the property of being soluble in a solvent having a boiling point in the range of 50 to 200°C), and E (a resin curing agent composed of one or more selected from the group consisting of biphenyl type phenol resin and a phenol aralkyl type phenol resin) and a resin-coated copper foil and the like in which the resin layer is formed by using the resin compound is used.
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72.发明专利
公开(公告)号：JP2014011341A
公开(公告)日：2014-01-20
申请号：JP2012147449
申请日：2012-06-29
Applicant: Jx Nippon Mining & Metals Corp , Jx日鉱日石金属株式会社
Inventor： NAKAMURO KAICHIRO , YOSHIKAWA TAKUMA
CPC classification number: B21B1/40 , B21B3/00 , B32B15/08 , B32B27/281 , B32B2307/412 , B32B2457/08 , C22F1/08 , H05K1/09 , H05K3/022 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358
Abstract: PROBLEM TO BE SOLVED: To provide a rolled copper foil excellently bondable to a resin, and excellent in transparency of the resin after removing a copper foil by etching, and to provide a process of manufacturing the rolled copper foil and a laminate sheet.SOLUTION: The rolled copper foil obtains excellent adhesiveness with a resin and is excellent in transparency of the resin after removing a copper foil by etching by smoothing a surface of the rolled copper foil that is to be a base material applied with roughed plating in such a manner that the 60-degree glossiness G in a direction parallel to the rolling is larger than 500.
Abstract translation: 要解决的问题：提供一种与树脂非常粘合的轧制铜箔，并且通过蚀刻除去铜箔后的树脂的透明度优异，并提供制造轧制铜箔和层压片的工艺。解决方案： 轧制铜箔与树脂具有优异的粘附性，并且通过使作为施加有粗糙电镀的基材的轧制铜箔的表面平滑化而蚀刻除去铜箔后的树脂透明度优异，使得 在与轧制平行的方向上的60度光泽度G大于500。
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公开(公告)号：JP2013237846A
公开(公告)日：2013-11-28
申请号：JP2013132920
申请日：2013-06-25
Applicant: Hitachi Chemical Co Ltd , 日立化成株式会社
Inventor： MATSUURA YOSHITSUGU , OBATA KAZUHITO , TAKEUCHI MASAKI
IPC: C09J7/02 , B32B27/34 , C09J163/00 , C09J175/04 , C09J177/00 , C09J179/08 , H05K1/03 , H05K3/46
CPC classification number: H05K3/4655 , C08G59/4085 , C09J7/29 , C09J163/00 , C09J2467/006 , H05K1/0393 , H05K3/386 , H05K3/4635 , H05K3/4652 , H05K2201/0195 , H05K2201/0358 , Y10T428/266 , Y10T428/269 , Y10T428/28 , Y10T428/2804
Abstract: PROBLEM TO BE SOLVED: To provide an adhesive sheet excellent in bending processability, heat resistance, adhesiveness and circuit-embedding ability, used in production of a multilayer wiring board obtained by multi-stratifying flexible circuit boards.SOLUTION: An adhesive sheet is equipped with a substrate 3 and an adhesive resin layer 4 formed on one surface of the substrate 3, where the adhesive resin layer 4 is a layer with 170-200°C glass transition temperature and 100-300 MPa elastic modulus after curing, contains a siloxane-modified polyamideimide resin therein, and the content of the siloxane-modified polyamideimide resin is 45-70 mass% based on the total solid content of the adhesive resin layer 4.
Abstract translation: 要解决的问题：提供一种在通过多层柔性电路板获得的多层布线板的生产中所使用的弯曲加工性，耐热性，粘附性和电路嵌入能力优异的粘合片。解决方案：粘合片装备有 形成在基板3的一个表面上的基板3和粘合树脂层4，其中粘合树脂层4是具有170-200℃玻璃化转变温度和固化后的100-300MPa弹性模量的层，其包含硅氧烷 - 改性聚酰胺酰亚胺树脂，硅氧烷改性聚酰胺酰亚胺树脂的含量相对于粘合树脂层4的总固体成分为45〜70质量％。
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74.发明专利
公开(公告)号：JP5278785B2
公开(公告)日：2013-09-04
申请号：JP2012555898
申请日：2012-01-31
Applicant: Dic株式会社
IPC: C08G59/40 , C08G73/10 , C08K5/49 , C08K5/53 , C08L63/00 , C09J7/02 , C09J11/06 , C09J163/00 , C09J179/08 , H05K3/38 , H05K3/46
CPC classification number: C09J179/08 , C08G59/4042 , C08G73/1035 , C08G73/1042 , C08G73/14 , C08K5/0066 , C08K5/5313 , C08L63/00 , C08L79/08 , C08L79/085 , C08L2205/02 , C09J7/35 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/08 , H05K3/022 , H05K3/386 , H05K3/4652 , H05K2201/012 , H05K2201/0154 , H05K2201/0358 , Y10T428/2887
Abstract: There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability at low temperature in a semicured state (in the B-stage) and excellent flame resistance in a completely cured state; there are also provided a cured product of such a composition and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film being formed of the composition. In particular, there are provided a thermosetting polyimide resin composition containing a thermosetting polyimide resin (A) having a biphenyl backbone directly linked to a nitrogen atom of a five-membered cyclic imide backbone and a weight-average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) represented by specific Formula (bl) or (b2), and an epoxy resin (C); a cured product of such a composition; and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film including a layer formed of the composition, the layer being formed on a carrier film.
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公开(公告)号：JP5261595B1
公开(公告)日：2013-08-14
申请号：JP2012147449
申请日：2012-06-29
Applicant: Jx日鉱日石金属株式会社
CPC classification number: B21B1/40 , B21B3/00 , B32B15/08 , B32B27/281 , B32B2307/412 , B32B2457/08 , C22F1/08 , H05K1/09 , H05K3/022 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358
Abstract: Provided are: a rolled copper foil that adheres favorably to resin, and is such that the resin transparency is superior after removing the copper foil by means of etching; a method for producing the rolled copper foil; and a laminate plate. In the rolled copper foil, of which the 60° glossiness (G) in the direction parallel to rolling is greater than 500 and no greater than 900, when a 180° tight rolling is performed with the polyimide film surface on the inside of a sample of a one-sided-copper-clad laminate plate having a width of 3-5 mm inclusive and resulting from laminating a copper foil and a polyimide film having a thickness of 25 mum, the number of bending repetitions until the copper foil breaks is at least three.
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Patent Agency Ranking76.发明专利
公开(公告)号：JP5178064B2
公开(公告)日：2013-04-10
申请号：JP2007169204
申请日：2007-06-27
Applicant: 富士フイルム株式会社
Inventor： 志貴 植木
CPC classification number: C23C2/04 , B32B15/08 , B32B15/20 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/32 , B32B27/36 , B32B27/38 , B32B27/42 , B32B2307/202 , B32B2307/206 , B32B2307/704 , B32B2457/08 , C23C28/00 , H05K3/181 , H05K3/384 , H05K3/386 , H05K2201/0179 , H05K2201/0358 , H05K2203/072 , Y10T428/12993
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公开(公告)号：JP5024930B2
公开(公告)日：2012-09-12
申请号：JP2006295614
申请日：2006-10-31
Applicant: 三井金属鉱業株式会社
CPC classification number: H05K3/384 , C25D5/12 , C25D5/34 , C25D5/48 , C25D5/50 , C25D5/56 , C25D7/12 , H05K3/386 , H05K3/389 , H05K2201/0355 , H05K2201/0358 , H05K2203/072 , H05K2203/0723 , Y10T428/265 , Y10T428/27
Abstract: Object of the invention is to provide a surface-treated copper foil comprising a rust-proofing treatment layer without chromium on an electro-deposited copper foil in which the peel strength of the circuits in processing of the printed wiring board and the chemical resistance against to the peel loss and the like are excellent. To achieve the object, the surface-treated copper foil characterized in comprising a rust-proofing treatment layer and a silane coupling agent layer on a bonding surface of an electro-deposited copper foil to an insulating resin substrate wherein the rust-proofing treatment layer is prepared by forming a nickel alloy layer having a thickness by weight of 5 mg/m 2 to 50 mg/m 2 and a tin layer having a thickness by weight of 5 mg/m 2 to 40 mg/m 2 in this order, and the silane coupling agent layer is provided on the rust-proofing treatment layer is employed. Further, a surface-treated copper foil with a very thin primer resin layer characterized by that a very thin primer resin layer having an equivalent thickness of 1 µm to 5 µm is provided on a bonding surface to the insulating resin substrate of the surface-treated copper foil without roughening treatment according to the present invention is employed.
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公开(公告)号：JP4978691B2
公开(公告)日：2012-07-18
申请号：JP2009501289
申请日：2008-02-28
Applicant: 味の素株式会社
CPC classification number: H05K3/025 , B32B37/025 , B32B38/10 , B32B2038/0076 , B32B2311/00 , B32B2457/08 , H05K3/386 , H05K2201/0358 , H05K2203/0264 , H05K2203/0769 , H05K2203/0786 , Y10T428/14 , Y10T428/1438 , Y10T428/1443 , Y10T428/1476 , Y10T428/26 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/266 , Y10T428/269
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公开(公告)号：JP2012515671A
公开(公告)日：2012-07-12
申请号：JP2011547782
申请日：2010-01-22
Applicant: ドゥーサン コーポレイション
IPC: B32B15/088 , B32B15/08
CPC classification number: B32B15/043 , B32B7/02 , B32B7/12 , B32B15/20 , B32B2255/06 , B32B2255/26 , B32B2255/28 , B32B2307/202 , B32B2307/306 , B32B2307/3065 , B32B2307/546 , B32B2307/714 , B32B2307/732 , B32B2457/08 , H05K1/036 , H05K1/0393 , H05K2201/0154 , H05K2201/0358 , Y10T428/24975 , Y10T428/31515
Abstract: Provided are a flexible metal clad laminate including: (a) a first conductive metal foil in which a first polyimide layer is formed on a surface thereof; and (b) a second conductive metal foil in which a second polyimide layer is formed on a surface thereof, wherein the first polyimide layer and the second polyimide layer are joined together by an epoxy adhesive, and a method of manufacturing the same. The inventive flexible metal clad laminate can maintain the intrinsic properties of polyimide, and thus, can exhibit good heat resistance and flexibility to comparable with a conventional two-layer, double-sided flexible copper clad laminate, and a manufacturing process thereof is simple and easy, thus ensuring enhanced productivity and economical effectiveness.
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公开(公告)号：JP4972753B2
公开(公告)日：2012-07-11
申请号：JP2009004838
申请日：2009-01-13
Applicant: サムソン エレクトロ−メカニックス カンパニーリミテッド.
Inventor： キム ウーン−チュン , イ ソン
CPC classification number: H05K3/387 , H05K3/0055 , H05K3/108 , H05K3/381 , H05K3/426 , H05K3/4661 , H05K2201/0358 , H05K2203/1152 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
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