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公开(公告)号：JP3876109B2
公开(公告)日：2007-01-31
申请号：JP2000090509
申请日：2000-03-29
Applicant: 松下電器産業株式会社
CPC classification number: H05K5/068 , H05K3/284 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146
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公开(公告)号：JPWO2006101127A1
公开(公告)日：2008-09-04
申请号：JP2007509301
申请日：2006-03-22
Applicant: 松下電器産業株式会社
CPC classification number: H05K1/095 , C08G59/66 , C08G59/687 , C08K5/37 , C09J163/00 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/0224 , H05K2203/122
Abstract: 保存安定性が高く、かつ、所望の場合に硬化し、好ましくは速やかに低温硬化する導電性接合材料を提供する。1つの発明では、導電性接合材料は、導電性粒子成分、エポキシ樹脂成分、及びエポキシ樹脂硬化性成分を含んでなり、エポキシ樹脂硬化性成分がチオール基を有する改質剤を更に含むことを特徴とする。もう1つの発明では、導電性接合材料において、エポキシ樹脂硬化性成分は金属粒子の表面に配位する末端基を有する含硫黄化合物を含んでおり、該末端基が金属粒子の表面から脱離することによって、前記含硫黄化合物はエポキシ樹脂の硬化作用を示すようになることを特徴とする。導電性接合材料は、香気成分を含むこともできる。
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公开(公告)号：JP3529657B2
公开(公告)日：2004-05-24
申请号：JP2883299
申请日：1999-02-05
Applicant: 松下電器産業株式会社
CPC classification number: H01L2224/16238 , H01L2224/73103 , H01L2224/73204 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To avoid the use of an expensive anisotropic conduction sheet by arranging thermoplastic synthetic resin sheets on both sides of a thermoplastic synthetic resin substrate to which a semiconductor element is fitted and pressurizing them while they are being heated. SOLUTION: Antenna coil patterns 3 and circuit patterns 2 are printed on the surface of a thermoplastic synthetic resin substrate 1 by using conduction paste. An adhesive 4 is applied on the opposite face of the substrate 1. The electrode parts 6 of a semiconductor element 5 face the circuit patterns 2 across the substrate 1 and they are positioned. Conduction paste and adhesive 4 are cured. Reversible synthetic resin sheets 7 and 8 are arranged on both faces of the substrate 1. They are sandwiched by metallic molds 9A and 9B and they are thermally pressed while they are heated. At that time, the electrode parts 6 touch the circuit patterns 2 but the pressure and time of thermal press are controlled so that the end face of the semiconductor element 5 does not touch the circuit patterns 2. Thus, the electrodes 6 pass through the substrate 1, they electrically touch the circuit patterns 2 and a card is completed.
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Patent Agency Ranking
公开(公告)号：JP3891743B2
公开(公告)日：2007-03-14
申请号：JP26539599
申请日：1999-09-20
Applicant: 松下電器産業株式会社
CPC classification number: H01L2224/73204 , H01L2924/19105
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公开(公告)号：JP3681907B2
公开(公告)日：2005-08-10
申请号：JP31255398
申请日：1998-11-02
Applicant: 松下電器産業株式会社
IPC: H05K3/32 , C09J9/02 , C09J163/00
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公开(公告)号：JP4179736B2
公开(公告)日：2008-11-12
申请号：JP2000212613
申请日：2000-07-13
Applicant: 松下電器産業株式会社
IPC: B42D15/10 , H01L21/56 , G06K19/07 , G06K19/077 , H01L23/12
CPC classification number: H01L24/96 , H01L2224/13 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2924/15787 , H01L2924/00 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor element package which is thin and has a high quality and a high productivity and a method for manufacturing an electronic parts module using it, a method for manufacturing a non-contact IC card, and a semiconductor element package using the manufacturing methods. SOLUTION: Bumps 4 and 4A are formed on the element electrode 5 of a semiconductor element 3, and a thermoplastic resin sheet 7a is aligned with the semiconductor element 3, and then the resin sheet 7a and semiconductor element 3 are pressed thermally to melt the resin sheet 7a, so that a thermoplastic resin 7 covering a part other than the end face 9 of the bump of the semiconductor element 3 is formed. After the thermal pressing, the thermoplastic resin is cut off.
Abstract translation: 要解决的问题：提供一种薄且具有高质量和高生产率的半导体元件封装的制造方法及其使用的电子部件模块的制造方法，非接触式IC卡的制造方法， 以及使用该制造方法的半导体元件封装。 解决方案：在半导体元件3的元件电极5上形成凸起4和4A，并且热塑性树脂片7a与半导体元件3对准，然后将树脂片7a和半导体元件3热压以熔化树脂 从而形成覆盖半导体元件3的凸块的端面9以外的部分的热塑性树脂7。 热压后，热塑性树脂被切断。
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