Abstract:
PROBLEM TO BE SOLVED: To provide a focused ion beam device 100 capable of forming an accurate observation image even when a relative position between an ion beam barrel 10 and a sample 2 is fluctuated.SOLUTION: A charged particle beam device includes a laser interferometer 50 which detects a relative position between an ion beam barrel 10 and a sample 2. An image forming part 31 includes: an irradiation position specification part which specifies the irradiation position of ion beams based on the detected relative position between the ion beam barrel 10 and the sample 2; and a brightness setting part which sets brightness of an observation image pixel based on the specified irradiation position of the ion beams and the detected amount of secondary particles.
Abstract:
PROBLEM TO BE SOLVED: To provide a focused ion beam device which efficiently carries out fine patterning with less damage to a sample by using a gas field ionization ion source.SOLUTION: A focused ion beam device includes a gas field ionization ion source having: an emitter 41 for emitting an ion beam 1; an ion source chamber 40 for housing the emitter 41; a gas supply part 46 for supplying nitrogen to the ion source chamber 40; an extraction electrode 49 for applying an extraction voltage to ionize and extract nitrogen ions; and a temperature control part 34 for cooling the emitter 41.
Abstract:
PROBLEM TO BE SOLVED: To provide a focused ion beam device which can produce an ion current stably regardless of the termination structure at the tip of an emitter, and to provide an irradiation method of a focused ion beam.SOLUTION: A focused ion beam device 1 includes an emitter 10 having a sharpened tip, an ion source chamber 20 housing the emitter, a gas supply section 11 for supplying gas having ionization energy lower than that of helium to the ion source chamber 20, and an extraction power supply 15 for producing gas ions by ionizing gas at the tip of an emitter 10, by applying an extraction voltage between the emitter 10 and an extraction electrode 14, and then extracting the gas ions to the extraction electrode 14 side. The extraction power supply 15 applies an extraction voltage so that the number of the bright spot of a field ion image in an ion beam emitted from the emitter 10 is one.
Abstract:
PROBLEM TO BE SOLVED: To enable obtaining a broad FIM image at an end of an emitter and perform broad FIM observation.SOLUTION: A conversing ion beam apparatus comprises: a gas electric field ionizing ion source 10; an ion gun portion 11 that accelerates gas ions toward a sample S and irradiates the sample S with the accelerated gas ions as an ion beam 3A; a beam optical system 12 that includes at least a conversing lens electrode 35 and irradiates the sample S with the ion beam 3A while conversing it; and an image acquiring mechanism 14 that acquire FIM images at an end of the emitter 20. The image acquiring mechanism 14 includes: an alignment electrode 32 that adjusts an ion beam irradiation direction; an alignment controller 46 that applies an alignment voltage on the alignment electrode 32; a storage unit 45 that stores the acquired FIM images; and an image processing unit 47 that creates one combined FIM image by mutually combining, among the FIM images stored in the storage unit 45, plural FIM images acquired when different alignment voltages are applied.
Abstract:
PROBLEM TO BE SOLVED: To provide an emitter that can have a crystal structure at its topmost end put back into the original state with good reproducibility by re-arraying of atoms by treatment, can suppress a rise in lead voltage after retreatment, and can be used for a long period.SOLUTION: There is provided a method of manufacturing an emitter that includes: an electrolytic polishing step S10 of electrolytically polishing a tip portion of an emitter raw material so that the diameter gradually decreases toward the tip; a first etching step S20 of forming a pyramidal pointed portion having a tip as a peak by performing etching processing by irradiating a processed portion of the emitter raw material with a charge particle beam; a second etching step S30 of making the tip more pointed through electric field induction gas etching processing while observing the crystal structure atop of the pointed portion through an electric field ion microscope, and making the number of atoms constituting the topmost end constant or less; and a heating step S40 of heating the emitter raw material to array the atoms constituting the topmost end of the pointed portion in a pyramidal state.