Abstract:
PROBLEM TO BE SOLVED: To provide a focused ion beam device which efficiently carries out fine patterning with less damage to a sample by using a gas field ionization ion source.SOLUTION: A focused ion beam device includes a gas field ionization ion source having: an emitter 41 for emitting an ion beam 1; an ion source chamber 40 for housing the emitter 41; a gas supply part 46 for supplying nitrogen to the ion source chamber 40; an extraction electrode 49 for applying an extraction voltage to ionize and extract nitrogen ions; and a temperature control part 34 for cooling the emitter 41.
Abstract:
PROBLEM TO BE SOLVED: To provide a focused ion beam apparatus which enables the shortening of a down time for replacement of an emitter and the increase in operation rate.SOLUTION: A focused ion beam apparatus comprises: an ion source room 10 in which an emitter 11 capable of emitting an ion beam is provided; a focused ion beam barrel 20 for focusing and directing the ion beam emitted by the ion source room 10; a preliminary chamber 30 whose inside communicates to inside the focused ion beam barrel 20 through a first communicating hole 21; a pump 35 for the preliminary chamber for evacuating the preliminary chamber 30 to create a vacuum; an on-off valve 40 for opening and closing the first communicating hole 21; and a transport device 45 for transporting the ion source room 10 to inside the focused ion beam barrel 20 and the preliminary chamber 30 through the first communicating hole 21.
Abstract:
PROBLEM TO BE SOLVED: To provide a focused ion beam device 100 capable of forming an accurate observation image even when a relative position between an ion beam barrel 10 and a sample 2 is fluctuated.SOLUTION: A charged particle beam device includes a laser interferometer 50 which detects a relative position between an ion beam barrel 10 and a sample 2. An image forming part 31 includes: an irradiation position specification part which specifies the irradiation position of ion beams based on the detected relative position between the ion beam barrel 10 and the sample 2; and a brightness setting part which sets brightness of an observation image pixel based on the specified irradiation position of the ion beams and the detected amount of secondary particles.
Abstract:
PROBLEM TO BE SOLVED: To enable obtaining a broad FIM image at an end of an emitter and perform broad FIM observation.SOLUTION: A conversing ion beam apparatus comprises: a gas electric field ionizing ion source 10; an ion gun portion 11 that accelerates gas ions toward a sample S and irradiates the sample S with the accelerated gas ions as an ion beam 3A; a beam optical system 12 that includes at least a conversing lens electrode 35 and irradiates the sample S with the ion beam 3A while conversing it; and an image acquiring mechanism 14 that acquire FIM images at an end of the emitter 20. The image acquiring mechanism 14 includes: an alignment electrode 32 that adjusts an ion beam irradiation direction; an alignment controller 46 that applies an alignment voltage on the alignment electrode 32; a storage unit 45 that stores the acquired FIM images; and an image processing unit 47 that creates one combined FIM image by mutually combining, among the FIM images stored in the storage unit 45, plural FIM images acquired when different alignment voltages are applied.
Abstract:
PROBLEM TO BE SOLVED: To provide an emitter that can have a crystal structure at its topmost end put back into the original state with good reproducibility by re-arraying of atoms by treatment, can suppress a rise in lead voltage after retreatment, and can be used for a long period.SOLUTION: There is provided a method of manufacturing an emitter that includes: an electrolytic polishing step S10 of electrolytically polishing a tip portion of an emitter raw material so that the diameter gradually decreases toward the tip; a first etching step S20 of forming a pyramidal pointed portion having a tip as a peak by performing etching processing by irradiating a processed portion of the emitter raw material with a charge particle beam; a second etching step S30 of making the tip more pointed through electric field induction gas etching processing while observing the crystal structure atop of the pointed portion through an electric field ion microscope, and making the number of atoms constituting the topmost end constant or less; and a heating step S40 of heating the emitter raw material to array the atoms constituting the topmost end of the pointed portion in a pyramidal state.