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    Double-sided copper-clad laminate for forming capacitor layer and manufacturing method thereof
    3.
    发明专利
    Double-sided copper-clad laminate for forming capacitor layer and manufacturing method thereof 有权
    用于形成电容层的双面铜箔层压板及其制造方法

    公开(公告)号：JP2003039595A

    公开(公告)日：2003-02-13

    申请号：JP2001228850

    申请日：2001-07-30

    申请人： Mitsui Mining & Smelting Co Ltd ,  三井金属鉱業株式会社

    发明人： KUWAKO FUJIO ,  YAMAZAKI KAZUHIRO ,  MATSUSHIMA TOSHIFUMI

    IPC分类号： B32B15/08 ,  H01G4/18 ,  H05K1/03 ,  H05K1/16 ,  H05K3/00 ,  H05K3/38

    CPC分类号： H05K1/162 ,  B32B15/08 ,  B32B2305/74 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/16 ,  H01G4/18 ,  H05K3/384 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/0307

    摘要： PROBLEM TO BE SOLVED: To provide a double-sided copper-clad laminate for forming a capacitor layer which has an insulating layer showing excellent properties of withstand voltage without short-circuiting even when a voltage is impressed between copper leaf surfaces and beside not being destructed by a showering pressure on the occasion of etching. SOLUTION: The double-sided copper-clad laminate for forming the capacitor layer has a constitution wherein copper leaf layers being conductors are provided for outer layers on the opposite sides and a resin layer to be a dielectric is held between the copper leaf layers. The resin layer has a three-layer structure constituted of a thermosetting resin layer, a heat-resistant film layer and the thermosetting resin layer and the total thickness thereof is 25 μm or below. The thermosetting resin layer is constituted of an epoxy resin material, while the heat-resistant film layer has dry characteristics of a Young's modulus of 300 kg/mm or above, a tensile strength of 20 kg/mm or above and a tensile modulus of elongation of 5% or above and has a softening temperature higher than a molding temperature of the thermosetting resin constituting the thermosetting resin layers positioned on the opposite sides. This film layer is constituted of the resin material having a relative dielectric constant of 2.5 or above.

    摘要翻译： 要解决的问题：为了提供一种用于形成电容器层的双面覆铜层压板，即使当在铜箔表面之间施加电压并且不被破坏时，其绝缘层显示出优异的耐电压性能而没有短路 通过蚀刻时的沉重压力。 解决方案：用于形成电容器层的双面覆铜层压板具有其相对侧的外层设置有作为导体的铜箔层，作为电介质的树脂层保持在铜箔层之间的结构。 树脂层具有由热固性树脂层，耐热膜层和热固性树脂层构成的三层结构，其总厚度为25μm以下。 热固性树脂层由环氧树脂材料构成，耐热膜层的杨氏模量为300kg / mm 2以上的干燥特性，拉伸强度为20kg / mm 2以上 拉伸伸长率为5％以上，软化温度高于构成相对侧的热固性树脂层的热固性树脂的成型温度。 该膜层由相对介电常数为2.5以上的树脂材料构成。