Abstract:
A hybrid substrate having a high-mobility surface for use with planar and/or multiple-gate metal oxide semiconductor field effect transistors (MOSFETs) is provided. The hybrid substrate has a first surface portion that is optimal for n-type devices, and a second surface portion that is optimal for p-type devices. Due to proper surface and wafer flat orientations in each semiconductor layers of the hybrid substrate, all gates of the devices are oriented in the same direction and all channels are located on the high mobility surface. The present invention also provides for a method of fabricating the hybrid substrate as well as a method of integrating at least one planar or multiple-gate MOSFET thereon.
Abstract:
A semiconductor device of the present invention is provided with a power device which has a semiconductor substrate having a first main surface and a second main surface that are opposed to each other and an insulating gate structure on the first main surface side, wherein a main current flows between the first main surface and the second main surface, that is to say, is provided with an insulating gate type MOS transistor structure wherein the thickness (t1) of the semiconductor substrate is no less than 50 mu m and no greater than 250 mu m and a low ON voltage and a high withstanding capacity against breakdown are implemented in the first main surface. Thereby, a low ON voltage, the maintaining of the withstanding capacity against breakdown and the reduction of a switching loss on the high voltage side can be implemented.
Abstract:
PROBLEM TO BE SOLVED: To provide a MOSFET switch suitable for use as a synchronous rectifier in a power converter.SOLUTION: An N-channel power MOSFET with its source and body connected together and biased at a high positive voltage with respect to its drain is fabricated. A gate is controlled by a switch (1184) which selectively connects the gate to the source or to a voltage (VCP) enough to turn a channel of the MOSFET fully on. When the gate is connected to the source, the device functions as a "pseudo-Schottky" diode which turns on at a lower voltage and has a lower conductor resistance than a conventional PN junction. When the gate is connected to the positive voltage the channel of the MOSFET is turned fully on. This MOSFET switch reduces power loss and stored charge in the "break-before-make" time.