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    접합 방법, 컴퓨터 기억 매체, 접합 장치 및 접합 시스템
    2.
    发明公开
    접합 방법, 컴퓨터 기억 매체, 접합 장치 및 접합 시스템 审中-实审
    结合方法和计算机存储介质和接合装置和接合系统

    公开(公告)号：KR1020130030223A

    公开(公告)日：2013-03-26

    申请号：KR1020120102006

    申请日：2012-09-14

    申请人： 도쿄엘렉트론가부시키가이샤

    发明人： 데구찌마사또시 ,  시라이시마사또시 ,  오까다신지

    IPC分类号： H01L21/02 ,  H01L21/683

    CPC分类号： H01L21/6715 ,  B32B38/0036 ,  B32B2038/1891 ,  B32B2309/02 ,  B32B2309/62 ,  B32B2457/14 ,  B32B2457/20 ,  H01L21/187 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68742

    摘要： PURPOSE: A bonding method, a computer storage medium, a bonding apparatus, and a bonding system are provided to improve a bonding throughput of a support wafer and a target wafer by constantly maintaining a temperature of a heating device. CONSTITUTION: After an adhesive is coated on a target wafer(A1), the target wafer is heated at a preset temperature(A2). The target wafer is located on the upper side of a first maintaining unit in a bonding part of a bonding apparatus. The target wafer is preheated by a heating device of the first maintaining unit(A4). A support wafer is preheated by a thermal process plate in a preheating unit of the bonding apparatus(A8). A target substrate and a support substrate are absorbed and maintained in the first maintaining unit and a second maintaining unit. The target substrate is bonded to the support substrate by compressing the second maintaining unit to the first maintaining unit when each substrate is heated by the heating device of each maintaining unit(A13). [Reference numerals] (A1) Applying adhesive on a processing target wafer; (A10) Adjusting positions in the horizontal direction of the processing target wafer and the supporting wafer; (A11) Adjusting positions in the vertical direction of processing target wafer and supporting wafer; (A12) Bonding the processing target wafer and the supporting wafer together; (A13) Joining the processing target wafer and the supporting wafer together; (A2) Heating the processing target wafer to a predetermined temperature; (A3) Adjusting orientation in the horizontal direction of the processing target wafer; (A4) Preheating the processing target wafer; (A5) Mounting the processing target wafer on a first holding unit; (A6) Adjusting orientation in the horizontal direction of a supporting wafer; (A7) Reversing front and rear surfaces of the supporting wafer; (A8) Preheating the supporting wafer; (A9) Holding the supporting wafer on a second holding unit

    摘要翻译： 目的：提供接合方法，计算机存储介质，接合装置和接合系统，以通过恒定地保持加热装置的温度来提高支撑晶片和目标晶片的结合生产率。 构成：在目标晶片（A1）上涂布粘合剂后，将目标晶片加热到预设温度（A2）。 目标晶片位于接合装置的接合部中的第一保持单元的上侧。 目标晶片由第一维持单元（A4）的加热装置预热。 支撑晶片由粘合装置（A8）的预热单元中的热处理板预热。 目标基板和支撑基板被吸收并保持在第一维持单元和第二维持单元中。 当每个基板被每个保持单元（A13）的加热装置加热时，通过将第二维持单元压缩到第一保持单元，将目标基板结合到支撑基板。 （A1）将粘合剂涂布在加工对象晶片上; （A10）处理对象晶片和支撑晶片的水平方向的调整位置; （A11）调整加工对象晶片和支撑晶片的垂直方向的位置; （A12）将处理目标晶片和支撑晶片结合在一起; （A13）将处理目标晶片和支撑晶片连接在一起; （A2）将处理目标晶片加热至规定温度; （A3）调整处理对象晶片的水平方向的取向; （A4）预处理目标晶片; （A5）将处理目标晶片安装在第一保持单元上; （A6）调整支撑晶片的水平方向的方向; （A7）反转支撑晶片的前表面和后表面; （A8）预热支撑晶片; （A9）将支撑晶片保持在第二保持单元上

    점착척 및 이를 가진 기판합착장치
    5.
    发明授权
    점착척 및 이를 가진 기판합착장치 有权
    一种用于组装具有相同基板的粘合块和装置

    公开(公告)号：KR100855461B1

    公开(公告)日：2008-09-01

    申请号：KR1020070092491

    申请日：2007-09-12

    申请人： 인베니아 주식회사

    发明人： 황재석

    IPC分类号： G02F1/13

    CPC分类号： B32B37/0046 ,  B32B37/12 ,  B32B38/18 ,  B32B38/1833 ,  B32B38/1858 ,  B32B2038/1891 ,  B32B2309/68 ,  B32B2457/202 ,  G02F1/1303 ,  G02F2001/133354 ,  G02F2202/28 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1744 ,  Y10T156/19

    摘要： An adhesive chuck and a substrate attaching apparatus having the same are provided to attach a substrate at a low cost by using adhesive rubbers, thereby reducing a manufacturing cost. A first chamber(100) has a first table(101) where a first substrate(S1) is mounted. A second chamber(200) is spaced from the first chamber, and has a second table(201) where a second substrate(S2) attached with the first substrate is mounted. An adhesive module is installed in the first table, and has plural adhesive rubbers for attaching the first substrate. A lifting member(131) lifts at least one or more of the adhesive modules.

    摘要翻译： 提供了一种粘合剂卡盘和具有该粘合剂卡盘的基片连接装置，通过使用粘合剂橡胶以低成本附着基板，从而降低制造成本。 第一室（100）具有安装有第一基板（S1）的第一工作台（101）。 第二腔室（200）与第一腔室间隔开，并且具有安装有第一衬底的第二衬底（S2）的第二工作台（201）。 粘合剂组件安装在第一工作台中，并且具有用于安装第一衬底的多个粘合橡胶。 提升构件（131）提升至少一个或多个粘合剂模块。

    프레스 장치
    6.
    发明公开
    프레스 장치 有权
    用于制造粘结基板的装置

    公开(公告)号：KR1020080075477A

    公开(公告)日：2008-08-18

    申请号：KR1020080072618

    申请日：2008-07-25

    申请人： 후지쯔 가부시끼가이샤

    发明人： 하시즈메고지 ,  미야지마요시마사 ,  하타노노리히코 ,  가도와키데츠지

    IPC分类号： G02F1/13

    CPC分类号： G02F1/1339 ,  B32B37/12 ,  B32B37/18 ,  B32B38/1841 ,  B32B2037/1253 ,  B32B2038/1891 ,  B32B2310/0806 ,  B32B2457/20 ,  B32B2457/202 ,  G02F1/1341 ,  G02F2001/133354 ,  G02F2001/13415 ,  Y10T29/49776 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T156/17 ,  Y10T156/1798

    摘要： A bonded substrate manufacturing apparatus is provided to enable pressure within suction pipes to be the same as pressure within a chamber, thereby preventing omission and displacement of substrates. First and second support plates respectively support first and second substrates and are disposed to face each other. At least one of the first and second support plates has a suction surface where suction channels(77a,77b) for sucking and supporting the first and second substrates by back pressure are opened. Valves(82a,82b) are installed in isobaric pipes(81a,81b) for connecting the suction channels with an inner space of a treatment chamber. A control device controls the valve so as for the back pressure to be almost the same pressure as pressure within the treatment chamber when converting environment under atmosphere pressure into environment under decompression.

    摘要翻译： 提供了一种键合衬底制造装置，以使吸入管内的压力与室内的压力相同，从而防止衬底的遗漏和位移。 第一支撑板和第二支撑板分别支撑第一和第二基板并且彼此相对配置。 第一支撑板和第二支撑板中的至少一个具有抽吸表面，其中用于通过背压吸引和支撑第一和第二基板的抽吸通道（77a，77b）被打开。 阀（82a，82b）安装在用于将吸入通道与处理室的内部空间连接的等压管（81a，81b）中。 控制装置控制阀，使得当将大气压下的环境转化为减压环境时，背压与处理室内的压力几乎相同。

    접합 기판 제조 시스템
    7.
    发明公开
    접합 기판 제조 시스템 有权
    用于制造粘结基板的系统

    公开(公告)号：KR1020080075472A

    公开(公告)日：2008-08-18

    申请号：KR1020080072584

    申请日：2008-07-25

    申请人： 후지쯔 가부시끼가이샤

    发明人： 하시즈메고지 ,  미야지마요시마사 ,  하타노노리히코 ,  가도와키데츠지

    IPC分类号： G02F1/13

    CPC分类号： G02F1/1339 ,  B32B37/12 ,  B32B37/18 ,  B32B38/1841 ,  B32B2037/1253 ,  B32B2038/1891 ,  B32B2310/0806 ,  B32B2457/20 ,  B32B2457/202 ,  G02F1/1341 ,  G02F2001/133354 ,  G02F2001/13415 ,  Y10T29/49776 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T156/17 ,  Y10T156/1798

    摘要： A bonding substrate manufacturing system is provided to measure the amount of displacement of substrates of an LC panel and perform correction of positioning in a presses device based on the measurement result. An LC(Liquid Crystal) drop unit(33) drops LC to at least one of first and second substrates(W1,W2) to bond the first and second substrate. A press unit bonds the first and second substrates by using a sealant including at least photocurable adhesive within a pressure-reduced processing chamber. A substrate curing unit(37) cures the sealant by irradiating light to the sealant of the bonded first and second substrate. A detection unit detects the amount of displacement of the bonded first and second substrate after the sealant is cured.

    摘要翻译： 提供一种接合基板制造系统，用于测量LC面板的基板的位移量，并基于测量结果执行压印设备中的定位校正。 液晶（液晶）液滴单元（33）将LC降到第一和第二基板（W1，W2）中的至少一个，以接合第一和第二基板。 按压单元通过使用至少包含可光固化的粘合剂的密封剂在减压处理室内粘合第一和第二基板。 基板固化单元（37）通过向结合的第一和第二基板的密封剂照射光来固化密封剂。 检测单元检测在密封剂固化之后粘合的第一和第二基底的位移量。

    감광성 적층체의 제조 장치 및 제조 방법
    8.
    发明公开
    감광성 적층체의 제조 장치 및 제조 방법 无效
    用于制造感光层压体的装置和方法

    公开(公告)号：KR1020080050498A

    公开(公告)日：2008-06-05

    申请号：KR1020087009158

    申请日：2006-09-22

    申请人： 후지필름 가부시키가이샤

    发明人： 이모토켄이치 ,  모리료

    IPC分类号： B32B37/22 ,  B32B38/18 ,  G03F7/16

    CPC分类号： B32B38/18 ,  B32B37/223 ,  B32B38/10 ,  B32B2038/1891 ,  B32B2309/14 ,  B32B2457/08

    摘要： While a photosensitive web (22) is fed at a low speed (V1), a partial cutting mechanism (36) forms partially cut regions (34) in the photosensitive web (22), and a label bonding mechanism (40) applies adhesive labels (38) to the photosensitive web (22). After an inter-substrate web cutting mechanism (48) cuts the photosensitive web (22) between two adjacent substrates (24), an applying mechanism (46) applies the photosensitive web (22) to a glass substrate (24) using heat and pressure while the photosensitive web (22) and the glass substrate (24) are fed at a high speed (V2), thereby producing an applied substrate (24a).

    摘要翻译： 当感光幅材（22）以低速（V1）供给时，部分切割机构（36）在感光幅材（22）中形成部分切割的区域（34），并且标签粘合机构（40）施加粘合标签 （38）到感光卷筒纸（22）。 在基板间卷筒纸切割机构（48）在两个相邻的基板（24）之间切割感光幅材（22）之后，施加机构（46）使用热和压力将感光幅材（22）施加到玻璃基板（24） 而感光网（22）和玻璃基板（24）以高速（V2）进给，从而产生施加的基板（24a）。

    감광성 적층체의 제조장치 및 제조방법
    9.
    发明公开
    감광성 적층체의 제조장치 및 제조방법 无效
    制造感光层压体的方法及方法

    公开(公告)号：KR1020080038019A

    公开(公告)日：2008-05-02

    申请号：KR1020070106537

    申请日：2007-10-23

    申请人： 후지필름 가부시키가이샤

    发明人： 나카기리마사유키 ,  시미즈마코토 ,  와타나베야스히사 ,  수에하라카즈요시

    IPC分类号： B32B37/20

    CPC分类号： B32B2038/1891 ,  B32B37/20 ,  B32B37/0053 ,  B32B41/00

    摘要： A photosensitive laminate manufacturing apparatus and a method are provided to detect the attachment state of a photosensitive material layer for a substrate at high precision easily by detecting the end of the substrate and a processed part of a long photosensitive web attached on the substrate. In a photosensitive laminate manufacturing apparatus(20), long photosensitive webs(22a,22b) formed by laminating a photosensitive material layer and a protection film(30) on a support body in order are delivered. A processed part corresponding to a boundary between the peeled part and the left part is formed on the protection film. The peeled part of the protection film is separated and continuously delivered to a gap of a pair of heated press rollers together with substrates(24) supplied at regular intervals. The left part of the protection film is disposed between the substrates. And then, the exposed photosensitive material layer is attached to the substrate. The photosensitive laminate manufacturing apparatus comprises a detection unit installed at the lower side of the press roller to detect the end of the substrate and the processed part of the long photosensitive web attached on the substrate and a distance calculating unit computing distance between the end of the substrate and the processed part.

    摘要翻译： 提供感光层压体制造装置和方法，通过检测基板的端部和附着在基板上的长感光纤维的加工部分，容易地高精度地检测基板用感光材料层的附着状态。 在感光层叠体制造装置（20）中，顺序地将感光材料层和保护膜（30）层叠在支承体上而形成的长感光性卷筒纸（22a，22b）。 在保护膜上形成对应于剥离部分和左部分之间的边界的加工部分。 保护膜的剥离部分被分离并连续地传送到一对加热的压辊的间隙以及以规则间隔提供的基底（24）。 保护膜的左侧部分设置在基板之间。 然后，曝光的感光材料层附着在基板上。 感光层压板制造装置包括安装在压辊下侧的检测单元，用于检测基材的端部和附着在基材上的长感光纤维的加工部分，以及距离计算单元， 底物和加工部分。