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Patent Agency Ranking
公开(公告)号：TW201505146A
公开(公告)日：2015-02-01
申请号：TW103106520
申请日：2014-02-26
Applicant: 新加坡賀利氏材料私人有限公司 , HERAEUS MATERIALS SINGAPORE PTE., LTD.
Inventor： 周泳慧 , CHEW, YEONG HUEY , 莎蘭葛帕尼 穆拉利 , SARANGAPANI, MURALI , 麥可 尤金 , MILKE, EUGEN
CPC classification number: H01L24/43 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05624 , H01L2224/05644 , H01L2224/4312 , H01L2224/4321 , H01L2224/4382 , H01L2224/43848 , H01L2224/43985 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45664 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48644 , H01L2224/48824 , H01L2224/48844 , H01L2224/85099 , H01L2224/85205 , H01L2924/00011 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/01047 , H01L2924/01015 , H01L2924/01203 , H01L2924/01201 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20109 , H01L2924/00014 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/01204 , H01L2924/01202 , H01L2924/013 , H01L2924/00013 , H01L2924/00015 , H01L2924/00 , H01L2924/2011 , H01L2924/00012 , H01L2924/01005 , H01L2924/01033 , H01L2924/01034
Abstract: 本發明係關於接合線，其包含具有表面之核心，其中該核心包含銅作為主要組份；及疊加於該核心之該表面上之塗覆層，其中該塗覆層包含鈀作為主要組份，其中該核心包含至少5ppm銀及至少20ppm磷作為其他組份，其中該線滿足關係0.0008
Abstract in simplified Chinese: 本发明系关于接合线，其包含具有表面之内核，其中该内核包含铜作为主要组份；及叠加于该内核之该表面上之涂覆层，其中该涂覆层包含钯作为主要组份，其中该内核包含至少5ppm银及至少20ppm磷作为其他组份，其中该线满足关系0.0008
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公开(公告)号：TW201505147A
公开(公告)日：2015-02-01
申请号：TW103106538
申请日：2014-02-26
Applicant: 新加坡賀利氏材料私人有限公司 , HERAEUS MATERIALS SINGAPORE PTE., LTD.
Inventor： 周泳慧 , CHEW, YEONG HUEY , 莎蘭葛帕尼 穆拉利 , SARANGAPANI, MURALI , 麥可 尤金 , MILKE, EUGEN
CPC classification number: C22C9/00 , C22C5/04 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05624 , H01L2224/05644 , H01L2224/4312 , H01L2224/4321 , H01L2224/4382 , H01L2224/43848 , H01L2224/43985 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45664 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48644 , H01L2224/48824 , H01L2224/48844 , H01L2224/85099 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/01047 , H01L2924/01015 , H01L2924/013 , H01L2924/00013 , H01L2924/01203 , H01L2924/01201 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20109 , H01L2924/00015 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/01204 , H01L2924/01202 , H01L2924/00 , H01L2924/2011 , H01L2224/45099 , H01L2924/00012 , H01L2924/01005 , H01L2924/01033 , H01L2924/01034
Abstract: 本發明係關於接合線，其包含具有表面之核心，其中該核心包含銅作為主要組份；及疊加於該核心之該表面上之塗覆層，其中該塗覆層包含鈀作為主要組份，其中該核心包含至少5ppm銀及至少20ppm磷作為其他組份，其中該線滿足關係 0.000025
Abstract in simplified Chinese: 本发明系关于接合线，其包含具有表面之内核，其中该内核包含铜作为主要组份；及叠加于该内核之该表面上之涂覆层，其中该涂覆层包含钯作为主要组份，其中该内核包含至少5ppm银及至少20ppm磷作为其他组份，其中该线满足关系 0.000025
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公开(公告)号：TW201504460A
公开(公告)日：2015-02-01
申请号：TW103115651
申请日：2014-04-30
Applicant: 新加坡賀利氏材料私人有限公司 , HERAEUS MATERIALS SINGAPORE PTE., LTD.
Inventor： 莎蘭葛帕尼 穆拉利 , SARANGAPANI, MURALI , 楊平熹 , YEUNG, PING HA , 麥可 尤金 , MILKE, EUGEN
CPC classification number: H01B5/02 , C22C9/00 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/745 , H01L2224/05624 , H01L2224/05644 , H01L2224/4321 , H01L2224/43985 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48824 , H01L2224/48844 , H01L2224/85205 , H01L2224/859 , H01L2924/00011 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H05K1/0213 , H05K1/111 , H01L2924/01047 , H01L2924/00015 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/01028 , H01L2924/01046 , H01L2924/01079 , H01L2924/01078 , H01L2924/01024 , H01L2924/0102 , H01L2924/01058 , H01L2924/01012 , H01L2924/01057 , H01L2924/01013 , H01L2924/01005 , H01L2924/0104 , H01L2924/01022 , H01L2924/01015 , H01L2924/01016 , H01L2924/01026 , H01L2924/01025 , H01L2924/00014 , H01L2224/43848 , H01L2924/01204 , H01L2924/01203 , H01L2924/01029 , H01L2924/01014 , H01L2924/013 , H01L2924/00 , H01L2924/00013 , H01L2924/01004 , H01L2924/00012 , H01L2924/01033
Abstract: 本發明係關於包括具有表面之核心之接合線，其中該核心包括銅作為主要組份，其中該核心中之晶粒之平均大小係介於2.5μm與30μm之間，且其中該接合線之屈服強度係小於120MPa。
Abstract in simplified Chinese: 本发明系关于包括具有表面之内核之接合线，其中该内核包括铜作为主要组份，其中该内核中之晶粒之平均大小系介于2.5μm与30μm之间，且其中该接合线之屈服强度系小于120MPa。
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公开(公告)号：TWI512121B
公开(公告)日：2015-12-11
申请号：TW103115651
申请日：2014-04-30
Applicant: 新加坡賀利氏材料私人有限公司 , HERAEUS MATERIALS SINGAPORE PTE., LTD.
Inventor： 莎蘭葛帕尼 穆拉利 , SARANGAPANI, MURALI , 楊平熹 , YEUNG, PING HA , 麥可 尤金 , MILKE, EUGEN
CPC classification number: H01B5/02 , C22C9/00 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/745 , H01L2224/05624 , H01L2224/05644 , H01L2224/4321 , H01L2224/43985 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48824 , H01L2224/48844 , H01L2224/85205 , H01L2224/859 , H01L2924/00011 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H05K1/0213 , H05K1/111 , H01L2924/01047 , H01L2924/00015 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/01028 , H01L2924/01046 , H01L2924/01079 , H01L2924/01078 , H01L2924/01024 , H01L2924/0102 , H01L2924/01058 , H01L2924/01012 , H01L2924/01057 , H01L2924/01013 , H01L2924/01005 , H01L2924/0104 , H01L2924/01022 , H01L2924/01015 , H01L2924/01016 , H01L2924/01026 , H01L2924/01025 , H01L2924/00014 , H01L2224/43848 , H01L2924/01204 , H01L2924/01203 , H01L2924/01029 , H01L2924/01014 , H01L2924/013 , H01L2924/00 , H01L2924/00013 , H01L2924/01004 , H01L2924/00012 , H01L2924/01033
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公开(公告)号：TW201505112A
公开(公告)日：2015-02-01
申请号：TW103106523
申请日：2014-02-26
Applicant: 新加坡賀利氏材料私人有限公司 , HERAEUS MATERIALS SINGAPORE PTE., LTD.
Inventor： 周泳慧 , CHEW, YEONG HUEY , 莎蘭葛帕尼 穆拉利 , SARANGAPANI, MURALI , 麥可 尤金 , MILKE, EUGEN
CPC classification number: C22C9/00 , B23K35/0261 , B23K35/0266 , B23K35/302 , B23K35/322 , B32B15/018 , C22C1/02 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05624 , H01L2224/05644 , H01L2224/4312 , H01L2224/4321 , H01L2224/4382 , H01L2224/43848 , H01L2224/43985 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45664 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48644 , H01L2224/48824 , H01L2224/48844 , H01L2224/85099 , H01L2224/85205 , H01L2924/00011 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/013 , H01L2924/00013 , H01L2924/01015 , H01L2924/01047 , H01L2924/01203 , H01L2924/01201 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20109 , H01L2924/00015 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/01204 , H01L2924/01202 , H01L2924/00 , H01L2924/2011 , H01L2924/00012 , H01L2924/01005 , H01L2924/01033
Abstract: 本發明係關於接合線，其包含具有表面之核心，其中該核心包含銅作為主要組份，及疊加於該核心之該表面上之塗覆層，其中該塗覆層包含鈀作為主要組份，其中該核心包含銀及磷作為其他組份，其中該核心之銀含量與磷含量之間之比係在0.03至2之範圍內。
Abstract in simplified Chinese: 本发明系关于接合线，其包含具有表面之内核，其中该内核包含铜作为主要组份，及叠加于该内核之该表面上之涂覆层，其中该涂覆层包含钯作为主要组份，其中该内核包含银及磷作为其他组份，其中该内核之银含量与磷含量之间之比系在0.03至2之范围内。
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