Heat dissipating device
    2.
    发明授权
    Heat dissipating device 有权
    散热装置

    公开(公告)号:US09342110B2

    公开(公告)日:2016-05-17

    申请号:US13300132

    申请日:2011-11-18

    Abstract: A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.

    Abstract translation: 散热装置包括支撑部,多个第一散热片和多个第二散热片。 第一翅片在支撑部分处以垂直阵列设置。 第二散热片以支撑部分倾斜排列。 所述第一散热片和所述第二散热片相互交错设置和相邻。 提高散热片的热交换效率,提高散热装置的散热效率。

    Heat dissipating module and heat dissipating method thereof
    4.
    发明授权
    Heat dissipating module and heat dissipating method thereof 有权
    散热模块及其散热方法

    公开(公告)号:US09087804B2

    公开(公告)日:2015-07-21

    申请号:US13463828

    申请日:2012-05-04

    Abstract: A heat dissipating module disposed between a plurality of heating elements is provided. The heat dissipating module includes a plurality of heat conducting units, a set of heat dissipating fins, a plurality of fans, a plurality of sensing units and a control unit. The heat conducting units are connected to the set of the heat dissipating fins and the heating elements. A gap exists between the heat conducting units. The fans are disposed at the same side of the set of the heat dissipating fins. The sensing units are coupled to the heating elements, respectively, to detect the heat generated by the heating elements. The control unit is electrically connected to the fans and the sensing units. The heat generated by the heating elements is different from each other, and the control unit adjusts the speed of the fans according to the heat generated by the heating elements.

    Abstract translation: 设置在多个加热元件之间的散热模块。 散热模块包括多个导热单元,一组散热翅片,多个风扇,多个感测单元和控制单元。 导热单元连接到散热片和加热元件组上。 导热单元之间存在间隙。 风扇设置在散热片组的同一侧。 感测单元分别耦合到加热元件,以检测由加热元件产生的热量。 控制单元电连接到风扇和感测单元。 由加热元件产生的热量彼此不同,并且控制单元根据由加热元件产生的热调节风扇的速度。

    NEAR FIELD COMMUNICATION MOBILE DEVICE AND NAVIGATION DEVICE COMMUNICATION SYSTEM
    5.
    发明申请
    NEAR FIELD COMMUNICATION MOBILE DEVICE AND NAVIGATION DEVICE COMMUNICATION SYSTEM 审中-公开
    近场通信移动设备和导航设备通信系统

    公开(公告)号:US20150120182A1

    公开(公告)日:2015-04-30

    申请号:US14588797

    申请日:2015-01-02

    Applicant: Cheng-Yu WANG

    Inventor: Cheng-Yu WANG

    CPC classification number: G01C21/362

    Abstract: A mobile device and navigation device communication system utilizing near field communication to easily capture and transfer address data and simplify programming of the navigation device is disclosed. When a mobile device receives a text message a mobile navigation communication application determines if there is an address included in the text message and if found extracts the address and encodes the address. The user then places the mobile device in close proximity to the navigation device and the data exchange is performed via near field communication. After the data exchange is complete the navigation device decodes the data into the address and searches its database to find an address match. The navigation device then displays the address for the user to confirm. After confirmation the navigation device displays the route or driving directs from the user's current location to the destination address.

    Abstract translation: 公开了一种使用近场通信的移动设备和导航设备通信系统来容易地捕获和传送地址数据并简化导航设备的编程。 当移动设备接收到文本消息时,移动导航通信应用程序确定是否存在包含在文本消息中的地址,并且如果找到,则提取地址并对该地址进行编码。 然后,用户将移动设备放置在靠近导航设备并且通过近场通信执行数据交换。 数据交换完成后,导航设备将数据解码成地址,并搜索其数据库以查找地址匹配。 然后,导航设备将显示用户确认的地址。 确认后,导航设备显示路线或从用户当前位置到目的地地址的直接驾驶。

    Heat-dissipating module
    6.
    发明授权
    Heat-dissipating module 有权
    散热模块

    公开(公告)号:US08953319B2

    公开(公告)日:2015-02-10

    申请号:US13562636

    申请日:2012-07-31

    Applicant: Cheng-Yu Wang

    Inventor: Cheng-Yu Wang

    Abstract: A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure.

    Abstract translation: 公开了一种应用于具有电子元件的电路板的散热模块。 散热模块包括多个连接部分,接触部分和折叠部分。 散热模块通过连接部与电路基板连接,接触部的第一面与电子元件接触。 折叠部分连接到接触部分。 散热模块适用于薄型轻型电子设备,结构坚固。

    Backlight module
    7.
    发明授权
    Backlight module 有权
    背光模组

    公开(公告)号:US08746946B2

    公开(公告)日:2014-06-10

    申请号:US13471435

    申请日:2012-05-14

    CPC classification number: F21V7/04 G02B6/0011 G02B6/002

    Abstract: A backlight module including a light guide plate and a light source is provided. The light guide plate has a light incident surface, a light reflection surface, a first side surface and a second side surface. The light incident surface is connected to the second side surface. The reflection surface is connected between the first side surface and the light incident surface. The first and the second side surfaces are two planes with their extending planes intersected. The light incident surface is a chamfering plane connected between the first and the second side surfaces. The light reflection surface is a cambered surface connected between the first side surface and the light incident surface. The light source is disposed next to the light incident surface, so as to transmit light into the light guide plate through the light incident surface.

    Abstract translation: 提供了包括导光板和光源的背光模块。 导光板具有光入射面,光反射面,第一侧面和第二侧面。 光入射表面连接到第二侧表面。 反射面连接在第一侧面和光入射面之间。 第一和第二侧表面是两个平面,它们的延伸平面相交。 光入射表面是连接在第一和第二侧表面之间的倒角平面。 光反射表面是连接在第一侧表面和光入射表面之间的弧形表面。 光源设置在光入射表面附近,以便通过光入射表面将光透射到导光板中。

    Complex circuit board and fabrication method thereof
    8.
    发明授权
    Complex circuit board and fabrication method thereof 有权
    复杂电路板及其制造方法

    公开(公告)号:US08641260B2

    公开(公告)日:2014-02-04

    申请号:US13053536

    申请日:2011-03-22

    Abstract: A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced.

    Abstract translation: 公开了一种复杂的电路板,包括用于提供光源的驱动信号的印刷电路板组件(PCBA)和柔性印刷电路(FPC)。 PCBA包括支撑部分和连接部分。 光源设置在支撑部分的上方。 连接部分与FPC的接触部分电接触。 FPC的接触部分具有固定孔。 PCBA的连接部分具有固定部分。 此外,FPC在接触部分上具有两个或两个以上的第一弯曲部分。 PCBA的固定部分插入到FPC的固定孔中,以完成复杂的电路板,而无需额外的附接单元。 因此,简化组装过程以增加生产量并降低成本。

    HEAT-DISSIPATING MODULE
    9.
    发明申请
    HEAT-DISSIPATING MODULE 有权
    散热模块

    公开(公告)号:US20130039011A1

    公开(公告)日:2013-02-14

    申请号:US13562636

    申请日:2012-07-31

    Applicant: Cheng-Yu WANG

    Inventor: Cheng-Yu WANG

    Abstract: A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure.

    Abstract translation: 公开了一种应用于具有电子元件的电路板的散热模块。 散热模块包括多个连接部分,接触部分和折叠部分。 散热模块通过连接部与电路基板连接,接触部的第一面与电子元件接触。 折叠部分连接到接触部分。 散热模块适用于薄型轻型电子设备,结构坚固。

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