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公开(公告)号：US20070036952A1
公开(公告)日：2007-02-15
申请号：US11381528
申请日：2006-05-03
Applicant: Tao-Chih Chang , Chiao-Yun Chang , Shan-Pu Yu
Inventor： Tao-Chih Chang , Chiao-Yun Chang , Shan-Pu Yu
CPC classification number: H01L24/12 , H01L21/563 , H01L23/49582 , H01L23/49816 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1182 , H01L2224/11822 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/29111 , H01L2224/73203 , H01L2224/73204 , H01L2224/81024 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/15311 , H05K3/3426 , H05K3/3436 , H05K3/3463 , H05K2203/0435 , Y02P70/613 , Y10T428/24917 , H01L2924/00015 , H01L2224/29099 , H01L2224/05599
Abstract: A method and a device for enhancing the solderability of a lead-free component are provided. The provided method is compatible with the conventional soldering process and is capable of improving the wetting ability of the solder so as to enhance the solderability and the ability of anti-oxidation thereof. Besides, it is also achievable for providing a recognizable lead-free device so as to prevent the process confusion.
Abstract translation: 提供了一种用于增强无铅部件的可焊性的方法和装置。 所提供的方法与传统的焊接工艺兼容，并且能够提高焊料的润湿能力，从而提高可焊性和抗氧化能力。 此外，还可以提供可识别的无铅装置，以防止过程混淆。
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公开(公告)号：US20090050470A1
公开(公告)日：2009-02-26
申请号：US12262002
申请日：2008-10-30
Applicant: Tao-Chih Chang , Chiao-Yun Chang , Shan-Pu Yu
Inventor： Tao-Chih Chang , Chiao-Yun Chang , Shan-Pu Yu
CPC classification number: H01L24/12 , H01L21/563 , H01L23/49582 , H01L23/49816 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1182 , H01L2224/11822 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/29111 , H01L2224/73203 , H01L2224/73204 , H01L2224/81024 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/15311 , H05K3/3426 , H05K3/3436 , H05K3/3463 , H05K2203/0435 , Y02P70/613 , Y10T428/24917 , H01L2924/00015 , H01L2224/29099 , H01L2224/05599
Abstract: A method and a device for enhancing the solderability of a lead-free component are provided. The provided method is compatible with the conventional soldering process and is capable of improving the wetting ability of the solder so as to enhance the solderability and the ability of anti-oxidation thereof. Besides, it is also achievable for providing a recognizable lead-free device so as to prevent the process confusion.
Abstract translation: 提供了一种用于增强无铅部件的可焊性的方法和装置。 所提供的方法与传统的焊接工艺兼容，并且能够提高焊料的润湿能力，从而提高可焊性和抗氧化能力。 此外，还可以提供可识别的无铅装置，以防止过程混淆。
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