公开(公告)号：US08786110B2

公开(公告)日：2014-07-22

申请号：US13075921

申请日：2011-03-30

Applicant: Hisakazu Marutani ,  Yasunari Iwami ,  Tomoshige Chikai ,  Tomoko Takahashi ,  Osamu Yamagata ,  Shingo Mitsugi ,  Chunghao Chen

Inventor： Hisakazu Marutani ,  Yasunari Iwami ,  Tomoshige Chikai ,  Tomoko Takahashi ,  Osamu Yamagata ,  Shingo Mitsugi ,  Chunghao Chen

IPC: H01L23/48 ,  H01L23/02

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/16 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/04 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/21 ,  H01L2224/2101 ,  H01L2224/215 ,  H01L2224/22 ,  H01L2224/221 ,  H01L2224/24011 ,  H01L2224/24146 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00

Abstract: A semiconductor device comprising a support plate, a semiconductor element mounted on the support plate and including a circuit element surface having a plurality of first electrodes, a first insulation layer covering the circuit element surface of the semiconductor element, and including a plurality of first apertures exposing the plurality of first electrodes, a second insulation layer covering an upper part of the support plate and side parts of the semiconductor element, and wirings formed on an upper part of the first insulation layer and on an upper part of the second insulation layer, and electrically connected to the corresponding first electrodes.

Abstract translation: 一种半导体器件，包括支撑板，安装在支撑板上并包括具有多个第一电极的电路元件表面的半导体元件，覆盖半导体元件的电路元件表面的第一绝缘层，并且包括多个第一孔 暴露多个第一电极，覆盖支撑板的上部和半导体元件的侧部的第二绝缘层以及形成在第一绝缘层的上部和第二绝缘层的上部上的布线， 并电连接到相应的第一电极。

公开(公告)号：US20120074594A1

公开(公告)日：2012-03-29

申请号：US13075921

申请日：2011-03-30

Applicant: Hisakazu MARUTANI ,  Yasunari Iwami ,  Tomoshige Chikai ,  Tomoko Takahashi ,  Osamu Yamagata ,  Shingo Mitsugi ,  Chunghao Chen

Inventor： Hisakazu MARUTANI ,  Yasunari Iwami ,  Tomoshige Chikai ,  Tomoko Takahashi ,  Osamu Yamagata ,  Shingo Mitsugi ,  Chunghao Chen

IPC: H01L23/48 ,  H01L21/78 ,  H01L21/50

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/16 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/04 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/21 ,  H01L2224/2101 ,  H01L2224/215 ,  H01L2224/22 ,  H01L2224/221 ,  H01L2224/24011 ,  H01L2224/24146 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00

Abstract: A semiconductor device comprising a support plate, a semiconductor element mounted on the support plate and including a circuit element surface having a plurality of first electrodes, a first insulation layer covering the circuit element surface of the semiconductor element, and including a plurality of first apertures exposing the plurality of first electrodes, a second insulation layer covering an upper part of the support plate and side parts of the semiconductor element, and wirings formed on an upper part of the first insulation layer and on an upper part of the second insulation layer, and electrically connected to the corresponding first electrodes.

Abstract translation: 一种半导体器件，包括支撑板，安装在支撑板上并包括具有多个第一电极的电路元件表面的半导体元件，覆盖半导体元件的电路元件表面的第一绝缘层，并且包括多个第一孔 暴露多个第一电极，覆盖支撑板的上部和半导体元件的侧部的第二绝缘层以及形成在第一绝缘层的上部和第二绝缘层的上部上的布线， 并电连接到相应的第一电极。