Application of facet-growth to self-aligned Shottky barrier gate field
effect transistors
    1.
    发明授权
    Application of facet-growth to self-aligned Shottky barrier gate field effect transistors 失效
    小面生长对自对准肖特基势垒栅场效应晶体管的应用

    公开(公告)号:US3943622A

    公开(公告)日:1976-03-16

    申请号:US517284

    申请日:1974-10-22

    摘要: A semiconductor device and particularly a self-aligned Schottky barrier gate field-effect transistor is made by epitaxial growth of facets corresponding to the source and drain regions on a surface of a semiconductor body through spaced apart preferably elongated windows in a masking layer and overgrowing edge portions of the masking layer at the windows to form overgrown portions on the facets. The channel region of the transistor is previously formed in the semiconductor body, preferably by epitaxial growth of a layer on a surface of a semiconductor body having a semi-insulating layer adjoining the surface. After removal of the masking layer, the Schottky barrier gate is self-aligned by deposition of metal on the unshielded portions of the planar surface between the facets.

    摘要翻译: 半导体器件,特别是自对准肖特基势垒栅场效应晶体管是通过在半导体主体的表面上对应于源极和漏极区域的面的外延生长而通过在掩模层中的间隔开的优选细长的窗口和过度生长边缘 在窗口处的掩模层的部分在小平面上形成长满的部分。 晶体管的沟道区预先形成在半导体本体中,优选地通过在邻接表面的半绝缘层的半导体本体的表面上外延生长层。 在去除掩模层之后,肖特基势垒栅极通过在面之间的平坦表面的非屏蔽部分上沉积金属而自对准。

    Ion implant mask and cap for gallium arsenide structures
    3.
    发明授权
    Ion implant mask and cap for gallium arsenide structures 失效
    用于砷化镓结构的离子注入掩模和盖

    公开(公告)号:US4494997A

    公开(公告)日:1985-01-22

    申请号:US504568

    申请日:1983-06-15

    摘要: A mask and encapsulating layer suitable for use on gallium arsenide substrates is described incorporating a layer of germanium selenide which is photosensitive and may be exposed and developed to form a mask suitable for ion implantation and which may also remain as a capping layer during an anneal process of ion implanted regions in a controlled atmosphere and temperature furnace wherein the layer of germanium selenide is converted to germanium which may subsequently be removed from the gallium arsenide substrate after the step of annealing.

    摘要翻译: 描述了适用于砷化镓衬底的掩模和封装层,其包括光敏的硒化锗层,并且可以被曝光和显影以形成适于离子注入的掩模,并且还可以在退火过程期间保持为封盖层 的离子注入区域在受控的气氛和温度炉中,其中硒化锗层被转化为锗,其可以在退火步骤之后随后从砷化镓衬底去除。