公开(公告)号：US08891953B2

公开(公告)日：2014-11-18

申请号：US12929085

申请日：2010-12-29

Applicant: Jung-bae Kim ,  Chan-min Park ,  Eui-hyeon Hwang

Inventor： Jung-bae Kim ,  Chan-min Park ,  Eui-hyeon Hwang

IPC: G03B15/03 ,  G03B17/18 ,  G03B17/20 ,  G06K9/46 ,  H04N5/232 ,  G06K9/00

CPC classification number: H04N5/23219 ,  G06K9/00228 ,  H04N5/232

Abstract: A photographing method, medium, and apparatus based on face detection in a portable camera. The portable photographing apparatus may include an image input unit that receives an image, a face detection unit that detects a face from the received image, a storage unit that stores the image detected by the face detection unit as a moving image in a first mode, and a quality evaluation unit that evaluates the quality of the image detected by the face detection unit and stores the same as a still image in a second mode upon satisfaction of predetermined conditions evaluated based on the quality evaluation of the still image.

Abstract translation: 基于便携式相机中的面部检测的拍摄方法，介质和装置。 便携式拍摄装置可以包括接收图像的图像输入单元，从接收图像检测面部的面部检测单元，存储单元，其将由面部检测单元检测到的图像存储为第一模式中的运动图像， 以及质量评估单元，其在满足基于静止图像的质量评估评估的预定条件时，评估由面部检测单元检测到的图像的质量并将其作为静止图像存储在第二模式中。

公开(公告)号：US20140106154A1

公开(公告)日：2014-04-17

申请号：US14050445

申请日：2013-10-10

Applicant: Do Young KIM ,  Young Kwon KOO ,  Dong Myeong SHIN ,  Oh Hyeon HWANG ,  Kyoung Ku KANG

Inventor： Do Young KIM ,  Young Kwon KOO ,  Dong Myeong SHIN ,  Oh Hyeon HWANG ,  Kyoung Ku KANG

IPC: H01B1/12

CPC classification number: H01B1/124 ,  H01B1/22 ,  Y10T428/31507

Abstract: A transparent conductor, a composition for the same, and an apparatus including the same, the transparent conductor including a transparent conductive film, the transparent conductive film including a metal nanowire and a conductive polymer, wherein the transparent conductor has a b* value of less than about 1.78 in color coordinates of CIE Lab at wavelengths of 400 nm to 700 nm.

Abstract translation: 一种透明导体及其组合物及其装置，该透明导体包括透明导电膜，透明导电膜包括金属纳米线和导电聚合物，其中透明导体的ab *值小于 CIE Lab色彩坐标约为1.78，波长为400 nm至700 nm。

公开(公告)号：US20110047388A1

公开(公告)日：2011-02-24

申请号：US12688162

申请日：2010-01-15

Applicant: Tae-suh PARK ,  Ui-hyeon HWANG ,  Seung-ji YANG ,  Doo-yeon LEE

Inventor： Tae-suh PARK ,  Ui-hyeon HWANG ,  Seung-ji YANG ,  Doo-yeon LEE

IPC: G06F12/14 ,  G06K9/62 ,  H04L9/08 ,  G06F15/16

CPC classification number: G06F21/6209 ,  G06F2221/2115 ,  G06F2221/2143 ,  G06F2221/2149

Abstract: A method and apparatus are provided for remotely controlling access to pornographic content of an image in a first device, the method including acquiring content of the image, determining whether the content of the image is pornographic by analyzing at least one image frame constituting the contents of the image, blocking access to the content of the image when the content is determined to be pornographic, extracting at least one representative problematic image frame from the content of the image; transmitting the at least one representative problematic image frame to a second device; receiving control commands from the second device and controlling access to the content of the image blocked in the first device, based on the control commands.

Abstract translation: 提供一种用于远程控制第一设备中的图像的色情内容的访问的方法和装置，所述方法包括获取图像的内容，通过分析构成图像的内容的至少一个图像帧来确定图像的内容是否是色情的 所述图像在所述内容被确定为色情时阻止对所述图像的内容的访问，从所述图像的内容中提取至少一个代表性的有问题的图像帧; 将所述至少一个代表性的有问题的图像帧发送到第二设备; 从所述第二设备接收控制命令，并基于所述控制命令来控制对所述第一设备中被阻止的所述图像的内容的访问。

公开(公告)号：US20100119842A1

公开(公告)日：2010-05-13

申请号：US12614531

申请日：2009-11-09

Applicant: Dong-Hyeon HWANG ,  Do-Heang KANG ,  Yong-Wook HWANG ,  Young-Ki KIM ,  Shin-Chul KANG ,  Hoon-Soo PARK

Inventor： Dong-Hyeon HWANG ,  Do-Heang KANG ,  Yong-Wook HWANG ,  Young-Ki KIM ,  Shin-Chul KANG ,  Hoon-Soo PARK

IPC: B32B27/06 ,  C08F2/48

CPC classification number: C08J7/04 ,  C08J2323/06 ,  Y10T428/31605

Abstract: An injection preform providing a metallic texture and a fabrication method thereof, in which on a surface of an injection substrate whereon a thin-film primer coating layer (TPPCL) is formed providing the metallic texture formed with various patterns and to preserve the texture on the surface of the injection substrate. The injection preform typically includes: an injection substrate having a surface on which the various patterns are formed by mold discharge corrosion; a TPPCL formed on the surface of the injection substrate to increase reflectivity of the injection substrate, so that the TPPCL provides the metallic texture with various patterns while preserving surface texture of the injection substrate; a non-conductive metal-deposited layer deposited on a surface of the thin film primer coating layer; a color coating layer (CCL) formed on a surface of the non-conductive metal-deposited layer; and a clear layer formed on a surface of the CCL.

Abstract translation: 提供金属结构的注射成型体及其制造方法，其中在注射基底的表面上形成薄膜底漆涂层（TPPCL），其提供形成有各种图案的金属质感并且保持在 注入基板的表面。 注射预成型件通常包括：注射基底，其具有通过模具排出腐蚀形成各种图案的表面; 形成在注入基板的表面上的TPPCL，以增加注入基板的反射率，使得TPPCL在保持注入基板的表面纹理的同时，提供各种图案的金属纹理; 沉积在薄膜底漆涂层的表面上的非导电金属沉积层; 形成在非导电金属沉积层的表面上的着色涂层（CCL）; 以及形成在CCL的表面上的透明层。

公开(公告)号：US20100041782A1

公开(公告)日：2010-02-18

申请号：US12522479

申请日：2008-01-02

Applicant: Pit Lehmann ,  Katrin Thane ,  Cheul Hyeon Hwang

Inventor： Pit Lehmann ,  Katrin Thane ,  Cheul Hyeon Hwang

IPC: C08J9/00

CPC classification number: C08G18/4812 ,  C08G18/161 ,  C08G18/1808 ,  C08G18/1816 ,  C08G18/2027 ,  C08G18/2081 ,  C08G18/4825 ,  C08G18/4883 ,  C08G2101/0025 ,  C08G2101/0083 ,  Y10T428/31551

Abstract: The present invention relates to a rigid polyurethane foam comprising reinforcing materials which can be obtained by mixing (a) isocyanates which have a viscosity at 25° C. of less than 500 mPas with (b) compounds having groups which are reactive toward isocyanates, (c) blowing agents comprising water, (d) catalysts and, if appropriate, (e) further additives to form a reaction mixture and applying the reaction mixture to a reinforcing material, wherein the compounds (b) having groups which are reactive toward isocyanates comprise a polyetherol (b1) having a functionality of 4 or more and a viscosity at 25° C. of 10 000 mPas or less and a polyetherol (b2) having a functionality of 3 or less and a viscosity at 25° C. of 500 mPas or less. The present invention further relates to a process for producing such rigid polyurethane foams and the use of the rigid polyurethane foams for the insulation of liquefied natural gas tanks.

Abstract translation: 本发明涉及一种硬质聚氨酯泡沫，其包括增强材料，其可以通过将（a）在25℃下具有小于500mPas的粘度的异氰酸酯与（b）具有对异氰酸酯反应的基团的化合物混合（ c）包含水的发泡剂，（d）催化剂，如果合适的话，（e）其它添加剂以形成反应混合物并将反应混合物施加到增强材料上，其中具有对异氰酸酯具有反应性的基团的化合物（b）包括 官能度为4以上，25℃下的粘度为10000mPa·s以下的聚醚类（b1）和官能度为3以下，25℃下的粘度为500mPa·s的聚醚类（b2） 或更少。 本发明还涉及一种用于生产这种硬质聚氨酯泡沫体的方法，以及使用硬质聚氨酯泡沫塑料用于液化天然气罐的绝缘。

公开(公告)号：US07494845B2

公开(公告)日：2009-02-24

申请号：US11144213

申请日：2005-06-02

Applicant: Hyeon Hwang ,  Ki-Kwon Jeong

Inventor： Hyeon Hwang ,  Ki-Kwon Jeong

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L23/481 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/6834 ,  H01L2224/02372 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of forming a stack of thin wafers provides a wafer level stack to greatly reduce process time compared to a method where individually separated chips are stacked after a wafer is sawed. A rigid planar wafer support member stabilizes and planarizes each wafer while it is thin or its thickness is reduced and during subsequent wafer processing. Thinned wafers are stacked and the external support members are removed by applying heat or ultraviolet (UV) light to an expandable adhesive layer between the support members and the thin wafers. The stacked wafers then can be further processed and packaged without thin-wafer warping, cracking or breaking. A wafer level package made in accordance with the invented method also is disclosed.

Abstract translation: 形成薄晶片堆叠的方法提供了晶片级堆叠，以便在晶片被锯切之后分开分离的芯片的方法中大大减少处理时间。 刚性平面晶片支撑构件在其薄或其厚度减小和在随后的晶片处理期间稳定和平坦化每个晶片。 将薄的晶片堆叠并且通过向支撑构件和薄晶片之间的可扩张的粘合剂层施加热或紫外线（UV）光来去除外部支撑构件。 然后可以进一步处理和封装堆叠的晶片，而不会出现薄片翘曲，开裂或断裂。 还公开了根据本发明方法制造的晶片级封装。

公开(公告)号：US20080298767A1

公开(公告)日：2008-12-04

申请号：US12005337

申请日：2007-12-27

Applicant: Jin-Guk Jeong ,  Eui-hyeon Hwang ,  Seok-cheol Kee ,  Ki-wan Eom

Inventor： Jin-Guk Jeong ,  Eui-hyeon Hwang ,  Seok-cheol Kee ,  Ki-wan Eom

IPC: H04N5/93 ,  G11B27/00

CPC classification number: H04N7/163 ,  G06F16/739 ,  G06F16/7834 ,  G06F16/785 ,  G06F16/7854 ,  G11B27/28 ,  H04N5/91 ,  H04N5/93 ,  H04N21/4394 ,  H04N21/44008 ,  H04N21/8456

Abstract: Provided is a method and apparatus for summarizing a moving picture of a sports game. The method includes detecting play sections of the moving picture; calculating a degree of importance of each play section; and summarizing the moving picture including each play section using the degree of importance of each play section.

Abstract translation: 提供了一种用于总结运动游戏的运动图像的方法和装置。 该方法包括检测运动图像的播放部分; 计算每个游戏部分的重要程度; 并且使用每个播放部分的重要程度来总结包括每个播放部分的运动图像。

公开(公告)号：US20080068496A1

公开(公告)日：2008-03-20

申请号：US11715374

申请日：2007-03-08

Applicant: Jin Guk Jeong ,  Eui Hyeon Hwang ,  Ki Wan Eom ,  Sang Kyun Kim ,  Ji Yeun Kim

Inventor： Jin Guk Jeong ,  Eui Hyeon Hwang ,  Ki Wan Eom ,  Sang Kyun Kim ,  Ji Yeun Kim

IPC: H04N7/01

CPC classification number: H04N7/163 ,  G11B27/034 ,  G11B27/28 ,  H04N5/46 ,  H04N9/7921 ,  H04N9/8042 ,  H04N9/8063 ,  H04N9/8205 ,  H04N19/132 ,  H04N19/142 ,  H04N19/172 ,  H04N19/48 ,  H04N19/87 ,  H04N21/4334 ,  H04N21/44008 ,  H04N21/4402 ,  H04N21/44029 ,  H04N21/8456 ,  H04N21/8549

Abstract: A broadcast program summary generation system, method and medium are provided. The broadcast program summary generation system includes a format transformation unit to transform a broadcast format of digital broadcast data into a storage format, and a summary generation unit to decode video data of the transformed digital broadcast data, to analyze the decoded video data, to detect an important event by analyzing audio data of the transformed digital broadcast data, and to generate summary information based on the important event.

Abstract translation: 提供广播节目摘要生成系统，方法和媒体。 广播节目摘要生成系统包括将数字广播数据的广播格式变换为存储格式的格式变换部，以及对变换后的数字广播数据的视频数据进行解码的摘要生成部，分析解码后的视频数据，检测 通过分析变换后的数字广播数据的音频数据，并根据重要事件生成摘要信息的重要事件。

公开(公告)号：US07262114B2

公开(公告)日：2007-08-28

申请号：US11045078

申请日：2005-01-31

Applicant: Ki-kwon Jeong ,  Hyeon Hwang

Inventor： Ki-kwon Jeong ,  Hyeon Hwang

IPC: H01L21/46

CPC classification number: H01L21/78 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/6839

Abstract: A die attaching method of a semiconductor chip simplifies the process of fabricating a package from the chip while preventing the chip form being damaged even when the chip is very thin. Warpage prevention material is adhered to a top surface of a wafer having a plurality of chips formed thereon, and then the wafer is cut to separate the chips from one another. Each semiconductor chip is then placed on and attached to a die pad of a base frame, while the warpage prevention material is detached from the semiconductor chip. Thus, the warpage prevention material is removed without requiring a process that is extraneous to the die attaching process.

Abstract translation: 半导体芯片的管芯附接方法简化了从芯片制造封装的过程，同时防止芯片形式受损，即使芯片非常薄。 防翘曲材料附着在其上形成有多个芯片的晶片的顶表面上，然后切割晶片以将芯片彼此分离。 然后将每个半导体芯片放置并附接到基架的芯片焊盘，同时防止翘曲材料与半导体芯片分离。 因此，除去防翘曲材料，而不需要与模具附接工艺无关的工艺。

公开(公告)号：US20050282374A1

公开(公告)日：2005-12-22

申请号：US11144213

申请日：2005-06-02

Applicant: Hyeon Hwang ,  Ki-Kwon Jeong

Inventor： Hyeon Hwang ,  Ki-Kwon Jeong

IPC: H01L23/12 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L21/68 ,  H01L21/98 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L21/6835 ,  H01L23/481 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/6834 ,  H01L2224/02372 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of forming a stack of thin wafers provides a wafer level stack to greatly reduce process time compared to a method where individually separated chips are stacked after a wafer is sawed. A rigid planar wafer support member stabilizes and planarizes each wafer while it is thin or its thickness is reduced and during subsequent wafer processing. Thinned wafers are stacked and the external support members are removed by applying heat or ultraviolet (UV) light to an expandable adhesive layer between the support members and the thin wafers. The stacked wafers then can be further processed and packaged without thin-wafer warping, cracking or breaking. A wafer level package made in accordance with the invented method also is disclosed.

Abstract translation: 形成薄晶片堆叠的方法提供了晶片级堆叠，以便在晶片被锯切之后分开分离的芯片的方法中大大减少处理时间。 刚性平面晶片支撑构件在其薄或其厚度减小和在随后的晶片处理期间稳定和平坦化每个晶片。 将薄的晶片堆叠并且通过向支撑构件和薄晶片之间的可扩张的粘合剂层施加热或紫外线（UV）光来去除外部支撑构件。 然后可以进一步处理和封装堆叠的晶片，而不会出现薄片翘曲，开裂或断裂。 还公开了根据本发明方法制造的晶片级封装。