摘要:
Provided is a polymer resin composition for manufacturing an insulating film for manufacture of a printed circuit board. The polymer resin composition includes polymer resins and graphene for linking the polymer resins with larger attraction than Van Deer Waals's force of the polymer resins.
摘要:
Disclosed herein is a radiating substrate radiating heat generated from a predetermined heating element to the outside. The radiating substrate includes polymer resins and graphenes distributed in the polymer resins.
摘要:
A metal powder including a graphene layer irregularly formed on a surface of the metal powder, a method for preparing the same, and a multilayered ceramic capacitor including an inner electrode using the metal powder. By using the metal powder having the graphene irregularly formed on the surface thereof as the inner electrode material of the multilayered ceramic capacitor, and allowing the necking phenomenon to occur on only the surface where the graphene is not formed, the necking of the metal powder is delayed and the shrinkage of the inner electrode is controlled, so that reduction of the thickness of the inner electrode and disconnection/crack can be prevented.
摘要:
Disclosed herein are inner electrodes of a multilayered ceramic capacitor including metal powders including graphene layers formed on a surface thereof and a multilayered ceramic capacitor including the inner electrodes. An exemplary embodiment of the present invention can include metal powders including graphene layers formed on a surface thereof as inner electrode materials of a multilayered ceramic capacitor to more effectively prevent necking of the metal powders than the related art including only dielectric ceramic powders, thereby increasing necking temperature and necking and control inner electrode shrinkage, thereby reducing a thickness of the inner electrode and defects such as short/cracks, and the like, of the inner electrode. Therefore, it is possible to provide the multilayered ceramic capacitor with excellent reliability by minimizing a difference in shrinkage between the dielectric layer and the inner electrodes.