利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

13 条记录 (耗时 0.013 秒)

    POST-LENS STEERING OF A LASER BEAM FOR MICRO-MACHINING APPLICATIONS
    2.
    发明申请
    POST-LENS STEERING OF A LASER BEAM FOR MICRO-MACHINING APPLICATIONS 审中-公开
    用于微加工应用的激光束的后透镜转向

    公开(公告)号：US20100078419A1

    公开(公告)日：2010-04-01

    申请号：US12238929

    申请日：2008-09-26

    申请人： Brian JOHANSEN ,  Mehmet Ermin ALPAY ,  Jeff HOWERTON

    发明人： Brian JOHANSEN ,  Mehmet Ermin ALPAY ,  Jeff HOWERTON

    IPC分类号： B23K26/02

    摘要： In a laser micro-machining system including a simple focusing lens located between a laser source and a beam steering mechanism along the path of a laser beam pulse. The focusing lens being a simple single-element spherical lens with an optical axis of the focusing lens located inline with a laser beam input from the laser source. The focusing lens located further away from a work piece than the beam steering mechanism. An active beam path management system moves the simple focusing lens in concert with and relative to the beam steering mechanism to maintain a focal point coincident with a surface of the work piece at all deflection angles affected by the beam steering mechanism. The focusing lens is rapidly moveable in concert with the beam steering mechanism to maintain a constant beam path length from the lens output to the work piece at all times.

    摘要翻译： 在激光微加工系统中，包括沿着激光束脉冲的路径位于激光源和光束转向机构之间的简单聚焦透镜。 聚焦透镜是简单的单元球面透镜，其中聚焦透镜的光轴与激光源输入的激光束成一直线。 聚焦透镜位于比工件更远离光束转向机构的位置。 主动光束路径管理系统使简单的聚焦透镜与光束转向机构相协调并相对于在由光束转向机构影响的所有偏转角度处保持与工件的表面一致的焦点。 聚焦透镜可以与光束转向机构一致地快速移动，以保持始终从透镜输出到工件的恒定光束路径长度。

    Automatic recipe management for laser processing a work piece
    4.
    发明授权
    Automatic recipe management for laser processing a work piece 有权
    激光加工工件的自动配方管理

    公开(公告)号：US08173931B2

    公开(公告)日：2012-05-08

    申请号：US12164698

    申请日：2008-06-30

    申请人： Ling Wen ,  Mehmet Alpay ,  Jeff Howerton

    发明人： Ling Wen ,  Mehmet Alpay ,  Jeff Howerton

    IPC分类号： B23K26/40 ,  G06F19/00 ,  G05B19/18

    CPC分类号： G05B19/4083 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G05B2219/36503 ,  G05B2219/45165

    摘要： To better address these problems, one or more characteristics are measured from a work piece (28). The measurement information is used to select a preferred predetermined laser processing recipe from a lookup table. The laser processing recipe is then used to process the work piece (28). The lookup table of laser processing recipes can be established from theoretical calculations, from trial an error by an operator, from an automated systematic recipe variation process with post process testing, or from some combination of these or other methods. An automated process can also reduce operator errors and may store measurement values for convenient tracking of work piece characteristics.

    摘要翻译： 为了更好地解决这些问题，从工件（28）测量一个或多个特性。 测量信息用于从查找表中选择优选的预定激光处理配方。 然后使用激光加工配方来处理工件（28）。 激光加工配方的查找表可以从理论计算，从操作员的误差，自动化系统配方变化过程，后处理测试或这些或其他方法的某种组合建立。 自动化过程还可以减少操作员的错误，并可能存储测量值，以方便跟踪工件特性。

    Process for Forming an Isolated Electrically Conductive Contact Through a Metal Package
    6.
    发明申请
    Process for Forming an Isolated Electrically Conductive Contact Through a Metal Package 失效
    通过金属封装形成隔离导电接触的工艺

    公开(公告)号：US20110131807A1

    公开(公告)日：2011-06-09

    申请号：US13027167

    申请日：2011-02-14

    申请人： Michael Nashner ,  Jeff Howerton

    发明人： Michael Nashner ,  Jeff Howerton

    IPC分类号： H05K13/00

    CPC分类号： H05K3/445 ,  H05K1/053 ,  H05K3/4061 ,  H05K5/0247 ,  H05K2201/0179 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/0315 ,  H05K2203/0323 ,  H05K2203/107 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom surface and at least one continuous sidewall extending therebetween. A dielectric sleeve is formed on the at least one sidewall of the via while preserving at least a portion of the through via. An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.

    摘要翻译： 通过金属基底形成隔离的导电接触的方法包括产生穿过基底的至少一个通孔，其中通孔包括在基底的顶表面中的第一开口，在相对的底表面中的第二开口和至少一个 连续的侧壁在其间延伸。 介电套筒形成在通孔的至少一个侧壁上，同时保留通孔的至少一部分。 然后将导电填料放入通孔中。 在所公开的实施例中，填料可以是导电油墨或导电环氧树脂。

    Process for forming an isolated electrically conductive contact through a metal package
    7.
    发明授权
    Process for forming an isolated electrically conductive contact through a metal package 有权
    用于通过金属封装形成隔离的导电触点的工艺

    公开(公告)号：US07886437B2

    公开(公告)日：2011-02-15

    申请号：US11753996

    申请日：2007-05-25

    申请人： Michael Nashner ,  Jeff Howerton

    发明人： Michael Nashner ,  Jeff Howerton

    IPC分类号： H01K3/10

    CPC分类号： H05K3/445 ,  H05K1/053 ,  H05K3/4061 ,  H05K5/0247 ,  H05K2201/0179 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/0315 ,  H05K2203/0323 ,  H05K2203/107 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of forming an isolated electrically conductive contact through a metal substrate by creating at least one via through the substrate. The at least one sidewall of the via is cleaned and coated with a non-conductive layer. In one example, the non-conductive layer is formed by anodizing the sidewall(s) of the via. In another example, the non-conductive layer may be formed by thin film deposition of a dielectric on the sidewall(s). An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.

    摘要翻译： 通过形成至少一个通孔穿过衬底，通过金属衬底形成隔离的导电接触的方法。 通孔的至少一个侧壁被清洁并涂覆有非导电层。 在一个示例中，非导电层通过阳极氧化通孔的侧壁而形成。 在另一示例中，非导电层可以通过在侧壁上的电介质的薄膜沉积来形成。 然后将导电填料放入通孔中。 在所公开的实施例中，填料可以是导电油墨或导电环氧树脂。

    AUTOMATIC RECIPE MANAGEMENT FOR LASER PROCESSING A WORK PIECE
    8.
    发明申请
    AUTOMATIC RECIPE MANAGEMENT FOR LASER PROCESSING A WORK PIECE 有权
    用于激光加工工作的自动化管理

    公开(公告)号：US20090308854A1

    公开(公告)日：2009-12-17

    申请号：US12164698

    申请日：2008-06-30

    申请人： Ling Wen ,  Mehmet Alpay ,  Jeff Howerton

    发明人： Ling Wen ,  Mehmet Alpay ,  Jeff Howerton

    IPC分类号： B23K26/40 ,  G06F19/00 ,  G05B19/18

    CPC分类号： G05B19/4083 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G05B2219/36503 ,  G05B2219/45165

    摘要： To better address these problems, one or more characteristics are measured from a work piece (28). The measurement information is used to select a preferred predetermined laser processing recipe from a lookup table. The laser processing recipe is then used to process the work piece (28). The lookup table of laser processing recipes can be established from theoretical calculations, from trial an error by an operator, from an automated systematic recipe variation process with post process testing, or from some combination of these or other methods. An automated process can also reduce operator errors and may store measurement values for convenient tracking of work piece characteristics.

    摘要翻译： 为了更好地解决这些问题，从工件（28）测量一个或多个特性。 测量信息用于从查找表中选择优选的预定激光处理配方。 然后使用激光加工配方来处理工件（28）。 激光加工配方的查找表可以从理论计算，从操作员的误差，自动化系统配方变化过程，后处理测试或这些或其他方法的某种组合建立。 自动化过程还可以减少操作员的错误，并可能存储测量值，以方便跟踪工件特性。

    PROCESS FOR FORMING AN ISOLATED ELECTRICALLY CONDUCTIVE CONTACT THROUGH A METAL PACKAGE
    10.
    发明申请
    PROCESS FOR FORMING AN ISOLATED ELECTRICALLY CONDUCTIVE CONTACT THROUGH A METAL PACKAGE 有权
    通过金属包装形成隔离电导电接触的方法

    公开(公告)号：US20080289178A1

    公开(公告)日：2008-11-27

    申请号：US11753996

    申请日：2007-05-25

    申请人： Michael Nashner ,  Jeff Howerton

    发明人： Michael Nashner ,  Jeff Howerton

    IPC分类号： H05K5/02 ,  H01Q1/00

    CPC分类号： H05K3/445 ,  H05K1/053 ,  H05K3/4061 ,  H05K5/0247 ,  H05K2201/0179 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/0315 ,  H05K2203/0323 ,  H05K2203/107 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of forming an isolated electrically conductive contact through a metal substrate by creating at least one via through the substrate. The at least one sidewall of the via is cleaned and coated with a non-conductive layer. In one example, the non-conductive layer is formed by anodizing the sidewall(s) of the via. In another example, the non-conductive layer may be formed by thin film deposition of a dielectric on the sidewall(s). An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.

    摘要翻译： 通过形成至少一个通孔穿过衬底，通过金属衬底形成隔离的导电接触的方法。 通孔的至少一个侧壁被清洁并涂覆有非导电层。 在一个示例中，非导电层通过阳极氧化通孔的侧壁而形成。 在另一示例中，非导电层可以通过在侧壁上的电介质的薄膜沉积来形成。 然后将导电填料放入通孔中。 在所公开的实施例中，填料可以是导电油墨或导电环氧树脂。