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    Card device
    1.
    发明授权
    Card device 失效
    卡设备

    公开(公告)号：US08259453B2

    公开(公告)日：2012-09-04

    申请号：US12964821

    申请日：2010-12-10

    申请人： Kaori Morita ,  Tomoyasu Yamada ,  Tamotsu Kiyakawauchi ,  Akitomi Katsumura ,  Koji Shiozawa

    发明人： Kaori Morita ,  Tomoyasu Yamada ,  Tamotsu Kiyakawauchi ,  Akitomi Katsumura ,  Koji Shiozawa

    IPC分类号： H05K7/02

    CPC分类号： G06K19/07743

    摘要： Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals. The superposition junction between the semiconductor package section and the substrate section is provided with such an offset that the card-side connector protrudes out off the card device.

    摘要翻译： 本文公开了一种卡装置，其包括具有存储功能的半导体封装部分和通过叠加并通过各种电子部件安装而连接到半导体封装部分的基板部分。 半导体封装部分包括具有用于输入和输出信息信号的卡侧端子的卡侧连接器部分和在半导体封装部分通过叠加与基板部分接合的位置处的封装侧端子。 基板部分包括在基板部分通过叠加连接到半导体封装部分的位置处的基板侧端子。 通过使用封装侧端子和基板侧端子将基板部电连接到半导体封装部。 半导体封装部和基板部之间的叠合接合部设置有使卡侧连接器从卡装置突出的偏移。

    CARD DEVICE
    3.
    发明申请
    CARD DEVICE 失效
    卡设备

    公开(公告)号：US20110157838A1

    公开(公告)日：2011-06-30

    申请号：US12964821

    申请日：2010-12-10

    申请人： KAORI MORITA ,  TOMOYASU YAMADA ,  TAMOTSU KIYAKAWAUCHI ,  AKITOMI KATSUMURA ,  KOJI SHIOZAWA

    发明人： KAORI MORITA ,  TOMOYASU YAMADA ,  TAMOTSU KIYAKAWAUCHI ,  AKITOMI KATSUMURA ,  KOJI SHIOZAWA

    IPC分类号： H05K1/14

    CPC分类号： G06K19/07743

    摘要： Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals. The superposition junction between the semiconductor package section and the substrate section is provided with such an offset that the card-side connector protrudes out off the card device.

    摘要翻译： 本文公开了一种卡装置，其包括具有存储功能的半导体封装部分和通过叠加并通过各种电子部件安装而连接到半导体封装部分的基板部分。 半导体封装部分包括具有用于输入和输出信息信号的卡侧端子的卡侧连接器部分和在半导体封装部分通过叠加与基板部分接合的位置处的封装侧端子。 基板部分包括在基板部分通过叠加连接到半导体封装部分的位置处的基板侧端子。 通过使用封装侧端子和基板侧端子将基板部电连接到半导体封装部。 半导体封装部和基板部之间的叠合接合部设置有使卡侧连接器从卡装置突出的偏移。

    Air-fuel ratio sensor
    4.
    发明授权
    Air-fuel ratio sensor 失效
    空燃比传感器

    公开(公告)号：US5762771A

    公开(公告)日：1998-06-09

    申请号：US796888

    申请日：1997-02-06

    申请人： Hirokazu Yamada ,  Takashi Kojima ,  Toshimi Miyamoto ,  Koji Shiozawa ,  Makoto Hori ,  Masahiro Hamaya ,  Minoru Ohta

    发明人： Hirokazu Yamada ,  Takashi Kojima ,  Toshimi Miyamoto ,  Koji Shiozawa ,  Makoto Hori ,  Masahiro Hamaya ,  Minoru Ohta

    IPC分类号： G01N27/407

    CPC分类号： G01N27/407

    摘要： An air-fuel ratio sensor comprises an oxygen concentration sensing element, a housing for holding this oxygen concentration sensing element, and protecting covers with gas holes. The protecting covers comprises an inside cover disposed closely to the oxygen concentration sensing element, and an outside cover surrounding the outside cover. Flange-like peripheral portions, formed on the protecting covers, are fixed to the abutting face of the housing by a caulking operation. These flange-like peripheral portions are disposed alternately along a same closed curve around the oxygen concentration sensing element, so that they are not overlapped with each other.

    摘要翻译： 空燃比传感器包括氧浓度检测元件，用于保持该氧浓度感测元件的壳体，以及用气孔保护盖。 保护盖包括靠近氧浓度感测元件设置的内盖和围绕外盖的外盖。 形成在保护盖上的法兰状周边部分通过铆接操作固定到壳体的邻接面。 这些凸缘状周边部分沿着氧浓度感测元件周围的相同闭合曲线交替设置，使得它们不彼此重叠。