公开(公告)号：US20060244120A1

公开(公告)日：2006-11-02

申请号：US11362507

申请日：2006-02-27

Applicant: Minka Gospodinova-Daltcheva ,  Harry Huebert ,  Rajesh Subraya ,  Jochen Thomas ,  Ingo Wennemuth

Inventor： Minka Gospodinova-Daltcheva ,  Harry Huebert ,  Rajesh Subraya ,  Jochen Thomas ,  Ingo Wennemuth

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor device includes a plastic package, at least one semiconductor chip and a rewiring level. The rewiring level includes an insulating layer and a rewiring layer. The rewiring layer includes either signal conductor paths and ground or supply conductor paths arranged parallel to one another and alternately, or only signal conductor paths arranged parallel to one another. In the latter case, an electrically conducting layer of metal which can be connected to ground or supply potential is additionally provided as a termination of the rewiring level or in the form of a covering layer.

Abstract translation: 半导体器件包括塑料封装，至少一个半导体芯片和重新布线层。 重新布线层包括绝缘层和重新布线层。 重新布线层包括彼此平行布置的信号导体路径和接地或供电导体路径，并且交替地或者仅包括彼此平行布置的信号导体路径。 在后一种情况下，另外提供可连接到接地或供电电位的导电金属层作为重新布线层的终端或覆盖层的形式。

公开(公告)号：US07345363B2

公开(公告)日：2008-03-18

申请号：US11362507

申请日：2006-02-27

Applicant: Minka Gospodinova-Daltcheva ,  Harry Huebert ,  Rajesh Subraya ,  Jochen Thomas ,  Ingo Wennemuth

Inventor： Minka Gospodinova-Daltcheva ,  Harry Huebert ,  Rajesh Subraya ,  Jochen Thomas ,  Ingo Wennemuth

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor device includes a plastic package, at least one semiconductor chip and a rewiring level. The rewiring level includes an insulating layer and a rewiring layer. The rewiring layer includes either signal conductor paths and ground or supply conductor paths arranged parallel to one another and alternately, or only signal conductor paths arranged parallel to one another. In the latter case, an electrically conducting layer of metal which can be connected to ground or supply potential is additionally provided as a termination of the rewiring level or in the form of a covering layer.

Abstract translation: 半导体器件包括塑料封装，至少一个半导体芯片和重新布线层。 重新布线层包括绝缘层和重新布线层。 重新布线层包括彼此平行布置的信号导体路径和接地或供电导体路径，并且交替地或者仅包括彼此平行布置的信号导体路径。 在后一种情况下，另外提供可连接到接地或供电电位的导电金属层作为重新布线层的终端或覆盖层的形式。

公开(公告)号：US20070210433A1

公开(公告)日：2007-09-13

申请号：US11371204

申请日：2006-03-08

Applicant: Rajesh Subraya ,  Helmut Fischer ,  Ingo Wennemuth ,  Minka Gospodinova ,  Jochen Thomas

Inventor： Rajesh Subraya ,  Helmut Fischer ,  Ingo Wennemuth ,  Minka Gospodinova ,  Jochen Thomas

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06551 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides an integrated device comprising a plurality of non-individually-encapsulated chip arrangements, each of which having a plurality of contact elements for contacting a contact pad, wherein the plurality of chip arrangements are stacked on each other such that the respective contact elements provide electrical connections to the respective chip arrangement, and a common integral mold arranged to encapsulate the plurality of stacked chip arrangements.

Abstract translation: 本发明提供了一种集成器件，其包括多个非单独封装的芯片布置，每个芯片布置具有用于接触接触焊盘的多个接触元件，其中所述多个芯片布置彼此堆叠，使得各个接触元件 提供到相应芯片布置的电连接，以及布置成封装多个堆叠芯片布置的公共整体模具。