公开(公告)号：US08952778B2

公开(公告)日：2015-02-10

申请号：US14125745

申请日：2012-08-20

申请人： Takahiro Sato ,  Yuya Ishima ,  Shusaku Umemoto ,  Takashi Suzuki ,  Satoru Okamoto ,  Yoshikazu Sakaguchi

发明人： Takahiro Sato ,  Yuya Ishima ,  Shusaku Umemoto ,  Takashi Suzuki ,  Satoru Okamoto ,  Yoshikazu Sakaguchi

IPC分类号： H01F5/00

CPC分类号： H01F5/003 ,  H01F17/0013 ,  H01F41/042

摘要： In the laminated coil component, the grain diameter of the coil conductors is 10 μm to 22 μm after baking is completed. When the grain diameter of the coil conductors is set to be 10 μm or larger after baking is completed, surface roughness of the coil conductors can be reduced to such an extent that a satisfactory Q value can be obtained at a high frequency. In addition, when the grain diameter of the coil conductors is set to be 22 μm or smaller after baking is completed, metal of the coil conductors can be refrained from being rapidly melted down during baking. Accordingly, a high Q value can be obtained while a high quality is ensured.

摘要翻译： 在层叠线圈部件中，线圈导体的粒径在烘烤完成后为10μm〜22μm。 当线圈导体的粒径在烘烤完成之后设定为10μm以上时，线圈导体的表面粗糙度可以降低到能够以高频获得令人满意的Q值的程度。 此外，当烘烤完成后，当线圈导体的粒径设定为22μm以下时，可以防止线圈导体的金属在烘烤时快速熔化。 因此，可以在确保高质量的同时获得高Q值。

公开(公告)号：US10043608B2

公开(公告)日：2018-08-07

申请号：US14131948

申请日：2012-08-20

申请人： Takahiro Sato ,  Yuya Ishima ,  Shusaku Umemoto ,  Takashi Suzuki ,  Satoru Okamoto ,  Yoshikazu Sakaguchi

发明人： Takahiro Sato ,  Yuya Ishima ,  Shusaku Umemoto ,  Takashi Suzuki ,  Satoru Okamoto ,  Yoshikazu Sakaguchi

IPC分类号： H01F5/00 ,  H01F27/28 ,  H01F27/24 ,  H01F5/06 ,  H01F17/00

CPC分类号： H01F5/06 ,  H01F17/0013 ,  H01F2017/004

摘要： A laminated coil component includes an element assembly formed by laminating a plurality of insulation layers and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween to retain a shape of the coil unit arrangement layer. The shape retention layer is made from glass-ceramic containing SrO, and a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layer.

公开(公告)号：US20140145816A1

公开(公告)日：2014-05-29

申请号：US14131948

申请日：2012-08-20

申请人： Takahiro Sato ,  Yuya Ishima ,  Shusaku Umemoto ,  Takashi Suzuki ,  Satoru Okamoto ,  Yoshikazu Sakaguchi

发明人： Takahiro Sato ,  Yuya Ishima ,  Shusaku Umemoto ,  Takashi Suzuki ,  Satoru Okamoto ,  Yoshikazu Sakaguchi

IPC分类号： H01F5/06

CPC分类号： H01F5/06 ,  H01F17/0013 ,  H01F2017/004

摘要： A laminated coil component includes an element assembly formed by laminating a plurality of insulation layers and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween to retain a shape of the coil unit arrangement layer. The shape retention layer is made from glass-ceramic containing SrO, and a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layer.

摘要翻译： 层叠线圈部件包括通过层叠多个绝缘层而形成的元件组件和通过多个线圈导体在元件组件内形成的线圈单元。 元件组件包括线圈单元布置层，线圈单元布置在其中，并且至少一对形状保持层设置成使线圈单元布置层插入其间以保持线圈单元布置层的形状。 形状保持层由含有SrO的玻璃陶瓷制成，线圈单元配置层的软化点低于形状保持层的软化点或熔点。

公开(公告)号：US20140118100A1

公开(公告)日：2014-05-01

申请号：US14125745

申请日：2012-08-20

申请人： Takahiro Sato ,  Yuya ISHIMA ,  Shusaku Umemoto ,  Takashi Suzuki ,  Satoru Okamoto ,  Yoshikazu Sakaguchi

发明人： Takahiro Sato ,  Yuya ISHIMA ,  Shusaku Umemoto ,  Takashi Suzuki ,  Satoru Okamoto ,  Yoshikazu Sakaguchi

IPC分类号： H01F5/00

CPC分类号： H01F5/003 ,  H01F17/0013 ,  H01F41/042

摘要： In the laminated coil component, the grain diameter of the coil conductors is 10 μm to 22 μm after baking is completed. When the grain diameter of the coil conductors is set to be 10 μm or larger after baking is completed, surface roughness of the coil conductors can be reduced to such an extent that a satisfactory Q value can be obtained at a high frequency. In addition, when the grain diameter of the coil conductors is set to be 22 μm or smaller after baking is completed, metal of the coil conductors can be refrained from being rapidly melted down during baking. Accordingly, a high Q value can be obtained while a high quality is ensured.

摘要翻译： 在层叠线圈部件中，线圈导体的粒径在烘烤完成后为10μm〜22μm。 当线圈导体的粒径在烘烤完成之后设定为10μm以上时，线圈导体的表面粗糙度可以降低到能够以高频获得令人满意的Q值的程度。 此外，当烘烤完成后，当线圈导体的粒径设定为22μm以下时，可以防止线圈导体的金属在烘烤时快速熔化。 因此，可以在确保高质量的同时获得高Q值。

公开(公告)号：US20090278627A1

公开(公告)日：2009-11-12

申请号：US12453422

申请日：2009-05-11

申请人： Shusaku Umemoto ,  Takashi Suzuki ,  Kouichi Kakuda ,  Hiroshi Momoi ,  Masaki Takahashi ,  Shinichi Kondo

发明人： Shusaku Umemoto ,  Takashi Suzuki ,  Kouichi Kakuda ,  Hiroshi Momoi ,  Masaki Takahashi ,  Shinichi Kondo

IPC分类号： H03H7/00 ,  C03C10/04 ,  H01G4/12 ,  H01F5/02

CPC分类号： C04B35/18 ,  C04B35/20 ,  C04B2235/3201 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/365 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/77 ,  C04B2235/785 ,  H01F5/003 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0093 ,  H01G4/10 ,  H01G4/105 ,  H01G4/12 ,  H01G4/1209 ,  H03H7/0115 ,  H03H7/427 ,  H03H2001/0085 ,  H05K1/0306

摘要： A dielectric ceramic composition comprises as a main component, Cu oxide, Si oxide and one selected from the group consisting of Zn oxide alone and a combination of Mg oxide and Zn oxide, as a subcomponent, a glass component including B oxide and at least one selected from the group consisting of Si oxide, Ba oxide, Ca oxide, Sr oxide, Li oxide and Zn oxide, and having a glass softening point is 750° C. or less, wherein a content of said glass component is 1.5 to 15 wt % with respect to 100 wt % of said main component.According to the present invention, a dielectric ceramic composition can be provided which is available to be sintered at low temperature (for example, 950° C. or lower) while comparatively decreasing contents of a glass component, which shows good properties (specific permittivity, loss Q value and insulation resistance), and which is available to perform cofiring different materials.

摘要翻译： 电介质陶瓷组合物作为主要成分包含Cu氧化物，Si氧化物和选自单独的Zn氧化物和Mg氧化物和Zn氧化物的组合的一种作为副成分，包括B氧化物的玻璃成分和至少一种 选自由Si氧化物，Ba氧化物，CaO 2，Sr氧化物，Li氧化物和Zn氧化物组成的组，玻璃软化点为750℃以下，其中，所述玻璃成分的含量为1.5〜15重量％ 相对于100重量％的所述主要成分。 根据本发明，可以提供一种电介质陶瓷组合物，其可以在低温（例如950℃或更低）下烧结，同时相对降低玻璃组分的含量，其显示出良好的性能（比介电常数， 损耗Q值和绝缘电阻），并且可用于执行不同材料的共烧。

公开(公告)号：US08102223B2

公开(公告)日：2012-01-24

申请号：US12453422

申请日：2009-05-11

申请人： Shusaku Umemoto ,  Takashi Suzuki ,  Kouichi Kakuda ,  Hiroshi Momoi ,  Masaki Takahashi ,  Shinichi Kondo

发明人： Shusaku Umemoto ,  Takashi Suzuki ,  Kouichi Kakuda ,  Hiroshi Momoi ,  Masaki Takahashi ,  Shinichi Kondo

IPC分类号： H03H7/00 ,  C03C14/00 ,  C04B35/00 ,  H01F5/00 ,  H01G4/06

CPC分类号： C04B35/18 ,  C04B35/20 ,  C04B2235/3201 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/365 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/77 ,  C04B2235/785 ,  H01F5/003 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0093 ,  H01G4/10 ,  H01G4/105 ,  H01G4/12 ,  H01G4/1209 ,  H03H7/0115 ,  H03H7/427 ,  H03H2001/0085 ,  H05K1/0306

摘要： A dielectric ceramic composition comprises as a main component, Cu oxide, Si oxide and one selected from the group consisting of Zn oxide alone and a combination of Mg oxide and Zn oxide, as a subcomponent, a glass component including B oxide and at least one selected from the group consisting of Si oxide, Ba oxide, Ca oxide, Sr oxide, Li oxide and Zn oxide, and having a glass softening point is 750° C. or less, wherein a content of said glass component is 1.5 to 15 wt % with respect to 100 wt % of said main component. According to the present invention, a dielectric ceramic composition can be provided which is available to be sintered at low temperature (for example, 950° C. or lower) while comparatively decreasing contents of a glass component, which shows good properties (specific permittivity, loss Q value and insulation resistance), and which is available to perform cofiring different materials.

摘要翻译： 电介质陶瓷组合物作为主要成分包含Cu氧化物，Si氧化物和选自单独的Zn氧化物和Mg氧化物和Zn氧化物的组合的一种作为副成分，包括B氧化物的玻璃成分和至少一种 选自由Si氧化物，Ba氧化物，CaO 2，Sr氧化物，Li氧化物和Zn氧化物组成的组，玻璃软化点为750℃以下，其中，所述玻璃成分的含量为1.5〜15重量％ 相对于100重量％的所述主要成分。 根据本发明，可以提供一种电介质陶瓷组合物，其可以在低温（例如950℃或更低）下烧结，同时相对降低玻璃组分的含量，其显示出良好的性能（比介电常数， 损耗Q值和绝缘电阻），并且可用于执行不同材料的共烧。