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    Lighting device
    2.
    发明授权
    Lighting device 有权
    照明设备

    公开(公告)号：US08952407B2

    公开(公告)日：2015-02-10

    申请号：US13599321

    申请日：2012-08-30

    Applicant: Won Jin Son

    Inventor： Won Jin Son

    IPC: H01L33/50 ,  H01L25/075

    CPC classification number: H01L33/50 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting device package may be provided that includes: a package body which includes a first cavity and a second cavity which are formed to be depressed in at least a portion of the package body; a first light emitting device and a second light emitting device, each of which is disposed in the first cavity and the second cavity respectively; and a first fluorescent substance and a second fluorescent substance, each of which is filled in the first cavity and the second cavity respectively.

    Abstract translation: 可以提供一种发光器件封装，其包括：封装体，其包括形成为在所述封装体的至少一部分中被压下的第一腔和第二腔; 第一发光器件和第二发光器件，其各自分别设置在第一腔体和第二腔体中; 以及分别填充在第一腔体和第二腔体中的第一荧光物质和第二荧光物质。

    Light emitting diode package and method of manufacturing the same
    6.
    发明申请
    Light emitting diode package and method of manufacturing the same 有权
    发光二极管封装及其制造方法

    公开(公告)号：US20070194333A1

    公开(公告)日：2007-08-23

    申请号：US11709764

    申请日：2007-02-23

    Applicant: Won-Jin Son

    Inventor： Won-Jin Son

    IPC: H01L33/00 ,  H01L21/00

    CPC classification number: H01L33/48 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

    Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

    Abstract translation: 提供一种发光二极管封装及其制造方法。 发光二极管封装包括具有空腔的封装主体，多个发光二极管芯片，导线和多个引线框架。 多个发光二极管芯片安装在空腔中。 导线连接至少一个发光二极管芯片的电极。 多个引线框架形成在空腔中，并且至少一个引线框架电连接到发光二极管芯片或多个导线。

    Light emitting apparatus with an opening part, manufacturing method thereof, and light unit
    8.
    发明授权
    Light emitting apparatus with an opening part, manufacturing method thereof, and light unit 有权
    具有开口部的发光装置及其制造方法以及灯单元

    公开(公告)号：US08704263B2

    公开(公告)日：2014-04-22

    申请号：US11844837

    申请日：2007-08-24

    Applicant: Won Jin Son

    Inventor： Won Jin Son

    IPC: H01L33/00

    CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/00012

    Abstract: Provided are a light emitting apparatus and a light unit. The light emitting apparatus comprises a first substrate, a second substrate, and a light emitting device. The first substrate has a plurality of lead frames, and the second substrate has an opening part on the first substrate. The light emitting device is mounted on a portion of the first substrate that is below the opening part. The light unit comprises at least one light emitting apparatus and an optical member on a light emitting path of the light emitting apparatus.

    Abstract translation: 提供了一种发光装置和光单元。 发光装置包括第一基板，第二基板和发光装置。 第一基板具有多个引线框架，第二基板在第一基板上具有开口部。 发光装置安装在第一基板的位于开口部下方的部分上。 光单元包括在发光装置的发光路径上的至少一个发光装置和光学构件。

    LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
    发光二极管封装及其制造方法

    公开(公告)号：US20100213475A1

    公开(公告)日：2010-08-26

    申请号：US12772968

    申请日：2010-05-03

    Applicant: Won-Jin SON

    Inventor： Won-Jin SON

    IPC: H01L27/15

    CPC classification number: H01L33/48 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

    Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

    Abstract translation: 提供一种发光二极管封装及其制造方法。 发光二极管封装包括具有空腔的封装主体，多个发光二极管芯片，导线和多个引线框架。 多个发光二极管芯片安装在空腔中。 导线连接至少一个发光二极管芯片的电极。 多个引线框架形成在空腔中，并且至少一个引线框架电连接到发光二极管芯片或多个导线。

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