Patent search ap:"eSionic Corp." Page 1

1.

发明申请
Methods Of Enhancing Electrochemical Double Layer Capacitor (EDLC) Performance And EDLC Devices Formed Therefrom 审中-公开
Title translation: 增强电化学双层电容器（EDLC）性能的方法和形成的EDLC器件

公开(公告)号：US20150263543A1

公开(公告)日：2015-09-17

申请号：US14659421

申请日：2015-03-16

Applicant: eSionic Corp.

Inventor： Wayne L. Gellett , Benjamin L. Rupert , Leanne Beer , Steven Z Shi , Shilpa A. Worlikar

IPC: H02J7/00 , H01G11/22 , H01G11/62 , H01G11/84

CPC classification number: H01G11/62 , H01G11/14 , H01G11/60 , H01G11/84 , Y02E60/13

Abstract: The invention broadly encompasses energy storage devices or systems and more specifically relates to methods of enhancing the performance of electrochemical double layer capacitors (EDLCs), or supercapacitors or ultracapacitors, and devices formed therefrom. In some embodiments, the invention relates generally to energy storage devices, such as EDLCs that use phosphonium-based electrolytes and methods for treating such devices to enhance their performance and operation. Embodiments of the invention further encompass conventional ammonium based electrolytes and phosphonium-based electrolytes comprised of phosphonium ionic liquids, salts, and compositions employed in such EDLCs.

Abstract translation: 本发明广泛地包括能量存储装置或系统，更具体地涉及提高电化学双层电容器（EDLC）或超级电容器或超级电容器以及由其形成的装置的性能的方法。在一些实施方案中，本发明一般涉及能量存储装置，例如使用基于鏻的电解质的EDLC以及用于处理这些装置以增强其性能和操作的方法。本发明的实施方案还包括常规的基于铵的电解质和由鏻离子液体，盐和这种EDLC中使用的组合物构成的基于鏻的电解质。

2.

发明申请
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards 有权
Title translation: 处理铜表面以增强与印刷电路板中使用有机基板的粘附性的方法

公开(公告)号：US20170027065A1

公开(公告)日：2017-01-26

申请号：US15130167

申请日：2016-04-15

Applicant: eSionic Corp.

Inventor： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr

IPC: H05K3/38 , H05K1/09

CPC classification number: H05K3/385 , H05K1/09 , H05K3/389 , H05K3/4652 , H05K2203/1157 , Y10T156/10

Abstract: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

Abstract translation: 本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。