公开(公告)号：US20130104592A1

公开(公告)日：2013-05-02

申请号：US13664927

申请日：2012-10-31

Applicant: ABB Technology AG

Inventor： Didier COTTET ,  Francesco Agostini ,  Thomas Gradinger ,  Andreas Vögeli

IPC: F25D31/00 ,  F25B39/04 ,  F25B39/02 ,  F25D17/06 ,  F25D17/04

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  F28F9/26 ,  H05K7/20936

Abstract: The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.

Abstract translation: 本公开涉及电气和/或电子部件的冷却，特别是涉及具有机柜的电气和/或电子系统，其包括具有用于接收冷却空气流的第一孔的机壳外壳。 机柜壳体包括用于在机柜的操作状态之后释放冷却空气的第二孔。 在机柜中设置至少两个模块，每个模块包括具有入口和出口的引导结构。 至少两个模块布置在机柜壳体中，使得流过机柜壳体的第一孔的大部分冷却空气的分支能够经由引导结构通过专用模块引导的入口流入每个模块 到出口，然后通过第二孔从机柜外壳中取出。

公开(公告)号：US09232685B2

公开(公告)日：2016-01-05

申请号：US14025135

申请日：2013-09-12

Applicant: ABB Technology AG

Inventor： Mathieu Habert ,  Oscar Apeldoorn ,  Thomas Gradinger

IPC: H05K7/20 ,  H01L23/427 ,  H01L23/473

CPC classification number: H05K7/20927 ,  H01L23/4006 ,  H01L23/4012 ,  H01L23/427 ,  H01L23/467 ,  H01L23/473 ,  H01L2023/4025 ,  H01L2023/4031 ,  H01L2924/0002 ,  H02M7/483 ,  H01L2924/00

Abstract: An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electronics module, a second power electronics element that generates a second heat flow during operation of the power electronics module. The first cooler is in thermal contact with the first power electronics element to receive at least part of the first heat flow. The second cooler is in thermal contact with the second power electronics element to receive at least part of the second heat flow. A heat exchanger is configured to transmit at least part of the first heat flow and the second heat flow to a primary cooling flow and transfer heat flow in a thermally efficient manner. A magnitude of the heat flow is less than a total magnitude that is formed from a maximum first heat flow and a maximum second heat flow.

Abstract translation: 示例性的电力电子模块包括在电力电子模块的操作期间产生第一热流的第一电力电子元件，在电力电子模块的运行期间产生第二热流的第二电力电子元件。 第一冷却器与第一电力电子元件热接触以接收第一热流的至少一部分。 第二冷却器与第二电力电子元件热接触以接收第二热流的至少一部分。 热交换器被配置为将至少一部分第一热流和第二热流传递到主冷却流并以热效率的方式传递热流。 热流的大小小于由最大第一热流和最大第二热流形成的总量。

公开(公告)号：US09113579B2

公开(公告)日：2015-08-18

申请号：US13664927

申请日：2012-10-31

Applicant: ABB Technology AG

Inventor： Didier Cottet ,  Francesco Agostini ,  Thomas Gradinger ,  Andreas Vögeli

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  F28F9/26 ,  H05K7/20936

Abstract: The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.

Abstract translation: 本公开涉及电气和/或电子部件的冷却，特别是涉及具有机柜的电气和/或电子系统，其包括具有用于接收冷却空气流的第一孔的机壳外壳。 机柜壳体包括用于在机柜的操作状态之后释放冷却空气的第二孔。 在机柜中设置至少两个模块，每个模块包括具有入口和出口的引导结构。 至少两个模块布置在机柜壳体中，使得流过机柜壳体的第一孔的大部分冷却空气的分支能够经由引导结构通过专用模块引导的入口流入每个模块 到出口，然后通过第二孔从机柜外壳中取出。

公开(公告)号：US09113578B2

公开(公告)日：2015-08-18

申请号：US13664878

申请日：2012-10-31

Applicant: ABB Technology AG

Inventor： Didier Cottet ,  Francesco Agostini ,  Thomas Gradinger ,  Andreas Vögeli

IPC: H05K7/20 ,  H01L23/473 ,  H02M7/483 ,  H02M7/00

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  H02M7/003 ,  H02M2007/4835 ,  H05K7/20936

Abstract: A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.

Abstract translation: 提供了一种用于冷却包括电和/或电子系统的模块的电气和/或电子部件的热虹吸管冷却器装置。 模块包括导向结构和用于接收冷却空气流的入口，以及此后在模块的操作状态下释放冷却空气的出口。 引导结构用于引导通过入口进入的冷却空气，并在模块的操作状态下使模块通过出口。 模块包括具有蒸发器的热虹吸管冷却器和用于在模块的运行状态下将大部分热负荷转移到冷却空气的冷凝器。 蒸发器相对于冷凝器倾斜，其中冷凝器布置成使得大部分冷却空气流过冷凝器。

公开(公告)号：US20130340978A1

公开(公告)日：2013-12-26

申请号：US13923053

申请日：2013-06-20

Applicant: ABB TECHNOLOGY AG

Inventor： Francesco AGOSTINI ,  Matteo Fabbri ,  Thomas Gradinger

IPC: H05K7/20

CPC classification number: H05K7/20309 ,  F28D15/0266 ,  F28D15/0275 ,  F28F3/14 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20318 ,  H05K7/20936 ,  H01L2924/00

Abstract: A two-phase heat exchanger for cooling at least one electronic and/or electric component includes an evaporator and a condenser. The evaporator transfers heat from the electronic and/or electric component to a working fluid. The condenser includes a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided to convey heat by convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.

Abstract translation: 用于冷却至少一个电子和/或电气部件的两相热交换器包括蒸发器和冷凝器。 蒸发器将热量从电子和/或电气部件传递到工作流体。 冷凝器包括辊式接合面板，其具有具有第一连接端口和第二连接端口的第一通道。 蒸发器具有第二通道和第一连接开口和第二连接开口。 第一通道的第一连接端口连接到蒸发器的一个第一连接开口，并且第一通道的第二连接端口连接到蒸发器的一个第二连接开口，并且提供工作流体以通过对流从 蒸发器通过从第二通道流过蒸发器的第一连接开口或第二连接开口朝向第一通道流到冷凝器。