公开(公告)号：US09607924B2

公开(公告)日：2017-03-28

申请号：US14824871

申请日：2015-08-12

Applicant: ABB Technology Oy

Inventor： Daniel Kearney ,  Francesco Agostini ,  Didier Cottet ,  Daniele Torresin ,  Mathieu Habert

IPC: H01L23/34 ,  H01L23/473 ,  H01L23/538 ,  H05K1/02 ,  H01L23/31 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L23/473 ,  H01L23/3121 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0116 ,  H05K2201/064 ,  H01L2924/00

Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

公开(公告)号：US20160079156A1

公开(公告)日：2016-03-17

申请号：US14827884

申请日：2015-08-17

Applicant: ABB Technology Oy

Inventor： Chunlei Liu ,  Didier Cottet ,  Franziska Brem ,  Slavo Kicin

IPC: H01L23/498 ,  H01L25/07 ,  H01L21/48 ,  H01L23/367 ,  H01L25/00 ,  H01L23/495 ,  H01L25/18

CPC classification number: H01L23/49861 ,  H01L21/4821 ,  H01L21/4846 ,  H01L23/142 ,  H01L23/3675 ,  H01L23/492 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/071 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8384 ,  H01L2224/92244 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/00

Abstract: The present disclosure describes a power electronics module comprising a lead frame in which a chip of a first semiconductor device is embedded, a first PCB mounted on top of the lead frame and the chip of the first semiconductor device, and a support frame mounted on top of the PCB, the support frame comprising a cavity in which the chip of a second semiconductor device is embedded, wherein the chips of the first semiconductor device and the second semiconductor device are positioned on top of each other, and the first PCB comprises a first electrically conducting path between the chips of the first semiconductor device and the second semiconductor device.

Abstract translation: 本公开描述了一种电力电子模块，其包括引线框架，其中嵌入有第一半导体器件的芯片，安装在引线框架的顶部上的第一PCB和第一半导体器件的芯片，以及安装在顶部的支撑框架 所述支撑框架包括其中嵌入有第二半导体器件的芯片的空腔，其中所述第一半导体器件和所述第二半导体器件的芯片位于彼此的顶部，并且所述第一PCB包括第一 在第一半导体器件的芯片与第二半导体器件之间的导电路径。

公开(公告)号：US20160049354A1

公开(公告)日：2016-02-18

申请号：US14824871

申请日：2015-08-12

Applicant: ABB Technology Oy

Inventor： Daniel Kearney ,  Francesco Agostini ,  Didier Cottet ,  Daniele Torresin ,  Mathieu Habert

IPC: H01L23/473 ,  H01L23/31

CPC classification number: H01L23/473 ,  H01L23/3121 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0116 ,  H05K2201/064 ,  H01L2924/00

Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

Abstract translation: 本公开涉及一种包括印刷电路板（PCB）的功率半导体模块以及冷却这种功率半导体模块的方法。 该模块包括功率半导体器件和嵌入印刷电路板的导热泡沫岛。 功率半导体器件和导热泡沫岛位于彼此的顶部，岛被布置成形成冷却功率半导体器件的流动冷却剂的路径。