公开(公告)号：US20240114658A1

公开(公告)日：2024-04-04

申请号：US17956799

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHRISTOPHER M. HELBERG ,  CHRISTOPHER M. JAGGERS ,  ROBERT EDWARD RADKE ,  MUSTANSIR M. PRATAPGARHWALA ,  MICHAEL J. AUSTIN ,  SUKESH SHENOY

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20336 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20327 ,  G06F2200/201

Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

公开(公告)号：US20240111344A1

公开(公告)日：2024-04-04

申请号：US17956821

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： MICHAEL J. AUSTIN ,  CHRISTOPHER M. HELBERG ,  SUKESH SHENOY ,  CHRISTOPHER M. JAGGERS

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K7/2039

Abstract: An apparatus for component cooling includes a thermoelectric cooling (TEC) device configured to be thermally coupled to a first processor, and a controller. The controller is configured to receive at least one first parameter indicative of a first activity level of the first processor; determine a TEC power level from among a plurality of TEC power levels based on the at least one first parameter; and control providing of power to the TEC device at the determined TEC power level.

公开(公告)号：US20230205301A1

公开(公告)日：2023-06-29

申请号：US17564075

申请日：2021-12-28

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： ALEXANDER SABINO DUENAS ,  ASHWINI CHANDRASHEKHARA HOLLA ,  RAMAN M. SRINIVASAN ,  MICHAEL J. AUSTIN ,  XINZHE LI ,  JUN HUANG

IPC: G06F1/3234 ,  G06F1/3215

CPC classification number: G06F1/3234 ,  G06F1/3215

Abstract: Dynamic adjustment of power modes including: detecting an application identified in an application power policy; limiting an application power consumption of a computing component based on the application power policy; monitoring power consumption of a computing component; and selecting a power mode based on the monitored power consumption of the computing component and a power consumption threshold for each of a plurality of power modes.

公开(公告)号：US20220317747A1

公开(公告)日：2022-10-06

申请号：US17219020

申请日：2021-03-31

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： WONJE CHOI ,  MICHAEL J. AUSTIN ,  INDRANI PAUL ,  MEETA SRIVASTAV ,  ALEXANDER SABINO DUENAS

IPC: G06F1/26

Abstract: Power shifting based on bottleneck prediction, including: determining a first plurality of performance metrics for an accelerated processing unit (APU) and a second plurality of performance metrics for a graphics processing unit (GPU); providing the first plurality of performance metrics and the second plurality of performance metrics as an input to a model configured to identify one or more bottlenecks in the APU or the GPU; determining, based on an output of the model, a power distribution between the APU and the GPU; and applying the power distribution.