公开(公告)号：US10264672B2

公开(公告)日：2019-04-16

申请号：US15962076

申请日：2018-04-25

申请人： AGC Inc.

发明人： Shigetoshi Mori ,  Motoshi Ono ,  Mamoru Isobe ,  Kohei Horiuchi

IPC分类号： H01B17/56 ,  H05K1/03 ,  H05K1/11

摘要： A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.

公开(公告)号：US10442720B2

公开(公告)日：2019-10-15

申请号：US15276990

申请日：2016-09-27

申请人： AGC Inc.

发明人： Kohei Horiuchi ,  Motoshi Ono

IPC分类号： C03B33/08 ,  B23K26/073 ,  B23K26/0622 ,  B23K26/382 ,  B23K26/402 ,  B23K103/00

摘要： Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

公开(公告)号：US11541482B2

公开(公告)日：2023-01-03

申请号：US16660599

申请日：2019-10-22

申请人： AGC Inc.

发明人： Mamoru Isobe ,  Shigetoshi Mori ,  Kohei Horiuchi

IPC分类号： B23K26/02 ,  B23K26/36 ,  B23K26/38 ,  B23K26/40 ,  B23K26/362 ,  B23K26/382 ,  B23K26/402 ,  H01L23/15 ,  B23K26/70 ,  B23K103/00 ,  C03C15/00 ,  B23K26/60

摘要： A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

公开(公告)号：US10531566B2

公开(公告)日：2020-01-07

申请号：US16030216

申请日：2018-07-09

申请人： AGC Inc.

发明人： Mamoru Isobe ,  Motoshi Ono ,  Shigetoshi Mori ,  Kohei Horiuchi

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  B23K26/046 ,  B23K26/064 ,  B23K26/382 ,  B23K26/402 ,  B23K26/142

摘要： A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 μm or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.

公开(公告)号：US11964344B2

公开(公告)日：2024-04-23

申请号：US17120717

申请日：2020-12-14

申请人： AGC Inc.

发明人： Mamoru Isobe ,  Kohei Horiuchi

IPC分类号： B23K26/384 ,  B23K26/0622 ,  B23K26/402 ,  B23K26/50 ,  B23K103/00 ,  C03C15/00

CPC分类号： B23K26/384 ,  B23K26/0624 ,  B23K26/402 ,  B23K26/50 ,  C03C15/00 ,  B23K2103/54

摘要： A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.

公开(公告)号：US11802080B2

公开(公告)日：2023-10-31

申请号：US17813372

申请日：2022-07-19

申请人： AGC Inc.

发明人： Yuha Kobayashi ,  Shigeto Kumano ,  Kaede Katsuno ,  Keisuke Hanashima ,  Kohei Horiuchi

IPC分类号： B32B3/00 ,  C03C23/00

CPC分类号： C03C23/0025

摘要： A glass substrate 10 has a mark provided on a surface 10A of the glass substrate 10, the mark including plural dots 104, a depth H of each of the dots 104 is 0.5 μm or larger and 7.0 μm or smaller, and an inclination angle of a side surface 104B of each of the dots 104 is 5° or larger and 56° or smaller.