公开(公告)号：US12142456B2

公开(公告)日：2024-11-12

申请号：US17638777

申请日：2020-08-20

Applicant: ASML Netherlands B.V.

Inventor： Jinmei Yang ,  Jian Zhang ,  Zhiwen Kang ,  Yixiang Wang

IPC: H01J37/28 ,  G01N23/2251 ,  H01J37/26

Abstract: A sensor may be used to measure a degree of tilt of a sample. The sensor may include an apparatus having a light source, first, second, and third optical elements, a lens, and an aperture. The first optical element may supply light from the light source toward the sample, and may supply light input into the first optical element from the sample toward the second optical element. The second optical element may supply light toward first and second sensing elements. An aperture may be arranged on a focal plane of the lens. A light beam incident on the first sensing element may be a reference beam.

公开(公告)号：US12125669B2

公开(公告)日：2024-10-22

申请号：US18362757

申请日：2023-07-31

Applicant: ASML Netherlands B.V.

Inventor： Ning Ye ,  Jun Jiang ,  Jian Zhang ,  Yixiang Wang

IPC: H01J37/28 ,  H01J37/244 ,  H01J37/26

CPC classification number: H01J37/28 ,  H01J37/244 ,  H01J37/265 ,  H01J2237/0047 ,  H01J2237/2817

Abstract: Apparatuses, systems, and methods for providing beams for controlling charges on a sample surface of charged particle beam system. In some embodiments, a module comprising a laser source configured to emit a beam. The beam may illuminate an area adjacent to a pixel on a wafer to indirectly heat the pixel to mitigate a cause of a direct photon-induced effect at the pixel. An electron beam tool configured to detect a defect in the pixel, wherein the defect is induced by the indirect heating of the pixel.

公开(公告)号：US11815473B2

公开(公告)日：2023-11-14

申请号：US16812109

申请日：2020-03-06

Applicant: ASML Netherlands B.V.

Inventor： Kuo-Feng Tseng ,  Zhonghua Dong ,  Yixiang Wang ,  Zhong-wei Chen

IPC: G01N23/203 ,  G01N23/2252 ,  G01N23/2254 ,  G01N23/2276

CPC classification number: G01N23/203 ,  G01N23/2252 ,  G01N23/2254 ,  G01N23/2276 ,  G01N2223/309 ,  G01N2223/33

Abstract: Disclosed herein is an apparatus comprising: a source configured to emit charged particles, an optical system and a stage; wherein the stage is configured to support a sample thereon and configured to move the sample by a first distance in a first direction; wherein the optical system is configured to form probe spots on the sample with the charged particles; wherein the optical system is configured to move the probe spots by the first distance in the first direction and by a second distance in a second direction, simultaneously, while the stage moves the sample by the first distance in the first direction; wherein the optical system is configured to move the probe spots by the first distance less a width of one of the probe spots in an opposite direction of the first direction, after the stage moves the sample by the first distance in the first direction.

公开(公告)号：US11183360B2

公开(公告)日：2021-11-23

申请号：US16650815

申请日：2018-09-25

Applicant: ASML Netherlands B.V.

Inventor： Jian Zhang ,  Zhiwen Kang ,  Yixiang Wang

IPC: H01J37/22 ,  H01J37/244

Abstract: An optical system used in a charged particle beam inspection system. The optical system includes one or more optical lenses, and a compensation lens configured to compensate a drift of a focal length of a combination of the one or more optical lenses from a first medium to a second medium.

公开(公告)号：US11164719B2

公开(公告)日：2021-11-02

申请号：US16651337

申请日：2018-09-25

Applicant: ASML Netherlands B.V.

Inventor： Yixiang Wang ,  Frank Nan Zhang

IPC: H01J37/28 ,  H01J37/26 ,  G01N23/203 ,  G01N23/2251

Abstract: Disclosed herein is a method comprising: depositing a first amount of electric charges into a region of a sample, during a first time period; depositing a second amount of electric charges into the region, during a second time period; while scanning a probe spot generated on the sample by a beam of charged particles, recording from the probe spot signals representing interactions of the beam of charged particles and the sample; wherein an average rate of deposition during the first time period and an average rate of deposition during the second time period are different.

公开(公告)号：US12087542B2

公开(公告)日：2024-09-10

申请号：US17516654

申请日：2021-11-01

Applicant: ASML Netherlands B.V.

Inventor： Yixiang Wang ,  Frank Nan Zhang

IPC: H01J37/28 ,  G01N23/203 ,  G01N23/2251 ,  H01J37/26

CPC classification number: H01J37/28 ,  G01N23/203 ,  G01N23/2251 ,  H01J37/261 ,  H01J2237/0048 ,  H01J2237/2817

Abstract: Disclosed herein is a method comprising depositing a first amount of electric charges into a region of a sample, during a first time period; depositing a second amount of electric charges into the region, during a second time period; while scanning a probe spot generated on the sample by a beam of charged particles, recording from the probe spot signals representing interactions of the beam of charged particles and the sample; wherein an average rale of deposition during the first time period, and an average rate of deposition during the second time period are different.

公开(公告)号：US12072181B2

公开(公告)日：2024-08-27

申请号：US17487896

申请日：2021-09-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Yan Wang ,  Jian Zhang ,  Zhiwen Kang ,  Yixiang Wang

IPC: G01B15/08 ,  H01J37/20 ,  H01J37/21 ,  H01J37/22 ,  H01J37/28

CPC classification number: G01B15/08 ,  H01J37/20 ,  H01J37/21 ,  H01J37/222 ,  H01J37/28 ,  H01J2237/20235 ,  H01J2237/2814

Abstract: An inspection apparatus for adjusting a working height for a substrate for multiple target heights is disclosed. The inspection apparatus includes a radiation source configured to provide a radiation beam and a beam splitter configured to split the radiation beam into multiple beamlets that each reflect off a substrate. Each beamlet contains light of multiple wavelengths. The inspection apparatus includes multiple light reflecting components, wherein each light reflecting component is associated with one of the beamlets reflecting off the substrate and is configured to support a different target height for the substrate by detecting a height or a levelness of the substrate based on the beamlet reflecting off the substrate.

公开(公告)号：US11581161B2

公开(公告)日：2023-02-14

申请号：US16727706

申请日：2019-12-26

Applicant: ASML Netherlands B.V.

Inventor： Jie Fang ,  Yixiang Wang ,  Qirong Zhang ,  Haojie Zhang ,  Jinmei Yang ,  Fenghui Zhu

IPC: H01J37/26 ,  C25F3/14

Abstract: A method of processing a workpiece may include forming a first layer on a first side of a base layer. The base layer may be part of a substrate including a plurality of layers. The method may also include forming a second layer on the first layer. A material of the second layer may include metal. The method may also include forming an opening in the second layer, forming an opening in the first layer by etching, and removing the second layer. The method may include dry etching of the first layer.

公开(公告)号：US10784077B2

公开(公告)日：2020-09-22

申请号：US16053636

申请日：2018-08-02

Applicant: ASML Netherlands B.V.

Inventor： Frank Nan Zhang ,  Zhongwei Chen ,  Yixiang Wang ,  Ying Crystal Shen

IPC: H01J37/26 ,  H01J37/04 ,  H01J37/28

Abstract: Systems and methods for implementing charged particle flooding in a charged particle beam apparatus are disclosed. According to certain embodiments, a charged particle beam system includes a charged particle source and a controller which controls the charged particle beam system to emit a charged particle beam in a first mode where the beam is defocused and a second mode where the beam is focused on a surface of a sample.

公开(公告)号：US12217927B2

公开(公告)日：2025-02-04

申请号：US17633556

申请日：2020-08-04

Applicant: ASML NETHERLANDS B.V.

Inventor： Jian Zhang ,  Ning Ye ,  Zhiwen Kang ,  Yixiang Wang

IPC: H01J37/26 ,  G02B27/09 ,  H01J37/02 ,  H01J37/28

Abstract: A system and a method for manipulating a beam of an Advanced Charge Controller module in different planes in an e-beam system are provided. Some embodiments of the system include a lens system configured to manipulate a beam in the tangential plane and the sagittal plane such that the beam spot is projected onto the wafer with high luminous energy. Some embodiments of the system include a lens system comprising at least two cylindrical lens.