公开(公告)号：US20240347909A1

公开(公告)日：2024-10-17

申请号：US18134514

申请日：2023-04-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q5/307 ,  H01Q15/00 ,  H01Q21/06

CPC classification number: H01Q5/307 ,  H01Q15/0013 ,  H01Q21/065 ,  H01Q19/062

Abstract: The present disclosure provides an antenna package structure, including a first antenna and a first frequency selective surface structure. The first frequency selective surface structure is disposed above the first antenna, and includes a plurality of first patterns and a plurality of second patterns geometrically distinct from the plurality of the first patterns. The plurality of first patterns and the plurality of second patterns are configured to enhance gain and directivity of the first antenna.

公开(公告)号：US20200381369A1

公开(公告)日：2020-12-03

申请号：US16996872

申请日：2020-08-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen Hung HUANG ,  Yan Wen CHUNG ,  Huei-Shyong CHO

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/552 ,  H01L23/66 ,  H01L21/66 ,  H01L21/683

Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.

公开(公告)号：US20190164916A1

公开(公告)日：2019-05-30

申请号：US16262768

申请日：2019-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01L23/66 ,  H01Q19/28 ,  H01Q19/08 ,  H01Q13/02 ,  H01P3/12 ,  H01Q13/08 ,  H01Q1/22 ,  H01P3/08 ,  H01L23/31 ,  H01L23/498

Abstract: An antenna semiconductor package device includes: (1) a waveguide cavity having a radiation opening; and (2) a first directing element outside of the waveguide cavity and separated from the waveguide cavity by a first gap.

公开(公告)号：US20250038136A1

公开(公告)日：2025-01-30

申请号：US18916604

申请日：2024-10-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Nan LIN ,  Wei-Tung CHANG ,  Jen-Chieh KAO ,  Huei-Shyong CHO

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01Q1/22 ,  H01Q1/24

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

公开(公告)号：US20210050649A1

公开(公告)日：2021-02-18

申请号：US16538592

申请日：2019-08-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q1/22 ,  H01Q9/04 ,  H01L23/31 ,  H01Q1/38 ,  H01L23/66

Abstract: A semiconductor device package includes a substrate, a first antenna and a second antenna. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The first antenna pattern has a first port configured to generate a magnetic field. The second antenna pattern is disposed over the first surface of the substrate. The second antenna pattern has a second bandwidth different from the first bandwidth. A prolonged line of an edge of the first antenna pattern parallel to the magnetic field generated by the first port of the first antenna pattern is spaced apart from the second antenna pattern.

公开(公告)号：US20200279804A1

公开(公告)日：2020-09-03

申请号：US16289156

申请日：2019-02-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen Hung HUANG ,  Huei-Shyong CHO ,  Jhao-Yang CHEN

IPC: H01L23/522 ,  H01L25/16 ,  H01L23/00 ,  H01L23/528 ,  H01L21/66 ,  H01L21/768

Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, an intermediate layer and at least one lower through via. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the upper dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The lower through via extends through at least a portion of the lower conductive structure and the intermediate layer, and is electrically connected to the upper circuit layer of the upper conductive structure.

公开(公告)号：US20240275061A1

公开(公告)日：2024-08-15

申请号：US18108498

申请日：2023-02-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q13/10 ,  H01P3/08 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01Q13/10 ,  H01P3/08 ,  H05K1/0243 ,  H05K1/115 ,  H05K2201/10098

Abstract: The present disclosure provides an electronic device. The electronic device includes a radio frequency (RF) circuit region and an antenna region. The RF circuit region has a first circuit density. The antenna region includes a circuit structure. The circuit structure defines a waveguide. The circuit structure has a second circuit density less than the first circuit density.

公开(公告)号：US20240038678A1

公开(公告)日：2024-02-01

申请号：US17877796

申请日：2022-07-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Yu CHEN ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01L23/552 ,  H01L25/10 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/552 ,  H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/162

Abstract: The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.

公开(公告)号：US20200098709A1

公开(公告)日：2020-03-26

申请号：US16453780

申请日：2019-06-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Nan LIN ,  Wei-Tung CHANG ,  Jen-Chieh KAO ,  Huei-Shyong CHO

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01Q1/22

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

公开(公告)号：US20240347921A1

公开(公告)日：2024-10-17

申请号：US18134511

申请日：2023-04-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q15/00 ,  H01Q1/22 ,  H01Q1/38

CPC classification number: H01Q15/0013 ,  H01Q1/2283 ,  H01Q1/38

Abstract: The present disclosure provides an antenna package structure, which includes antenna and a transmitting structure. The transmitting structure includes a first dielectric material and a second dielectric material of different dielectric constants, and a frequency selective surface unit. The first dielectric layer and the second dielectric layer are configured to focus the electromagnetic wave radiated between the antenna and the frequency selective surface unit.