公开(公告)号：US20050156308A1

公开(公告)日：2005-07-21

申请号：US11038574

申请日：2005-01-21

申请人： Anton Legen ,  Jochen Thomas ,  Ingo Wennemuth

发明人： Anton Legen ,  Jochen Thomas ,  Ingo Wennemuth

IPC分类号： H01L21/44 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/495 ,  H01L23/50 ,  H01L25/065 ,  H01R12/50

CPC分类号： H01L24/10 ,  H01L23/495 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00

摘要： Connecting elements on semiconductor chips for semiconductor components and methods for producing connecting elements provide electrical connections between contact areas of a semiconductor chip and contact pads of a superordinate circuit board. The connecting elements have a bent metal strip with two metal limbs with flattened limb ends. One of the two limb ends is electrically connected to the contact areas, while the second limb end is elastically supported on the top side of the semiconductor chip.

摘要翻译： 用于半导体部件的半导体芯片上的连接元件和用于制造连接元件的方法提供半导体芯片的接触区域和上级电路板的接触焊盘之间的电连接。 连接元件具有弯曲的金属条带，具有两个具有扁平端部的金属四肢。 两个肢端中的一个电连接到接触区域，而第二肢端部弹性地支撑在半导体芯片的顶侧上。

公开(公告)号：US07253514B2

公开(公告)日：2007-08-07

申请号：US11038574

申请日：2005-01-21

申请人： Anton Legen ,  Jochen Thomas ,  Ingo Wennemuth

发明人： Anton Legen ,  Jochen Thomas ,  Ingo Wennemuth

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L23/50 ,  H01L23/52 ,  H01R12/02

CPC分类号： H01L24/10 ,  H01L23/495 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00

摘要： A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for contacting and providing electrical connectivity to a plurality of contact pads of a superordinate circuit board. At least one of the two limb ends is electrically connected to the contact areas of a semiconductor chip, while the other limb end is elastically supported on the top side of the semiconductor chip, thereby enabling the connecting element to be self supporting.

摘要翻译： 用于电连接半导体芯片和上级电路板的连接元件包括弹性金属条，其弯曲形成具有扁平的端部的两个金属片，从而在金属片之间形成底座，金属片适于接触并提供与 多个上位电路板的接触焊盘。 两个肢端中的至少一个电连接到半导体芯片的接触区域，而另一个肢端部弹性地支撑在半导体芯片的顶侧，从而使得连接元件能够自支撑。

公开(公告)号：US07781900B2

公开(公告)日：2010-08-24

申请号：US11630930

申请日：2005-06-09

申请人： Manuel Carmona ,  Anton Legen ,  Ingo Wennemuth

发明人： Manuel Carmona ,  Anton Legen ,  Ingo Wennemuth

IPC分类号： H01L23/29 ,  H01L23/28

CPC分类号： H01L23/427 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/00

摘要： One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.

摘要翻译： 本发明的一个方面涉及一种半导体器件，其包括壳体和部分地嵌入在塑料外壳组合物中的半导体芯片。 另一方面涉及其制造方法。 塑料外壳组合物具有至少一种具有软化温度的主体组分和具有相变温度的掺入组分。 在这种情况下，主体成分的软化温度大于引入成分的相变温度。

公开(公告)号：US20080111231A1

公开(公告)日：2008-05-15

申请号：US11630930

申请日：2005-06-09

申请人： Manuel Carmona ,  Anton Legen ,  Ingo Wennemuth

发明人： Manuel Carmona ,  Anton Legen ,  Ingo Wennemuth

IPC分类号： H01L23/14 ,  H01L21/02

CPC分类号： H01L23/427 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/00

摘要： One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.

摘要翻译： 本发明的一个方面涉及一种半导体器件，其包括壳体和部分地嵌入在塑料外壳组合物中的半导体芯片。 另一方面涉及其制造方法。 塑料外壳组合物具有至少一种具有软化温度的主体组分和具有相变温度的掺入组分。 在这种情况下，主体成分的软化温度大于引入成分的相变温度。

公开(公告)号：US06894381B2

公开(公告)日：2005-05-17

申请号：US10738071

申请日：2003-12-17

申请人： Wolfgang Hetzel ,  Anton Legen ,  Jochen Thomas

发明人： Wolfgang Hetzel ,  Anton Legen ,  Jochen Thomas

IPC分类号： H01L23/31 ,  H01L25/065 ,  H01L23/02

CPC分类号： H01L23/3114 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention relates to an electronic device having a stack of semiconductor chips, and to a method for the production thereof. A first semiconductor chip is arranged on a rewiring substrate, and at least one semiconductor stack chip is arranged on the first semiconductor chip. A rewiring plane is arranged between the semiconductor chips. The contact areas of the semiconductor chips are connected to external contacts of the device by the rewiring plane and the rewiring substrate.

摘要翻译： 本发明涉及一种具有半导体芯片堆叠的电子设备及其生产方法。 第一半导体芯片布置在重新布线基板上，并且至少一个半导体堆叠芯片布置在第一半导体芯片上。 半导体芯片之间布置有重新布线平面。 半导体芯片的接触区域通过重新布线平面和重新布线基板连接到器件的外部触点。

公开(公告)号：US20070217160A1

公开(公告)日：2007-09-20

申请号：US11687677

申请日：2007-03-19

申请人： Anton Legen ,  Lutz Morgenroth ,  Klaus Neumaier ,  Steve Wood

发明人： Anton Legen ,  Lutz Morgenroth ,  Klaus Neumaier ,  Steve Wood

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module includes a cooling element with a board. The board includes a surface on which at least one first electronic component and at least one second electronic component are arranged, a cooling element that is arranged on the surface of the board and includes first and second sections extending in a first direction. At least one stabilizing element that extends in the first direction is arranged at first and second ends of the first section of the cooling element. A surface of the first section of the cooling element is at a first distance from the surface of the board and a surface of the second section of the cooling element is at a second distance from the surface of the board, the first distance being different from the second distance.

摘要翻译： 存储器模块包括具有板的冷却元件。 所述板包括其上布置有至少一个第一电子部件和至少一个第二电子部件的表面;布置在所述板的表面上并且包括沿第一方向延伸的第一部分和第二部分的冷却元件。 至少一个在第一方向上延伸的稳定元件布置在冷却元件的第一部分的第一和第二端。 冷却元件的第一部分的表面距离板的表面第一距离，并且冷却元件的第二部分的表面距离板的表面为第二距离，第一距离不同于 第二个距离。

公开(公告)号：US07256070B2

公开(公告)日：2007-08-14

申请号：US11155317

申请日：2005-06-17

申请人： Martin Reiss ,  Anton Legen ,  Manuel Carmona ,  Kerstin Nocke

发明人： Martin Reiss ,  Anton Legen ,  Manuel Carmona ,  Kerstin Nocke

IPC分类号： H01L21/00

CPC分类号： H01L23/3114 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/564 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.

摘要翻译： 本发明涉及具有半导体芯片的电子部件，其连接到载体基板并被壳体包围，其基于呈现基于基板的容纳的电子部件，其能够连续释放内部蒸汽压力 当电子部件被加热时产生，同时可以使用已知和经过试验的方法和材料廉价地生产。 根据本发明的实施例，这是通过以下事实来实现的：载体基板包括在两侧开口的多个中空通孔，该通孔分布在载体基板的至少一个部分中，所述至少一个部分被壳体覆盖 。

公开(公告)号：US07796393B2

公开(公告)日：2010-09-14

申请号：US11954186

申请日：2007-12-11

申请人： Anton Legen ,  Steve Wood

发明人： Anton Legen ,  Steve Wood

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  Y10T403/13 ,  H01L2924/00

摘要： A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted to spread apart the first and second side parts by mechanical pressure action on mutually opposite sides of the first and second side parts, so as to be able to guide a predetermined region of the module between the first and second side parts.

摘要翻译： 可以使用一种装置将冷却元件施加到模块上。 冷却元件具有与第一侧部相对的第一侧部和第二侧部。 第一和第二侧部分通过一个区域连接。 该装置包括一个扩展器，其适用于通过在第一和第二侧部的相互相对的两侧上的机械压力作用来分开第一和第二侧部，以便能够将模块的预定区域引导到第一 和第二侧面部分。

公开(公告)号：US20090251857A1

公开(公告)日：2009-10-08

申请号：US12098801

申请日：2008-04-07

申请人： Anton Legen ,  Steve Wood ,  Lutz Morgenroth

发明人： Anton Legen ,  Steve Wood ,  Lutz Morgenroth

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4093 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system including an electronic module with a heat spreader. One embodiment provides a plate including a thermally conductive material and a guiding member arranged along an edge of the plate. The plate and the guiding member of the heat spreader are configured to form, when attached to a first memory module, together with another heat spreader attached to a second memory module or together with a wall of another device, a duct channeling a flow of a coolant.

摘要翻译： 一种包括具有散热器的电子模块的系统。 一个实施例提供了一种板，其包括导热材料和沿板的边缘布置的引导构件。 散热器的板和引导构件被配置成当附接到第一存储器模块时，与附接到第二存储器模块的另一散热器或与另一个装置的壁一起形成导管 冷却液

公开(公告)号：US20090135565A1

公开(公告)日：2009-05-28

申请号：US11954186

申请日：2007-12-11

申请人： Anton Legen ,  Steve Wood

发明人： Anton Legen ,  Steve Wood

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  Y10T403/13 ,  H01L2924/00

摘要： A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted to spread apart the first and second side parts by mechanical pressure action on mutually opposite sides of the first and second side parts, so as to be able to guide a predetermined region of the module between the first and second side parts.

摘要翻译： 可以使用一种装置将冷却元件施加到模块上。 冷却元件具有与第一侧部相对的第一侧部和第二侧部。 第一和第二侧部分通过一个区域连接。 该装置包括一个扩展器，其适用于通过在第一和第二侧部的相互相对的两侧上的机械压力作用来分开第一和第二侧部，以便能够将模块的预定区域引导到第一 和第二侧面部分。