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公开(公告)号：US20200220098A1
公开(公告)日：2020-07-09
申请号：US16670071
申请日：2019-10-31
Applicant: Apple Inc.
Inventor： Tsung-Ting Tsai , Abbas Jamshidi Roudbari , Chuan-Sheng Wei , HanChi Ting , Jae Won Choi , Jianhong Lin , Nai-Chih Kao , Shih Chang Chang , Shin-Hung Yeh , Takahide Ishii , Ting-Kuo Chang , Yu Hung Chen , Yu-Wen Liu , Yu-Chuan Pai , Andrew Lin
Abstract: A display may have organic light-emitting diode pixels formed from thin-film circuitry. The thin-film circuitry may be formed in thin-film transistor (TFT) layers and the organic light-emitting diodes may include anodes and cathodes and an organic emissive layer formed over the TFT layers between the anodes and cathodes. The organic emissive layer may be formed via chemical evaporation techniques. The display may include moisture blocking structures such as organic emissive layer disconnecting structures that introduce one or more gaps in the organic emissive layer during evaporation so that any potential moisture permeating path from the display panel edge to the active area of the display is completely terminated.
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公开(公告)号：US20220181418A1
公开(公告)日：2022-06-09
申请号：US17504230
申请日：2021-10-18
Applicant: Apple Inc.
Inventor： Jung Yen Huang , Shinya Ono , Chin-Wei Lin , Akira Matsudaira , Cheng Min Hu , Chih Pang Chang , Ching-Sang Chuang , Gihoon Choo , Jiun-Jye Chang , Po-Chun Yeh , Shih Chang Chang , Yu-Wen Liu , Zino Lee
IPC: H01L27/32 , H01L29/786 , H01L29/66
Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated semiconducting oxide transistors. The semiconducting oxide transistors may exhibit different device characteristics. Some of the semiconducting oxide transistors may be formed using a first oxide layer formed from a first semiconducting oxide material using first processing steps, whereas other semiconducting oxide transistors are formed using a second oxide layer formed from a second semiconducting oxide material using second processing steps different than the first processing steps. The display may include three or more different semiconducting oxide layers formed during different processing steps.
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公开(公告)号：US10224238B2
公开(公告)日：2019-03-05
申请号：US15268106
申请日：2016-09-16
Applicant: Apple Inc.
Inventor： Chang Ming Lu , Chia-Yu Chen , Chih Pang Chang , Ching-Sang Chuang , Hung-Che Ting , Jung Yen Huang , Sheng Hui Shen , Shih Chang Chang , Tsung-Hsiang Shih , Yu-Wen Liu , Yu Hung Chen , Kai-Chieh Wu , Lun Tsai , Takahide Ishii , Chung-Wang Lee , Hsing-Chuan Wang , Chin Wei Hsu , Fu-Yu Teng
IPC: H01L21/768 , H01L21/02 , H01L21/027 , H01L21/77
Abstract: A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.
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Patent Agency Ranking
公开(公告)号：US12096657B2
公开(公告)日：2024-09-17
申请号：US17504230
申请日：2021-10-18
Applicant: Apple Inc.
Inventor： Jung Yen Huang , Shinya Ono , Chin-Wei Lin , Akira Matsudaira , Cheng Min Hu , Chih Pang Chang , Ching-Sang Chuang , Gihoon Choo , Jiun-Jye Chang , Po-Chun Yeh , Shih Chang Chang , Yu-Wen Liu , Zino Lee
IPC: H01L27/32 , H01L29/66 , H01L29/786 , H10K59/121 , H10K59/12
CPC classification number: H10K59/1213 , H01L29/66742 , H01L29/7869 , H10K59/1216 , H10K59/1201
Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated semiconducting oxide transistors. The semiconducting oxide transistors may exhibit different device characteristics. Some of the semiconducting oxide transistors may be formed using a first oxide layer formed from a first semiconducting oxide material using first processing steps, whereas other semiconducting oxide transistors are formed using a second oxide layer formed from a second semiconducting oxide material using second processing steps different than the first processing steps. The display may include three or more different semiconducting oxide layers formed during different processing steps.
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公开(公告)号：US11818912B2
公开(公告)日：2023-11-14
申请号：US16670071
申请日：2019-10-31
Applicant: Apple Inc.
Inventor： Tsung-Ting Tsai , Abbas Jamshidi Roudbari , Chuan-Sheng Wei , HanChi Ting , Jae Won Choi , Jianhong Lin , Nai-Chih Kao , Shih Chang Chang , Shin-Hung Yeh , Takahide Ishii , Ting-Kuo Chang , Yu Hung Chen , Yu-Wen Liu , Yu-Chuan Pai , Andrew Lin
IPC: H10K50/84 , H10K71/00 , H10K71/18 , H10K59/12 , H10K59/124
CPC classification number: H10K50/841 , H10K59/12 , H10K71/00 , H10K71/18 , H10K59/124 , H10K71/821
Abstract: A display may have organic light-emitting diode pixels formed from thin-film circuitry. The thin-film circuitry may be formed in thin-film transistor (TFT) layers and the organic light-emitting diodes may include anodes and cathodes and an organic emissive layer formed over the TFT layers between the anodes and cathodes. The organic emissive layer may be formed via chemical evaporation techniques. The display may include moisture blocking structures such as organic emissive layer disconnecting structures that introduce one or more gaps in the organic emissive layer during evaporation so that any potential moisture permeating path from the display panel edge to the active area of the display is completely terminated.
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公开(公告)号：US20230092986A1
公开(公告)日：2023-03-23
申请号：US17802102
申请日：2021-02-02
Applicant: Apple Inc.
Inventor： Warren S. Rieutort-Louis , Meng-Huan Ho , Abbas Jamshidi Roudbari , Chih Jen Yang , Chin Wei Hsu , Jae Won Choi , Jean-Pierre S. Guillou , Ming Xu , Rui Liu , Yi Qiao , Yu-Wen Liu , Yuchi Che , Yue Cui
Abstract: An electronic device may include a display and an optical sensor formed underneath the display. A pixel removal region on the display may at least partially overlap with the sensor. The pixel removal region may include a plurality of non-pixel regions each of which is devoid of thin-film transistors. The plurality of non-pixel regions is configured to increase the transmittance of light through the display to the sensor. In addition to removing thin-film transistors in the pixel removal region, additional layers in the display stack-up may be removed. In particular, a cathode layer, polyimide layer, and/or substrate in the display stack-up may be patterned to have an opening in the pixel removal region. A polarizer may be bleached in the pixel removal region for additional transmittance gains. The cathode layer may be removed using laser ablation with a spot laser or blanket illumination.
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公开(公告)号：US20250081730A1
公开(公告)日：2025-03-06
申请号：US18755498
申请日：2024-06-26
Applicant: Apple Inc.
Inventor： Andrew Lin , Alper Ozgurluk , Chao Liang Chien , Cheuk Chi Lo , Chia-Yu Chen , Chien-Chung Wang , Chih Pang Chang , Chih-Hung Yu , Chih-Wei Chang , Chin Wei Hsu , ChinWei Hu , Chun-Kai Tzeng , Chun-Ming Tang , Chun-Yao Huang , Hung-Che Ting , Jung Yen Huang , Lungpao Hsin , Shih Chang Chang , Tien-Pei Chou , Wen Sheng Lo , Yu-Wen Liu , Yung Da Lai
IPC: H10K59/121 , H10K59/131
Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.
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公开(公告)号：US20170294499A1
公开(公告)日：2017-10-12
申请号：US15268106
申请日：2016-09-16
Applicant: Apple Inc.
Inventor： Chang Ming Lu , Chia-Yu Chen , Chih Pang Chang , Ching-Sang Chuang , Hung-Che Ting , Jung Yen Huang , Sheng Hui Shen , Shih Chang Chang , Tsung-Hsiang Shih , Yu-Wen Liu , Yu Hung Chen , Kai-Chieh Wu , Lun Tsai , Takahide Ishii , Chung-Wang Lee , Hsing-Chuan Wang , Chin Wei Hsu , Fu-Yu Teng
IPC: H01L27/32 , H01L51/56 , H01L23/532 , H01L21/027 , H01L21/768 , H01L21/02
CPC classification number: H01L21/76834 , H01L21/02244 , H01L21/02252 , H01L21/02255 , H01L21/0273 , H01L21/7685 , H01L21/76877 , H01L21/77
Abstract: A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.
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