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公开(公告)号:US11848226B2
公开(公告)日:2023-12-19
申请号:US17183146
申请日:2021-02-23
Applicant: Applied Materials, Inc.
Inventor: Anhthu Ngo , Zuoming Zhu , Balasubramanian Ramachandran , Paul Brillhart , Edric Tong , Anzhong Chang , Kin Pong Lo , Kartik Shah , Schubert S. Chu , Zhepeng Cong , James Francis Mack , Nyi O. Myo , Kevin Joseph Bautista , Xuebin Li , Yi-Chiau Huang , Zhiyuan Ye
IPC: H01L21/687 , C30B25/12 , B05C13/02 , B05C13/00 , H01L21/673 , C23C16/458
CPC classification number: H01L21/68735 , B05C13/00 , B05C13/02 , C30B25/12 , H01L21/67326 , H01L21/6875 , H01L21/68785 , C23C16/4585
Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.
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公开(公告)号:US10269614B2
公开(公告)日:2019-04-23
申请号:US14885016
申请日:2015-10-16
Applicant: Applied Materials, Inc.
Inventor: Schubert S. Chu , Kartik Shah , Anhthu Ngo , Karthik Ramanathan , Nitin Pathak , Nyi O. Myo , Paul Brillhart , Richard O. Collins , Kevin Joseph Bautista , Edric Tong , Zhepeng Cong , Anzhong Chang , Kin Pong Lo , Manish Hemkar
IPC: H01L21/687 , H01L21/67 , C23C16/458
Abstract: Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region.
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公开(公告)号:US10930543B2
公开(公告)日:2021-02-23
申请号:US16109945
申请日:2018-08-23
Applicant: Applied Materials, Inc.
Inventor: Anhthu Ngo , Zuoming Zhu , Balasubramanian Ramachandran , Paul Brillhart , Edric Tong , Anzhong Chang , Kin Pong Lo , Kartik Shah , Schubert S. Chu , Zhepeng Cong , James Francis Mack , Nyi O. Myo , Kevin Joseph Bautista , Xuebin Li , Yi-Chiau Huang , Zhiyuan Ye
IPC: H01L21/687 , C30B25/12 , B05C13/02 , B05C13/00 , H01L21/673 , C23C16/458
Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.
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公开(公告)号:US10062598B2
公开(公告)日:2018-08-28
申请号:US14698793
申请日:2015-04-28
Applicant: Applied Materials, Inc.
Inventor: Anhthu Ngo , Zuoming Zhu , Balasubramanian Ramachandran , Paul Brillhart , Edric Tong , Anzhong Chang , Kin Pong Lo , Kartik Shah , Schubert S. Chu , Zhepeng Cong , James Francis Mack , Nyi O. Myo , Kevin Joseph Bautista , Xuebin Li , Yi-Chiau Huang , Zhiyuan Ye
IPC: H01L21/687 , H01L21/673 , C30B25/12 , B05C13/02 , B05C13/00 , C23C16/458
CPC classification number: H01L21/68735 , B05C13/00 , B05C13/02 , C23C16/4585 , C30B25/12 , H01L21/67326 , H01L21/6875 , H01L21/68785
Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.
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